JP2016529395A5 - - Google Patents
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- Publication number
- JP2016529395A5 JP2016529395A5 JP2016523733A JP2016523733A JP2016529395A5 JP 2016529395 A5 JP2016529395 A5 JP 2016529395A5 JP 2016523733 A JP2016523733 A JP 2016523733A JP 2016523733 A JP2016523733 A JP 2016523733A JP 2016529395 A5 JP2016529395 A5 JP 2016529395A5
- Authority
- JP
- Japan
- Prior art keywords
- germanium
- tin
- solution
- amount
- containing compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052732 germanium Inorganic materials 0.000 claims 29
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 29
- 239000000243 solution Substances 0.000 claims 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 20
- 239000000758 substrate Substances 0.000 claims 18
- 150000001875 compounds Chemical class 0.000 claims 15
- 238000000034 method Methods 0.000 claims 14
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 9
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims 8
- 239000008139 complexing agent Substances 0.000 claims 4
- 229940119177 germanium dioxide Drugs 0.000 claims 4
- OBBXFSIWZVFYJR-UHFFFAOYSA-L tin(2+);sulfate Chemical compound [Sn+2].[O-]S([O-])(=O)=O OBBXFSIWZVFYJR-UHFFFAOYSA-L 0.000 claims 4
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 3
- 239000003637 basic solution Substances 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 238000009713 electroplating Methods 0.000 claims 3
- 239000004094 surface-active agent Substances 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- 230000003213 activating effect Effects 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 2
- 150000002290 germanium Chemical class 0.000 claims 2
- 230000000116 mitigating effect Effects 0.000 claims 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 238000000975 co-precipitation Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/935,768 | 2013-07-05 | ||
| US13/935,768 US10633754B2 (en) | 2013-07-05 | 2013-07-05 | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium |
| PCT/US2014/035815 WO2015002690A1 (en) | 2013-07-05 | 2014-04-29 | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016529395A JP2016529395A (ja) | 2016-09-23 |
| JP2016529395A5 true JP2016529395A5 (https=) | 2017-06-15 |
| JP6453321B2 JP6453321B2 (ja) | 2019-01-16 |
Family
ID=50819983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016523733A Active JP6453321B2 (ja) | 2013-07-05 | 2014-04-29 | スズをゲルマニウムでドープすることによりスズ表面及びスズめっき表面上でのスズウィスカの成長を軽減するための方法及び装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10633754B2 (https=) |
| EP (1) | EP3017091B1 (https=) |
| JP (1) | JP6453321B2 (https=) |
| CN (2) | CN111876805B (https=) |
| WO (1) | WO2015002690A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020045367A1 (ja) * | 2018-08-28 | 2020-03-05 | 学校法人工学院大学 | 金属膜形成用組成物の製造方法、金属膜の製造方法、金属膜、金属膜積層体及び金属膜形成用組成物の製造装置 |
| CN109158712B (zh) * | 2018-09-27 | 2024-04-23 | 格林美（武汉）城市矿产循环产业园开发有限公司 | 一种双轴调节螺纹环镀修复装置 |
| CN114561633B (zh) * | 2022-02-23 | 2023-11-14 | 吉安宏达秋科技有限公司 | 镀锡液及其制备方法和用于印制线路板的镀锡方法 |
| CN116575086A (zh) * | 2023-06-12 | 2023-08-11 | 吉林师范大学 | 一种离子液体电沉积锡中抑制锡枝晶的方法 |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL6511264A (https=) * | 1965-08-28 | 1967-03-01 | ||
| JPS6015716B2 (ja) * | 1977-10-21 | 1985-04-20 | デイツプソ−ル株式会社 | 錫または錫合金電気めつき用浴の安定化方法 |
| US4749626A (en) | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
| JPS6317890A (ja) * | 1986-07-10 | 1988-01-25 | Shiro Watanabe | ゲルマニウム有機キレ−トアルカリ塩の製法 |
| US4959278A (en) | 1988-06-16 | 1990-09-25 | Nippon Mining Co., Ltd. | Tin whisker-free tin or tin alloy plated article and coating technique thereof |
| US5334240A (en) * | 1990-06-04 | 1994-08-02 | Macdermid, Incorporated | Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base |
