CN111876805B - 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 - Google Patents
通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 Download PDFInfo
- Publication number
- CN111876805B CN111876805B CN202010757612.0A CN202010757612A CN111876805B CN 111876805 B CN111876805 B CN 111876805B CN 202010757612 A CN202010757612 A CN 202010757612A CN 111876805 B CN111876805 B CN 111876805B
- Authority
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- China
- Prior art keywords
- germanium
- tin
- solution
- amount
- containing compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 170
- 229910052732 germanium Inorganic materials 0.000 title claims abstract description 148
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title claims abstract description 146
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000007747 plating Methods 0.000 claims abstract description 23
- 239000000243 solution Substances 0.000 claims description 97
- 239000000758 substrate Substances 0.000 claims description 74
- 150000001875 compounds Chemical class 0.000 claims description 59
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 45
- 238000000576 coating method Methods 0.000 claims description 38
- 238000009713 electroplating Methods 0.000 claims description 35
- 239000011248 coating agent Substances 0.000 claims description 32
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 239000008139 complexing agent Substances 0.000 claims description 19
- 239000004094 surface-active agent Substances 0.000 claims description 19
- OBBXFSIWZVFYJR-UHFFFAOYSA-L tin(2+);sulfate Chemical compound [Sn+2].[O-]S([O-])(=O)=O OBBXFSIWZVFYJR-UHFFFAOYSA-L 0.000 claims description 17
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 229940119177 germanium dioxide Drugs 0.000 claims description 15
- 239000012670 alkaline solution Substances 0.000 claims description 9
- 239000008367 deionised water Substances 0.000 claims description 8
- 229910021641 deionized water Inorganic materials 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 8
- 230000003746 surface roughness Effects 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 150000002290 germanium Chemical class 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- 230000000116 mitigating effect Effects 0.000 abstract description 4
- 229910052718 tin Inorganic materials 0.000 description 111
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000008151 electrolyte solution Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 5
- 239000013504 Triton X-100 Substances 0.000 description 4
- 229920004890 Triton X-100 Polymers 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000003607 modifier Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- IWTIUUVUEKAHRM-UHFFFAOYSA-N germanium tin Chemical compound [Ge].[Sn] IWTIUUVUEKAHRM-UHFFFAOYSA-N 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910005793 GeO 2 Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- 230000000536 complexating effect Effects 0.000 description 2
- -1 germanium fluoroborate Chemical compound 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- JYCQQPHGFMYQCF-UHFFFAOYSA-N 4-tert-Octylphenol monoethoxylate Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCO)C=C1 JYCQQPHGFMYQCF-UHFFFAOYSA-N 0.000 description 1
- MITGKKFYIJJQGL-UHFFFAOYSA-N 9-(4-chlorobenzoyl)-6-methylsulfonyl-2,3-dihydro-1H-carbazol-4-one Chemical compound ClC1=CC=C(C(=O)N2C3=CC=C(C=C3C=3C(CCCC2=3)=O)S(=O)(=O)C)C=C1 MITGKKFYIJJQGL-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 235000003704 aspartic acid Nutrition 0.000 description 1
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 1
- 230000035899 viability Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010757612.0A CN111876805B (zh) | 2013-07-05 | 2014-04-29 | 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/935,768 | 2013-07-05 | ||
| US13/935,768 US10633754B2 (en) | 2013-07-05 | 2013-07-05 | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium |
| PCT/US2014/035815 WO2015002690A1 (en) | 2013-07-05 | 2014-04-29 | Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium |
| CN201480037944.4A CN105392927A (zh) | 2013-07-05 | 2014-04-29 | 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 |
| CN202010757612.0A CN111876805B (zh) | 2013-07-05 | 2014-04-29 | 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480037944.4A Division CN105392927A (zh) | 2013-07-05 | 2014-04-29 | 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111876805A CN111876805A (zh) | 2020-11-03 |
