JP6453321B2 - スズをゲルマニウムでドープすることによりスズ表面及びスズめっき表面上でのスズウィスカの成長を軽減するための方法及び装置 - Google Patents

スズをゲルマニウムでドープすることによりスズ表面及びスズめっき表面上でのスズウィスカの成長を軽減するための方法及び装置 Download PDF

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Publication number
JP6453321B2
JP6453321B2 JP2016523733A JP2016523733A JP6453321B2 JP 6453321 B2 JP6453321 B2 JP 6453321B2 JP 2016523733 A JP2016523733 A JP 2016523733A JP 2016523733 A JP2016523733 A JP 2016523733A JP 6453321 B2 JP6453321 B2 JP 6453321B2
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Prior art keywords
germanium
tin
solution
amount
substrate surface
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Japanese (ja)
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JP2016529395A5 (https=
JP2016529395A (ja
Inventor
トーマス エー． ウッドロウ，
トーマス エー． ウッドロウ，
ジーン エー． ニールセン，
ジーン エー． ニールセン，
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Boeing Co
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Boeing Co
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2016523733A 2013-07-05 2014-04-29 スズをゲルマニウムでドープすることによりスズ表面及びスズめっき表面上でのスズウィスカの成長を軽減するための方法及び装置 Active JP6453321B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/935,768 2013-07-05
US13/935,768 US10633754B2 (en) 2013-07-05 2013-07-05 Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium
PCT/US2014/035815 WO2015002690A1 (en) 2013-07-05 2014-04-29 Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with germanium

Publications (3)

Publication Number Publication Date
JP2016529395A JP2016529395A (ja) 2016-09-23
JP2016529395A5 JP2016529395A5 (https=) 2017-06-15
JP6453321B2 true JP6453321B2 (ja) 2019-01-16

Family

ID=50819983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016523733A Active JP6453321B2 (ja) 2013-07-05 2014-04-29 スズをゲルマニウムでドープすることによりスズ表面及びスズめっき表面上でのスズウィスカの成長を軽減するための方法及び装置

Country Status (5)

Country Link
US (2) US10633754B2 (https=)
EP (1) EP3017091B1 (https=)
JP (1) JP6453321B2 (https=)
CN (2) CN111876805B (https=)
WO (1) WO2015002690A1 (https=)

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WO2020045367A1 (ja) * 2018-08-28 2020-03-05 学校法人工学院大学 金属膜形成用組成物の製造方法、金属膜の製造方法、金属膜、金属膜積層体及び金属膜形成用組成物の製造装置
CN109158712B (zh) * 2018-09-27 2024-04-23 格林美（武汉）城市矿产循环产业园开发有限公司 一种双轴调节螺纹环镀修复装置
CN114561633B (zh) * 2022-02-23 2023-11-14 吉安宏达秋科技有限公司 镀锡液及其制备方法和用于印制线路板的镀锡方法
CN116575086A (zh) * 2023-06-12 2023-08-11 吉林师范大学 一种离子液体电沉积锡中抑制锡枝晶的方法

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Also Published As

Publication number Publication date
CN105392927A (zh) 2016-03-09
EP3017091A1 (en) 2016-05-11
US20200216972A1 (en) 2020-07-09
WO2015002690A1 (en) 2015-01-08
EP3017091B1 (en) 2021-01-27
CN111876805A (zh) 2020-11-03
US20150010774A1 (en) 2015-01-08
JP2016529395A (ja) 2016-09-23
US11505874B2 (en) 2022-11-22
US10633754B2 (en) 2020-04-28
CN111876805B (zh) 2023-12-01

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