JP2015153874A - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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Abstract
Description
まず、半導体チップと、前記半導体チップを支持するダイパッドと、前記半導体チップと前記ダイパッドを接着する接着剤と、前記ダイパッドの辺に向かって延在する複数の信号用リードと、前記半導体チップと前記信号用リードを接続するボンディングワイヤと、モールド樹脂で封止する封止体とを備えた半導体装置において、前記半導体チップの側面が第一の凹凸側面と前記第一側面の上方に形成された第二凹凸側面とからなり、前記第二凹凸側面における第二凹凸は前記第一凹凸側面における第一凹凸よりも大きいことを特徴とする半導体装置とした。
また、前記第二凹凸側面が前記半導体チップの厚さの2/3以上であることを特徴とする半導体装置とした。
また、前記第二の凹凸側面を形成する工程がアブレーションレーザーを用いる工程であることを特徴とする半導体装置の製造方法を用いた。
また、前記第一の凹凸側面を形成する工程が前記半導体チップ内にパルスレーザーにて離間した改質層を形成する工程であることを特徴とする半導体装置の製造方法を用いた。
また、前記ブレードダイシング工程の後に、等方性プラズマシリコンエッチングを行うことを特徴とする半導体装置の製造方法を用いた。
また、前記第二の凹凸側面を形成する工程がプラズマダイシング工程であって、ボッシュプロセスのシリコンエッチングであることを特徴とする半導体装置の製造方法を用いた。
図1は、本発明の半導体装置の部分断面図である。図1(a)に示すように、半導体チップ2は、上表面に粗面15を施したダイパッド3上に銀ペーストなどの接着剤18を介して搭載されている。半導体チップ2の上表面はポリイミド膜などからなる保護膜17によって覆われ、ダイパッド3、半導体チップ2は封止樹脂8によって封止されている。半導体チップ2の側面を拡大したのが図1(b)である。半導体チップ2の側面下部には小さな凹凸からなる第一の凹凸側面24が形成され(第一の凹凸は図示せず)、側面上部には側面下部における凹凸よりも大きな凹凸を配置した第二の凹凸側面25が形成されている。このような構成とすることで、半導体素子が形成されている半導体チップの側面上部と封止樹脂8との密着力が向上することになり、水分の浸入が抑えられ、耐湿性の良好な半導体装置とすることが可能となる。
まず、図に示した工程S1〜S6について説明する。ダイシング工程S1は半導体ウエハを半導体チップに分割する工程である。ダイボンド工程S2は半導体チップをリードフレームのダイパッド領域に銀ペースト等を用いて接着する工程である。次のダイボンドキュア工程S3は接着されたダイパッドと半導体チップを加熱して接合部を硬化させる工程である。次のワイヤボンド工程S4は熱圧着に超音波振動を併用したボンディング法などによって、ボンディングワイヤを半導体チップ表面の電極部分とリードインナー部を接続する工程である。そして、組立検査工程S5にて、ダイパッドと半導体チップの接合状態、半導体チップとボンディングワイヤとの接合状態について検査を行い、樹脂封止工程S6に移行する。
最初に図3(a)は、レーザーダイシング工程を用いた製造方法である。図5に示すように、ここではダイシングテープ14に貼り付けられた半導体基板に形成された半導体チップ2と隣接する半導体チップ2間に設けられたスクライブライン12に、集光レンズ13を介してパルスレーザー9を照射する。パルスレーザーは深さ方向に多段数照射され、レーザー照射された領域には改質層10が形成される。半導体チップ2の厚さ方向の上部2/3には、深さ方向に形成される改質層10が平面的に連続的に繋がるようにパルスレーザーが高出力で密に照射される。これが図3(a)のレーザーダイシング工程1に相当し、図1(b)の第二の凹凸側面25を形成する工程である。レーザーダイシング工程2は半導体チップの厚さ方向の下部1/3に第一の凹凸側面24を形成する工程であって、低出力のパルスレーザーによって深さ方向に形成される改質層11は離れて形成され、個々の改質層の大きさもレーザーダイシング工程1で形成されるものよりも小さい。レーザーダイシング工程1および2を経た後、劈開して、第一の凹凸側面24と第二の凹凸側面25を有する半導体チップ2を得ることになる。
