JP2015088521A5 - - Google Patents

Download PDF

Info

Publication number
JP2015088521A5
JP2015088521A5 JP2013223376A JP2013223376A JP2015088521A5 JP 2015088521 A5 JP2015088521 A5 JP 2015088521A5 JP 2013223376 A JP2013223376 A JP 2013223376A JP 2013223376 A JP2013223376 A JP 2013223376A JP 2015088521 A5 JP2015088521 A5 JP 2015088521A5
Authority
JP
Japan
Prior art keywords
electrode
piezoelectric film
piezoelectric
film
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013223376A
Other languages
English (en)
Japanese (ja)
Other versions
JP6154729B2 (ja
JP2015088521A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013223376A priority Critical patent/JP6154729B2/ja
Priority claimed from JP2013223376A external-priority patent/JP6154729B2/ja
Priority to PCT/JP2014/077958 priority patent/WO2015064423A1/ja
Publication of JP2015088521A publication Critical patent/JP2015088521A/ja
Priority to US15/137,142 priority patent/US20160240768A1/en
Publication of JP2015088521A5 publication Critical patent/JP2015088521A5/ja
Application granted granted Critical
Publication of JP6154729B2 publication Critical patent/JP6154729B2/ja
Priority to US16/352,770 priority patent/US11165011B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013223376A 2013-10-28 2013-10-28 圧電体素子の製造方法 Active JP6154729B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013223376A JP6154729B2 (ja) 2013-10-28 2013-10-28 圧電体素子の製造方法
PCT/JP2014/077958 WO2015064423A1 (ja) 2013-10-28 2014-10-21 圧電体素子及び圧電体素子の製造方法
US15/137,142 US20160240768A1 (en) 2013-10-28 2016-04-25 Piezoelectric element and method for manufacturing piezoelectric element
US16/352,770 US11165011B2 (en) 2013-10-28 2019-03-13 Piezoelectric element and method for manufacturing piezoelectric element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013223376A JP6154729B2 (ja) 2013-10-28 2013-10-28 圧電体素子の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017091823A Division JP6346693B2 (ja) 2017-05-02 2017-05-02 圧電体素子の製造方法

Publications (3)

Publication Number Publication Date
JP2015088521A JP2015088521A (ja) 2015-05-07
JP2015088521A5 true JP2015088521A5 (enExample) 2016-04-28
JP6154729B2 JP6154729B2 (ja) 2017-06-28

Family

ID=53004031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013223376A Active JP6154729B2 (ja) 2013-10-28 2013-10-28 圧電体素子の製造方法

Country Status (3)

Country Link
US (2) US20160240768A1 (enExample)
JP (1) JP6154729B2 (enExample)
WO (1) WO2015064423A1 (enExample)

