JP2015521390A - 半導体装置及び検出システム - Google Patents

半導体装置及び検出システム Download PDF

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Publication number
JP2015521390A
JP2015521390A JP2014552415A JP2014552415A JP2015521390A JP 2015521390 A JP2015521390 A JP 2015521390A JP 2014552415 A JP2014552415 A JP 2014552415A JP 2014552415 A JP2014552415 A JP 2014552415A JP 2015521390 A JP2015521390 A JP 2015521390A
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substrate
processing unit
semiconductor device
data
unit
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JP2014552415A
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Japanese (ja)
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JP2015521390A5 (https=
Inventor
豪 浅山
豪 浅山
アヌップ シャルマ
アヌップ シャルマ
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Sony Corp
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Sony Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/68—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to defects
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184—Infrared image sensors
    • H10F39/1843—Infrared image sensors of the hybrid type

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
JP2014552415A 2012-06-04 2013-05-31 半導体装置及び検出システム Pending JP2015521390A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261655237P 2012-06-04 2012-06-04
US61/655,237 2012-06-04
PCT/JP2013/003440 WO2013183266A2 (en) 2012-06-04 2013-05-31 Semiconductor device and sensing system

Publications (2)

Publication Number Publication Date
JP2015521390A true JP2015521390A (ja) 2015-07-27
JP2015521390A5 JP2015521390A5 (https=) 2016-06-30

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JP2014552415A Pending JP2015521390A (ja) 2012-06-04 2013-05-31 半導体装置及び検出システム

Country Status (7)

Country Link
US (1) US9607971B2 (https=)
EP (1) EP2856750A2 (https=)
JP (1) JP2015521390A (https=)
KR (1) KR20150027061A (https=)
CN (1) CN104471925B (https=)
TW (1) TWI599015B (https=)
WO (1) WO2013183266A2 (https=)

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JP2017098903A (ja) * 2015-11-27 2017-06-01 キヤノン株式会社 撮像素子及び撮像装置
JP2017183659A (ja) * 2016-03-31 2017-10-05 ソニー株式会社 固体撮像素子、撮像装置、および電子機器
JP2018078609A (ja) * 2017-12-15 2018-05-17 キヤノン株式会社 撮像素子及び撮像装置
JP2018170471A (ja) * 2017-03-30 2018-11-01 キヤノン株式会社 半導体装置および機器
JP2020162173A (ja) * 2016-03-29 2020-10-01 株式会社ニコン 撮像素子および撮像装置
JPWO2021100826A1 (https=) * 2019-11-19 2021-05-27
WO2022250000A1 (ja) * 2021-05-24 2022-12-01 株式会社ニコン 撮像素子および撮像装置

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TWI648986B (zh) 2014-04-15 2019-01-21 Sony Corporation 攝像元件、電子機器
JP6539987B2 (ja) * 2014-11-10 2019-07-10 株式会社ニコン 撮像素子および撮像装置
US10070088B2 (en) * 2015-01-05 2018-09-04 Canon Kabushiki Kaisha Image sensor and image capturing apparatus for simultaneously performing focus detection and image generation
JP6218799B2 (ja) 2015-01-05 2017-10-25 キヤノン株式会社 撮像素子及び撮像装置
US10145942B2 (en) * 2015-03-27 2018-12-04 Intel Corporation Techniques for spatio-temporal compressed time of flight imaging
JP6272387B2 (ja) 2015-05-29 2018-01-31 キヤノン株式会社 撮像素子および撮像装置
KR102464716B1 (ko) 2015-12-16 2022-11-07 삼성전자주식회사 반도체 장치 및 그 제조 방법
JP2017175004A (ja) * 2016-03-24 2017-09-28 ソニー株式会社 チップサイズパッケージ、製造方法、電子機器、および内視鏡
JP2017174994A (ja) * 2016-03-24 2017-09-28 ソニー株式会社 撮像装置、電子機器
KR102275684B1 (ko) 2017-04-18 2021-07-13 삼성전자주식회사 반도체 패키지
JP7278209B2 (ja) * 2017-04-25 2023-05-19 ヌヴォトンテクノロジージャパン株式会社 固体撮像装置および撮像装置
KR102477352B1 (ko) * 2017-09-29 2022-12-15 삼성전자주식회사 반도체 패키지 및 이미지 센서
JP7527755B2 (ja) * 2018-02-09 2024-08-05 キヤノン株式会社 光電変換装置および撮像システム
KR102598041B1 (ko) 2018-02-28 2023-11-07 삼성전자주식회사 이미지 센서 칩
KR102765858B1 (ko) * 2019-02-08 2025-02-12 삼성전자주식회사 이미지 센서 장치
KR102661820B1 (ko) 2019-02-11 2024-05-02 삼성전자주식회사 이미지 센서 및 그것의 구동 방법
US10672101B1 (en) * 2019-03-04 2020-06-02 Omnivision Technologies, Inc. DRAM with simultaneous read and write for multiwafer image sensors
EP4099684B1 (en) * 2020-01-31 2026-02-25 Sony Semiconductor Solutions Corporation Imaging device and imaging method
JPWO2022064317A1 (https=) * 2020-09-25 2022-03-31
TW202308372A (zh) * 2021-06-22 2023-02-16 美商元平台技術有限公司 多層堆疊的相機影像感測電路
TW202320535A (zh) * 2021-10-08 2023-05-16 日商索尼半導體解決方案公司 攝像裝置

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JP2017034499A (ja) * 2015-08-03 2017-02-09 キヤノン株式会社 固体撮像装置
JP2017098903A (ja) * 2015-11-27 2017-06-01 キヤノン株式会社 撮像素子及び撮像装置
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JP2020162173A (ja) * 2016-03-29 2020-10-01 株式会社ニコン 撮像素子および撮像装置
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JP2017183659A (ja) * 2016-03-31 2017-10-05 ソニー株式会社 固体撮像素子、撮像装置、および電子機器
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JP2018170471A (ja) * 2017-03-30 2018-11-01 キヤノン株式会社 半導体装置および機器
JP2018078609A (ja) * 2017-12-15 2018-05-17 キヤノン株式会社 撮像素子及び撮像装置
JPWO2021100826A1 (https=) * 2019-11-19 2021-05-27
JP7656541B2 (ja) 2019-11-19 2025-04-03 ソニーセミコンダクタソリューションズ株式会社 受光素子、測距モジュール
WO2022250000A1 (ja) * 2021-05-24 2022-12-01 株式会社ニコン 撮像素子および撮像装置
JPWO2022250000A1 (https=) * 2021-05-24 2022-12-01

Also Published As

Publication number Publication date
TW201351607A (zh) 2013-12-16
US20130320197A1 (en) 2013-12-05
EP2856750A2 (en) 2015-04-08
TWI599015B (zh) 2017-09-11
US9607971B2 (en) 2017-03-28
CN104471925A (zh) 2015-03-25
WO2013183266A2 (en) 2013-12-12
CN104471925B (zh) 2017-12-15
KR20150027061A (ko) 2015-03-11
WO2013183266A3 (en) 2014-02-27

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