JP2011192676A5 - - Google Patents

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Publication number
JP2011192676A5
JP2011192676A5 JP2010055062A JP2010055062A JP2011192676A5 JP 2011192676 A5 JP2011192676 A5 JP 2011192676A5 JP 2010055062 A JP2010055062 A JP 2010055062A JP 2010055062 A JP2010055062 A JP 2010055062A JP 2011192676 A5 JP2011192676 A5 JP 2011192676A5
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JP
Japan
Prior art keywords
transfer arm
substrate
processing apparatus
substrate processing
chamber
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Pending
Application number
JP2010055062A
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English (en)
Japanese (ja)
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JP2011192676A (ja
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Publication date
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Priority to JP2010055062A priority Critical patent/JP2011192676A/ja
Priority claimed from JP2010055062A external-priority patent/JP2011192676A/ja
Publication of JP2011192676A publication Critical patent/JP2011192676A/ja
Publication of JP2011192676A5 publication Critical patent/JP2011192676A5/ja
Pending legal-status Critical Current

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JP2010055062A 2010-03-11 2010-03-11 基板処理装置、積層半導体装置製造方法及び積層半導体装置 Pending JP2011192676A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010055062A JP2011192676A (ja) 2010-03-11 2010-03-11 基板処理装置、積層半導体装置製造方法及び積層半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010055062A JP2011192676A (ja) 2010-03-11 2010-03-11 基板処理装置、積層半導体装置製造方法及び積層半導体装置

Publications (2)

Publication Number Publication Date
JP2011192676A JP2011192676A (ja) 2011-09-29
JP2011192676A5 true JP2011192676A5 (enExample) 2013-06-27

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ID=44797321

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JP2010055062A Pending JP2011192676A (ja) 2010-03-11 2010-03-11 基板処理装置、積層半導体装置製造方法及び積層半導体装置

Country Status (1)

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JP (1) JP2011192676A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102829722B (zh) * 2012-08-29 2013-09-18 江苏建威电子科技有限公司 位置传感器
US9442482B2 (en) 2013-04-29 2016-09-13 GlobalFoundries, Inc. System and method for monitoring wafer handling and a wafer handling machine
US10279485B2 (en) * 2014-12-22 2019-05-07 Kawasaki Jukogyo Kabushiki Kaisha Robot system and method of detecting deformation of end effector
CN106935538B (zh) * 2015-12-30 2020-08-04 上海微电子装备（集团）股份有限公司 一种载片传输装置及其传输方法
US10651067B2 (en) * 2017-01-26 2020-05-12 Brooks Automation, Inc. Method and apparatus for substrate transport apparatus position compensation
KR102022804B1 (ko) * 2017-11-02 2019-09-18 조재용 웨이퍼 이송용 로봇 감지장치
JP7630246B2 (ja) * 2020-09-04 2025-02-17 川崎重工業株式会社 ロボット及びハンド部姿勢調整方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275753A (ja) * 1997-03-31 1998-10-13 Hitachi Ltd 半導体基板の製造方法
JP2001127136A (ja) * 1999-10-29 2001-05-11 Applied Materials Inc 基板搬送ロボットの検査装置
US6956489B2 (en) * 2002-07-17 2005-10-18 Mrl Industries Heating element condition monitor
JP2005051171A (ja) * 2003-07-31 2005-02-24 Applied Materials Inc 基板処理装置
JP4899478B2 (ja) * 2003-09-02 2012-03-21 株式会社ニコン 保守管理装置、保守管理方法、保守管理プログラム、及び情報記録媒体
JP4835839B2 (ja) * 2006-04-07 2011-12-14 株式会社安川電機 搬送用ロボットおよび搬送用ロボットの位置補正方法
JP2009123722A (ja) * 2007-11-12 2009-06-04 Dainippon Screen Mfg Co Ltd 基板搬送装置
JP2009233788A (ja) * 2008-03-27 2009-10-15 Daihen Corp 搬送用ロボットの制御方法
JP5417751B2 (ja) * 2008-06-30 2014-02-19 株式会社ニコン 接合装置および接合方法

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