| US5393573A (en) | 1991-07-16 | 1995-02-28 | Microelectronics And Computer Technology Corporation | Method of inhibiting tin whisker growth |
| JP2953551B2 (ja) | 1993-05-10 | 1999-09-27 | ノーリツ鋼機株式会社 | フィルム現像装置 |
| US5750017A (en) | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
| WO1999006612A1 (en) * | 1997-07-30 | 1999-02-11 | The Whitaker Corporation | Two layer solderable tin coating |
| CN1144649C (zh) * | 1999-06-11 | 2004-04-07 | 日本板硝子株式会社 | 无铅软钎料 |
| US6361823B1 (en) | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
| JP2003049293A (ja) * | 2001-03-16 | 2003-02-21 | Shipley Co Llc | 錫メッキ |
| US20020192492A1 (en) | 2001-05-11 | 2002-12-19 | Abys Joseph Anthony | Metal article coated with near-surface doped tin or tin alloy |
| EP1260614B1 (en) | 2001-05-24 | 2008-04-23 | Shipley Co. L.L.C. | Tin plating |
| JP4698904B2 (ja) | 2001-09-20 | 2011-06-08 | 株式会社大和化成研究所 | 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品 |
| US6860981B2 (en) | 2002-04-30 | 2005-03-01 | Technic, Inc. | Minimizing whisker growth in tin electrodeposits |
| AU2003252677A1 (en) * | 2002-07-25 | 2004-02-16 | Shinryo Electronics Co., Ltd. | Tin-silver-copper plating solution, plating film containing the same, and method for forming the plating film |
| JP4461295B2 (ja) | 2003-06-03 | 2010-05-12 | 石原薬品株式会社 | 中性光沢スズ−亜鉛合金メッキ浴 |
| US7391116B2 (en) | 2003-10-14 | 2008-06-24 | Gbc Metals, Llc | Fretting and whisker resistant coating system and method |
| JP4367149B2 (ja) * | 2004-01-30 | 2009-11-18 | 日立電線株式会社 | フラットケーブル用導体及びその製造方法並びにフラットケーブル |
| DE112005001074T5 (de) * | 2004-05-11 | 2007-04-05 | Technic, Inc. | Galvanisierlösung für eutektische Gold-Zinn-Legierung |
| JP2006009039A (ja) | 2004-06-21 | 2006-01-12 | Rambo Chemicals (Hong Kong) Ltd | ウィスカー成長が抑制されたスズ系めっき皮膜及びその形成方法 |
| US20060096867A1 (en) * | 2004-11-10 | 2006-05-11 | George Bokisa | Tin alloy electroplating system |
| US20070007144A1 (en) | 2005-07-11 | 2007-01-11 | Schetty Robert A Iii | Tin electrodeposits having properties or characteristics that minimize tin whisker growth |
| US7604871B2 (en) | 2006-06-07 | 2009-10-20 | Honeywell International Inc. | Electrical components including abrasive powder coatings for inhibiting tin whisker growth |
| US20070295530A1 (en) | 2006-06-07 | 2007-12-27 | Honeywell International, Inc. | Coatings and methods for inhibiting tin whisker growth |
| JP4998704B2 (ja) * | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法 |
| JP2009019226A (ja) * | 2007-07-10 | 2009-01-29 | Shinryo Corp | 錫−銀−銅−ニッケル含有めっき液及びこれを用いて形成された錫−銀−銅−ニッケル含有めっき被膜 |
| JP4188408B1 (ja) | 2007-07-31 | 2008-11-26 | 株式会社プライマリー | 電解技術を用いて、金属ゲルマニウムの薄膜を形成する方法 |
| WO2009028147A1 (ja) * | 2007-08-24 | 2009-03-05 | Kabushiki Kaisha Toshiba | 接合用組成物 |
| US7918984B2 (en) * | 2007-09-17 | 2011-04-05 | International Business Machines Corporation | Method of electrodepositing germanium compound materials on a substrate |
| EP2460910B1 (en) * | 2009-07-31 | 2014-11-05 | Shinji Dewaki | Tin-containing alloy plating bath, electroplating method using same, and base having electroplated material deposited thereon |
| EP2738290A1 (en) * | 2011-08-30 | 2014-06-04 | Rohm and Haas Electronic Materials LLC | Adhesion promotion of cyanide-free white bronze |
| JP2014024082A (ja) * | 2012-07-26 | 2014-02-06 | Sumitomo Metal Mining Co Ltd | はんだ合金 |
-
2013
- 2013-07-05 US US13/935,768 patent/US10633754B2/en active Active
-
2014
- 2014-04-29 CN CN202010757612.0A patent/CN111876805B/zh active Active
- 2014-04-29 JP JP2016523733A patent/JP6453321B2/ja active Active
- 2014-04-29 CN CN201480037944.4A patent/CN105392927A/zh active Pending
- 2014-04-29 EP EP14726494.9A patent/EP3017091B1/en active Active
- 2014-04-29 WO PCT/US2014/035815 patent/WO2015002690A1/en not_active Ceased
-
2020
- 2020-03-19 US US16/824,399 patent/US11505874B2/en active Active
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