| CN111876805B true CN111876805B (zh) | 2023-12-01 |
Family
ID=50819983
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010757612.0A Active CN111876805B (zh) | 2013-07-05 | 2014-04-29 | 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 |
| CN201480037944.4A Pending CN105392927A (zh) | 2013-07-05 | 2014-04-29 | 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480037944.4A Pending CN105392927A (zh) | 2013-07-05 | 2014-04-29 | 通过将锡与锗掺杂减轻锡和镀锡表面上的锡须生长的方法和装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10633754B2 (https=) |
| EP (1) | EP3017091B1 (https=) |
| JP (1) | JP6453321B2 (https=) |
| CN (2) | CN111876805B (https=) |
| WO (1) | WO2015002690A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020045367A1 (ja) * | 2018-08-28 | 2020-03-05 | 学校法人工学院大学 | 金属膜形成用組成物の製造方法、金属膜の製造方法、金属膜、金属膜積層体及び金属膜形成用組成物の製造装置 |
| CN109158712B (zh) * | 2018-09-27 | 2024-04-23 | 格林美（武汉）城市矿产循环产业园开发有限公司 | 一种双轴调节螺纹环镀修复装置 |
| CN114561633B (zh) * | 2022-02-23 | 2023-11-14 | 吉安宏达秋科技有限公司 | 镀锡液及其制备方法和用于印制线路板的镀锡方法 |
| CN116575086A (zh) * | 2023-06-12 | 2023-08-11 | 吉林师范大学 | 一种离子液体电沉积锡中抑制锡枝晶的方法 |
Citations (4)
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| US4749626A (en) * | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
| CN1649676A (zh) * | 2002-04-30 | 2005-08-03 | 技术公司 | 在锡的电沉积物中最小化晶须生长 |
| CN1662679A (zh) * | 2002-07-25 | 2005-08-31 | 新菱电子株式会社 | 含有锡－银－铜的电镀液、电镀覆膜及电镀方法 |
| JP2009052130A (ja) * | 2007-07-31 | 2009-03-12 | Primary:Kk | 電解技術を用いて、金属ゲルマニウムの薄膜を形成する方法 |
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| NL6511264A (https=) * | 1965-08-28 | 1967-03-01 | ||
| JPS6015716B2 (ja) * | 1977-10-21 | 1985-04-20 | デイツプソ−ル株式会社 | 錫または錫合金電気めつき用浴の安定化方法 |
| JPS6317890A (ja) * | 1986-07-10 | 1988-01-25 | Shiro Watanabe | ゲルマニウム有機キレ−トアルカリ塩の製法 |
| US4959278A (en) | 1988-06-16 | 1990-09-25 | Nippon Mining Co., Ltd. | Tin whisker-free tin or tin alloy plated article and coating technique thereof |
| US5334240A (en) * | 1990-06-04 | 1994-08-02 | Macdermid, Incorporated | Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base |
| US5393573A (en) | 1991-07-16 | 1995-02-28 | Microelectronics And Computer Technology Corporation | Method of inhibiting tin whisker growth |
| JP2953551B2 (ja) | 1993-05-10 | 1999-09-27 | ノーリツ鋼機株式会社 | フィルム現像装置 |
| US5750017A (en) | 1996-08-21 | 1998-05-12 | Lucent Technologies Inc. | Tin electroplating process |
| WO1999006612A1 (en) * | 1997-07-30 | 1999-02-11 | The Whitaker Corporation | Two layer solderable tin coating |
| CN1144649C (zh) * | 1999-06-11 | 2004-04-07 | 日本板硝子株式会社 | 无铅软钎料 |
| US6361823B1 (en) | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
| JP2003049293A (ja) * | 2001-03-16 | 2003-02-21 | Shipley Co Llc | 錫メッキ |
| US20020192492A1 (en) | 2001-05-11 | 2002-12-19 | Abys Joseph Anthony | Metal article coated with near-surface doped tin or tin alloy |
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| JP4698904B2 (ja) | 2001-09-20 | 2011-06-08 | 株式会社大和化成研究所 | 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品 |
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2013
- 2013-07-05 US US13/935,768 patent/US10633754B2/en active Active
-
2014
- 2014-04-29 CN CN202010757612.0A patent/CN111876805B/zh active Active
- 2014-04-29 JP JP2016523733A patent/JP6453321B2/ja active Active
- 2014-04-29 CN CN201480037944.4A patent/CN105392927A/zh active Pending
- 2014-04-29 EP EP14726494.9A patent/EP3017091B1/en active Active
- 2014-04-29 WO PCT/US2014/035815 patent/WO2015002690A1/en not_active Ceased
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2020
- 2020-03-19 US US16/824,399 patent/US11505874B2/en active Active
Patent Citations (4)
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|---|---|---|---|---|
| US4749626A (en) * | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
| CN1649676A (zh) * | 2002-04-30 | 2005-08-03 | 技术公司 | 在锡的电沉积物中最小化晶须生长 |
| CN1662679A (zh) * | 2002-07-25 | 2005-08-31 | 新菱电子株式会社 | 含有锡－银－铜的电镀液、电镀覆膜及电镀方法 |
| JP2009052130A (ja) * | 2007-07-31 | 2009-03-12 | Primary:Kk | 電解技術を用いて、金属ゲルマニウムの薄膜を形成する方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105392927A (zh) | 2016-03-09 |
| EP3017091A1 (en) | 2016-05-11 |
| US20200216972A1 (en) | 2020-07-09 |
| WO2015002690A1 (en) | 2015-01-08 |
| EP3017091B1 (en) | 2021-01-27 |
| CN111876805A (zh) | 2020-11-03 |
| US20150010774A1 (en) | 2015-01-08 |
| JP2016529395A (ja) | 2016-09-23 |
| US11505874B2 (en) | 2022-11-22 |
| US10633754B2 (en) | 2020-04-28 |
| JP6453321B2 (ja) | 2019-01-16 |
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