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8182501B2 (en) 2004-02-27 2012-05-22 Ethicon Endo-Surgery, Inc. Ultrasonic surgical shears and method for sealing a blood vessel using same
PL1802245T3 (pl) 2004-10-08 2017-01-31 Ethicon Endosurgery Llc Ultradźwiękowy przyrząd chirurgiczny
US20070191713A1 (en) 2005-10-14 2007-08-16 Eichmann Stephen E Ultrasonic device for cutting and coagulating
US7621930B2 (en) 2006-01-20 2009-11-24 Ethicon Endo-Surgery, Inc. Ultrasound medical instrument having a medical ultrasonic blade
US8911460B2 (en) 2007-03-22 2014-12-16 Ethicon Endo-Surgery, Inc. Ultrasonic surgical instruments
US8057498B2 (en) 2007-11-30 2011-11-15 Ethicon Endo-Surgery, Inc. Ultrasonic surgical instrument blades
US8523889B2 (en) 2007-07-27 2013-09-03 Ethicon Endo-Surgery, Inc. Ultrasonic end effectors with increased active length
US8808319B2 (en) 2007-07-27 2014-08-19 Ethicon Endo-Surgery, Inc. Surgical instruments
US8430898B2 (en) 2007-07-31 2013-04-30 Ethicon Endo-Surgery, Inc. Ultrasonic surgical instruments
US9044261B2 (en) 2007-07-31 2015-06-02 Ethicon Endo-Surgery, Inc. Temperature controlled ultrasonic surgical instruments
US8512365B2 (en) 2007-07-31 2013-08-20 Ethicon Endo-Surgery, Inc. Surgical instruments
EP2217157A2 (en) 2007-10-05 2010-08-18 Ethicon Endo-Surgery, Inc. Ergonomic surgical instruments
US10010339B2 (en) 2007-11-30 2018-07-03 Ethicon Llc Ultrasonic surgical blades
US8319400B2 (en) 2009-06-24 2012-11-27 Ethicon Endo-Surgery, Inc. Ultrasonic surgical instruments
US8951272B2 (en) 2010-02-11 2015-02-10 Ethicon Endo-Surgery, Inc. Seal arrangements for ultrasonically powered surgical instruments
US8486096B2 (en) 2010-02-11 2013-07-16 Ethicon Endo-Surgery, Inc. Dual purpose surgical instrument for cutting and coagulating tissue
US9820768B2 (en) 2012-06-29 2017-11-21 Ethicon Llc Ultrasonic surgical instruments with control mechanisms
US10226273B2 (en) 2013-03-14 2019-03-12 Ethicon Llc Mechanical fasteners for use with surgical energy devices
GB2521229A (en) 2013-12-16 2015-06-17 Ethicon Endo Surgery Inc Medical device
EP3140869B1 (en) * 2014-05-09 2019-06-05 Chirp Microsystems, Inc. Micromachined ultrasound transducer using multiple piezoelectric materials
US20160352307A1 (en) * 2015-05-27 2016-12-01 Murata Manufacturing Co., Ltd. Mems resonator with high quality factor
CN106291562A (zh) * 2015-05-30 2017-01-04 鸿富锦精密工业（深圳）有限公司 超声波感测器及其制造方法、超声波感测器阵列
JP6460406B2 (ja) * 2015-06-09 2019-01-30 第一精工株式会社 可動反射素子及び二次元走査装置
US11020140B2 (en) 2015-06-17 2021-06-01 Cilag Gmbh International Ultrasonic surgical blade for use with ultrasonic surgical instruments
JP6464049B2 (ja) * 2015-06-30 2019-02-06 富士フイルム株式会社 積層構造体、圧電素子および圧電素子の製造方法
US10357303B2 (en) 2015-06-30 2019-07-23 Ethicon Llc Translatable outer tube for sealing using shielded lap chole dissector
JP6426061B2 (ja) 2015-07-02 2018-11-21 富士フイルム株式会社 積層薄膜構造体の製造方法、積層薄膜構造体及びそれを備えた圧電素子
US9845235B2 (en) * 2015-09-03 2017-12-19 General Electric Company Refractory seed metal for electroplated MEMS structures
JP2017092097A (ja) * 2015-11-04 2017-05-25 セイコーエプソン株式会社 圧電素子、超音波プローブ、超音波測定装置及び圧電素子の製造方法
JP6610883B2 (ja) 2015-12-17 2019-11-27 セイコーエプソン株式会社 超音波センサー用の圧電デバイス
CN107342357B (zh) * 2016-04-28 2022-08-16 新科实业有限公司 薄膜压电元件及其制造方法
US10445547B2 (en) 2016-05-04 2019-10-15 Invensense, Inc. Device mountable packaging of ultrasonic transducers
US10516943B2 (en) 2016-05-04 2019-12-24 Infineon Technologies Ag Microelectromechanical device, an array of microelectromechanical devices, a method of manufacturing a microelectromechanical device, and a method of operating a microelectromechanical device
US10706835B2 (en) 2016-05-10 2020-07-07 Invensense, Inc. Transmit beamforming of a two-dimensional array of ultrasonic transducers
US10245064B2 (en) 2016-07-12 2019-04-02 Ethicon Llc Ultrasonic surgical instrument with piezoelectric central lumen transducer
USD847990S1 (en) 2016-08-16 2019-05-07 Ethicon Llc Surgical instrument
US10952759B2 (en) 2016-08-25 2021-03-23 Ethicon Llc Tissue loading of a surgical instrument
US10736649B2 (en) * 2016-08-25 2020-08-11 Ethicon Llc Electrical and thermal connections for ultrasonic transducer
JP6788186B2 (ja) 2016-09-29 2020-11-25 ミツミ電機株式会社 光走査装置及び光走査装置の製造方法
JP2018129402A (ja) * 2017-02-08 2018-08-16 セイコーエプソン株式会社 圧電素子及びその製造方法
WO2018207578A1 (ja) * 2017-05-09 2018-11-15 富士フイルム株式会社 圧電マイクロフォンチップおよび圧電マイクロフォン
JP6342040B1 (ja) * 2017-06-09 2018-06-13 株式会社サイオクス 圧電膜を有する積層基板、圧電膜を有する素子および圧電膜を有する積層基板の製造方法
US10910551B2 (en) * 2017-11-06 2021-02-02 Samsung Electronics Co., Ltd. Piezoelectric material, piezoelectric device including the piezoelectric material, and method of manufacturing the piezoelectric material
WO2019102952A1 (ja) * 2017-11-22 2019-05-31 株式会社村田製作所 圧電デバイス及び圧電デバイスの製造方法
WO2019102951A1 (ja) 2017-11-22 2019-05-31 株式会社村田製作所 圧電デバイス及び圧電デバイスの製造方法
CN107979353B (zh) * 2018-01-08 2025-08-22 左蓝微(江苏)电子技术有限公司 Rf mems滤波器及其制备方法
US10755067B2 (en) 2018-03-22 2020-08-25 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
JP7421710B2 (ja) * 2019-04-03 2024-01-25 Ｉ－ＰＥＸ Ｐｉｅｚｏ Ｓｏｌｕｔｉｏｎｓ株式会社 膜構造体
EP3972747A1 (en) * 2019-05-20 2022-03-30 InvenSense, Inc. A dual layer ultrasonic transducer
US11176345B2 (en) 2019-07-17 2021-11-16 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
CN112864304A (zh) * 2019-11-12 2021-05-28 应用材料公司 具有pmnpt层的压电装置的制造
US11995909B2 (en) 2020-07-17 2024-05-28 Tdk Corporation Multipath reflection correction
US12174295B2 (en) 2020-08-07 2024-12-24 Tdk Corporation Acoustic multipath correction
JP7476039B2 (ja) 2020-09-02 2024-04-30 キオクシア株式会社 半導体装置の検査装置、及び、半導体装置の検査方法
JP7696305B2 (ja) 2021-05-12 2025-06-20 浜松ホトニクス株式会社 アクチュエータ装置
JP7672925B2 (ja) * 2021-05-12 2025-05-08 浜松ホトニクス株式会社 アクチュエータ装置
CN113709642A (zh) * 2021-06-21 2021-11-26 天津大学 压电mems执行器及其形成方法和运行方法
US12197681B2 (en) 2021-08-25 2025-01-14 Tdk Corporation Anchor configurations for an array of ultrasonic transducers
JP2024052271A (ja) * 2022-09-30 2024-04-11 富士フイルム株式会社 圧電素子及びアクチュエータ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005203750A (ja) 2003-12-16 2005-07-28 Matsushita Electric Ind Co Ltd 圧電体薄膜装置および圧電体薄膜装置の駆動方法
CN100411214C (zh) 2003-12-16 2008-08-13 松下电器产业株式会社 压电体薄膜装置和压电体薄膜装置的驱动方法
JP2006048302A (ja) 2004-08-03 2006-02-16 Sony Corp 圧電複合装置、その製造方法、その取扱方法、その制御方法、入出力装置及び電子機器
US8114307B2 (en) * 2006-09-15 2012-02-14 Canon Kabushiki Kaisha Piezoelectric body and liquid discharge head
JP5385117B2 (ja) 2009-12-17 2014-01-08 富士フイルム株式会社 圧電ｍｅｍｓスイッチの製造方法
JP5506035B2 (ja) * 2010-02-23 2014-05-28 富士フイルム株式会社 アクチュエータの製造方法
JP5416166B2 (ja) * 2011-05-10 2014-02-12 株式会社アドバンテスト スイッチ装置および試験装置
JP5394435B2 (ja) 2011-05-13 2014-01-22 株式会社アドバンテスト 製造方法、スイッチ装置、伝送路切り替え装置、および試験装置
JP5394451B2 (ja) 2011-07-26 2014-01-22 株式会社アドバンテスト アクチュエータの製造方法、スイッチ装置、伝送路切替装置、および試験装置
JP5836754B2 (ja) * 2011-10-04 2015-12-24 富士フイルム株式会社 圧電体素子及びその製造方法
JP5539430B2 (ja) 2012-03-22 2014-07-02 富士フイルム株式会社 電子機器の製造方法
JP6341446B2 (ja) * 2014-03-13 2018-06-13 株式会社リコー 電気機械変換素子の製造方法、電気機械変換素子、液滴吐出ヘッド、液滴吐出装置及び画像形成装置

