JP2011192676A5 - - Google Patents

Claims (16)

A processing chamber for processing the substrate;
A transfer arm for transferring the substrate to the processing chamber;
A measurement unit for measuring the vertical position of the transfer arm;
A calculation unit that calculates a difference between a vertical position measured by the measurement unit and a target position;
A substrate processing apparatus comprising: The measuring unit measures positions of a plurality of points of the transfer arm;
The substrate processing apparatus according to claim 1, wherein the calculation unit calculates an inclination of the transfer arm based on positions of a plurality of points measured by the measurement unit, and calculates the difference based on the inclination. The substrate processing apparatus according to claim 1 or 2 comprising a warning unit that warns when the difference calculated by the calculating unit exceeds a threshold value. The substrate processing apparatus according to any one of claims 1 to 3, stops the operation of the transport arm when the difference between the position measured by the target position and the measurement unit exceeds a threshold value. The measurement unit is a laser sensor that measures a distance to the transfer arm by irradiating the transfer arm with a laser, and measures the position of the transfer arm based on the distance . The substrate processing apparatus as described in any one of Claims . The measurement unit, the substrate processing apparatus according to any one of claims 1 to 5, wherein the transfer arm is measured vertical position of said transfer arm while holding the object corresponding to the mass of the substrate . The measurement unit, the substrate processing apparatus according to any one of claims 1 to 6, wherein the conveying arm to measure the position in the vertical direction of the transfer arm in a state of not holding the object. A plurality of the processing chambers;
The transfer arm transfers the substrate between the plurality of processing chambers,
At least one of the plurality of processing chambers is a pressure chamber that presses and bonds the plurality of substrates in a reduced pressure environment,
8. The substrate processing apparatus according to claim 1, wherein at least another of the plurality of processing chambers is a load lock chamber in which the substrate to be transferred to the transfer arm is temporarily placed. Connected to the processing chamber, comprising a connecting chamber in which the transfer arm is arranged;
The substrate processing apparatus according to claim 8 , wherein the measurement unit is disposed in at least one of the connection chamber and the load lock chamber. The transfer arm is arranged in two overlapping in the vertical direction,
The two transfer arms operate independently of each other;
When the measuring unit measures the position of one of two of the transfer arms, two of said transfer arm as claimed in any one of claims 1 to 9 in a position shifted from each other for the surface direction of the substrate Substrate processing equipment. A processing chamber for processing the substrate;
A transfer arm for transferring the substrate to the processing chamber;
A detection unit for detecting a vertical inclination of the transfer arm;
A substrate processing apparatus comprising: Wherein the detection unit the position of the plurality of points of the transfer arm is measured and the substrate processing apparatus according to claim 11 for calculating the inclination of the transfer arm based on the position of the plurality of points measured by the detection unit. The substrate processing apparatus according to claim 11, further comprising a warning unit that warns when the inclination detected by the detection unit exceeds a threshold value. The substrate processing apparatus according to claim 11 , wherein the operation of the transfer arm is stopped when an inclination detected by the detection unit exceeds a threshold value. A method for manufacturing a laminated semiconductor device, comprising processing a substrate by the substrate processing apparatus according to claim 1 . A stacked semiconductor device manufactured by the method for manufacturing a stacked semiconductor device according to claim 15 .