JP2018078192A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP2018078192A JP2018078192A JP2016218932A JP2016218932A JP2018078192A JP 2018078192 A JP2018078192 A JP 2018078192A JP 2016218932 A JP2016218932 A JP 2016218932A JP 2016218932 A JP2016218932 A JP 2016218932A JP 2018078192 A JP2018078192 A JP 2018078192A
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Abstract
Description
2,22 半導体基板
2A 表面
3 半導体素子
11,23 基部
12,24 鍔部
13,25 基部側凹凸端面部(凹凸端面部)
27 被膜
Claims (2)
- 表面側に半導体素子が形成された半導体基板を備えた半導体装置において、
前記半導体基板は、
前記半導体素子が形成された基部と、
前記半導体基板の裏面側に位置して前記基部の周縁から外側に突出し、前記基部の周囲を取囲む鍔部と、
前記基部と前記鍔部との段差部分に位置して前記基部の周縁端面に形成され、周方向に沿って凹凸形状となった凹凸端面部と、を備えたことを特徴とする半導体装置。 - 前記凹凸端面部は、絶縁性および耐湿性を有する被膜によって覆われてなる請求項1に記載の半導体装置。
Priority Applications (1)
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JP2016218932A JP2018078192A (ja) | 2016-11-09 | 2016-11-09 | 半導体装置 |
Applications Claiming Priority (1)
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JP2016218932A JP2018078192A (ja) | 2016-11-09 | 2016-11-09 | 半導体装置 |
Publications (1)
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JP2018078192A true JP2018078192A (ja) | 2018-05-17 |
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JP2016218932A Pending JP2018078192A (ja) | 2016-11-09 | 2016-11-09 | 半導体装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021039802A1 (ja) * | 2019-08-27 | 2021-03-04 | ローム株式会社 | 半導体素子、および半導体素子の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6265438A (ja) * | 1985-09-18 | 1987-03-24 | Mitsubishi Electric Corp | 半導体装置 |
JP2003031526A (ja) * | 2001-07-16 | 2003-01-31 | Mitsumi Electric Co Ltd | モジュールの製造方法及びモジュール |
JP2015153874A (ja) * | 2014-02-13 | 2015-08-24 | セイコーインスツル株式会社 | 半導体装置およびその製造方法 |
-
2016
- 2016-11-09 JP JP2016218932A patent/JP2018078192A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6265438A (ja) * | 1985-09-18 | 1987-03-24 | Mitsubishi Electric Corp | 半導体装置 |
JP2003031526A (ja) * | 2001-07-16 | 2003-01-31 | Mitsumi Electric Co Ltd | モジュールの製造方法及びモジュール |
JP2015153874A (ja) * | 2014-02-13 | 2015-08-24 | セイコーインスツル株式会社 | 半導体装置およびその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021039802A1 (ja) * | 2019-08-27 | 2021-03-04 | ローム株式会社 | 半導体素子、および半導体素子の製造方法 |
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