Similar Documents

Publication Publication Date Title
JP2015088521A5 (enExample)
CN107591090B (zh) 可卷曲显示装置及可卷曲装置
JP2013168419A5 (enExample)
JP2009111373A5 (enExample)
JP2019504490A5 (enExample)
JP2009111375A5 (enExample)
JP2018014643A5 (enExample)
JP2016535930A5 (enExample)
JP2016029161A5 (enExample)
JP2019505468A5 (enExample)
JP2015019310A5 (enExample)
JP2008270771A5 (enExample)
JP2013171981A5 (enExample)
WO2018070801A3 (ko) 다층형 캐리어 필름 및 이를 이용한 소자 전사 방법과 이 방법을 이용하여 전자제품을 제조하는 전자제품 제조방법
JP2016076798A5 (enExample)
JP2017504046A5 (enExample)
JP2013070112A5 (enExample)
JP2011223489A5 (enExample)
JP2017098781A5 (ja) 圧電素子及び圧電素子の製造方法
JP6425941B2 (ja) 電子デバイス及び電子デバイスの製造方法
CN110127592B (zh) Mems感知器结构及其制造方法
JP2015129830A5 (enExample)
JP2007001004A5 (enExample)
TW200640283A (en) Method of manufacturing an organic electronic device
JP2009101351A5 (enExample)