2 半導体チップ
3 ダイパッド
4 リード
5 吊りリード
5a 吊りリード基部
5b 吊りリードアウター部
6 リード
6a リードインナー部
6b リードアウター部
7 ボンディングワイヤ
8 封止樹脂
9 パルスレーザー
10 改質層
11 改質層
12 スクライブライン
13 集光レンズ
14 ダイシングテープ
15 粗面
16 ダイシングブレード
17 保護膜
18 接着剤
19 剥離部
24 第一の凹凸側面
25 第二の凹凸側面
S1 ダイシング工程
S2 ダイボンド工程
S3 ダイボンドキュア工程
S4 ワイヤボンド工程
S5 組立検査工程
S6 樹脂封止工程
S7 改質工程
Claims (9)
- 半導体チップと、前記半導体チップを支持するダイパッドと、前記半導体チップと前記ダイパッドを接着する接着剤と、前記ダイパッドの辺に向かって延在する複数の信号用リードと、前記半導体チップと前記信号用リードを接続するボンディングワイヤと、モールド樹脂で封止する封止体とを備えた半導体装置において、
前記半導体チップの側面が第一の凹凸側面と前記第一側面の上方に形成された第二凹凸側面とからなり、
前記第二凹凸側面における第二凹凸は前記第一凹凸側面における第一凹凸よりも大きいことを特徴とする半導体装置。 - 前記第二凹凸側面が前記半導体チップの厚さの2/3以上であることを特徴とする請求項1記載の半導体装置。
- 半導体チップと、前記半導体チップを支持するダイパッドと、前記半導体チップと前記ダイパッドを接着する接着剤と、前記ダイパッドの辺に向かって延在する複数の信号用リードと、前記半導体チップと前記信号用リードを接続するボンディングワイヤと、モールド樹脂で封止する封止体とを備えた半導体装置の製造方法において、
前記半導体チップの側面に第一の凹凸側面を形成する工程と、
前記半導体チップの側面に前記第一の凹凸面とは異なる第二の凹凸側面を形成する工程と、
を備えた半導体装置の製造方法。 - 前記第二の凹凸側面を形成する工程が前記半導体チップ内にパルスレーザーにて連続した改質層を形成する工程であることを特徴とする請求項3記載の半導体装置の製造方法。
- 前記第二の凹凸側面を形成する工程がアブレーションレーザーを用いる工程であることを特徴とする請求項3記載の半導体装置の製造方法。
- 前記第一の凹凸側面を形成する工程が前記半導体チップ内にパルスレーザーにて離間した改質層を形成する工程であることを特徴とする請求項3乃至請求項5のいずれか1項記載の半導体装置の製造方法。
- 前記第二の凹凸側面を形成する工程がブレードダイシング工程であって、ダイシングブレードのメッシュサイズが#1000以下であることを特徴とする請求項3記載の半導体装置の製造方法。
- 前記ブレードダイシング工程の後に、等方性プラズマシリコンエッチングを行うことを特徴とする請求項7記載の半導体装置の製造方法。
- 前記第二の凹凸側面を形成する工程がプラズマダイシング工程であって、ボッシュプロセスのシリコンエッチングであることを特徴とする請求項3記載の半導体装置の製造方法。
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TWI643267B (zh) | 2018-12-01 |
US10236269B2 (en) | 2019-03-19 |
CN104851851B (zh) | 2018-12-11 |
US20150228504A1 (en) | 2015-08-13 |
KR20150095586A (ko) | 2015-08-21 |
KR102287698B1 (ko) | 2021-08-09 |
JP6250429B2 (ja) | 2017-12-20 |
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