JP2013542295A - オーバーモールド成形ポリアミド複合構造及びその製造方法 - Google Patents
オーバーモールド成形ポリアミド複合構造及びその製造方法 Download PDFInfo
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- JP2013542295A JP2013542295A JP2013536792A JP2013536792A JP2013542295A JP 2013542295 A JP2013542295 A JP 2013542295A JP 2013536792 A JP2013536792 A JP 2013536792A JP 2013536792 A JP2013536792 A JP 2013536792A JP 2013542295 A JP2013542295 A JP 2013542295A
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- resin composition
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- polyamide
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- composite structure
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- Textile Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Moulding By Coating Moulds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
Abstract
Description
下記の材料は、実施例及び比較例に使用した組成物に含まれる。
ポリアミド2(PA2):テレフタル酸と、イソフタル酸と、1,6−ヘキサメチレンジアミンでできているポリアミド。この半芳香族ポリアミドは、ガラス転移温度が約120℃から約130℃である。PA2はPA6I6Tと呼ばれ、E.I.du Pont de Nemours and Companyから市販されている。
オーバーモールド成形用樹脂:テレフタル酸と、1,6−ヘキサメチレンジアミン(HMD)及び2−メチルペンタメチレンジアミン(MPMD)(HMD:MPMD=50:50)でできている半芳香族ポリアミド(PA1)、並びに全樹脂組成物の重量で50%のガラス繊維を含む組成物。オーバーモールド成形用樹脂は、E.I.du Pont de Nemours and Companyから市販されている。
実施例で使用した樹脂組成物(表1及び2で「E」と略記)及び比較例(表1及び2で「C」と略記)を、二軸押出機中で構成要素を溶融又は溶融ブレンドすることにより製造した。押出機から出ると同時に、表1及び2に列記した組成物を、押出機からアダプター及び約325℃のフィルムダイを通して出し、120℃に油加熱されたキャスティングドラムにキャストし、次いで空気中で延伸し、室温で芯に巻くことにより、フィルムにキャストした。マトリックス及び表面樹脂組成物は、約102ミクロンの厚さのフィルムに製造した。フィルムの厚さは、延伸速度により制御した。
複合構造E1、C1、及びC2を、表1及び2に示される組成物のフィルムの複数の層と連続ガラス繊維織布(直径17ミクロン、0.4%シラン系サイズ剤により糊付け処理され、公称ロービングテックス1200g/kmのE−ガラス繊維から製造、2/2綾織り(バランス織り)に織られ、目付が600g/m2)とをラミネートすることにより製造した。複合構造E1及びC1のラミネーションシーケンスは下記のとおりであった:表面樹脂組成物のフィルムの4層、連続ガラス繊維織布の1層、マトリックス樹脂組成物のフィルムの6層、連続ガラス繊維織布の1層、表面樹脂組成物のフィルムの4層。複合構造C2のラミネーションシーケンスは下記のとおりであった:表面樹脂組成物のフィルムの2層、マトリックス樹脂組成物のフィルムの2層、連続ガラス繊維織布の1層、マトリックス樹脂組成物のフィルムの6層、連続ガラス繊維織布の1層、マトリックス樹脂組成物のフィルムの2層、表面樹脂組成物のフィルムの2層。
表1に列記したオーバーモールド成形複合構造を、上述のとおり得られた複合構造E1及びC1の上に、約1.7mmのオーバーモールド成形用樹脂組成物をオーバー射出成形することにより製造した。オーバーモールド成形された複合構造の全体の厚さは約3.2mmであった。複合構造を、3×5インチ(約76mm×127mm)の試験片に切り出し、150℃の加熱チャンバー(Hotpack oven Model 273601)に約10分間置いた。次いで、複合構造を手作業で型穴に移し、成形機(Nissei Corp.製、Model FN4000、1752 KN、148cc(6オンス))によりオーバーモールド成形用樹脂によりオーバー射出成形した。型を150℃に電気加熱したが、型はバーゲージのついた1/8インチ×3インチ×5インチのプラーク・キャビティ(plaque cavity)を備えていた。射出機を320℃に設定した。
上述のとおり得られたオーバーモールド成形複合構造を、ダイヤモンドエッジブレードを備えたMK−377 Tile Saw及び潤滑剤として水を使用して、1/2インチ(約12.7mm)×3インチ(約76mm)の長さの試験片(バー)に切り出した。曲げ強さを、三点曲げ試験により試験片に対して試験した。装置及び幾何的形状は、ISO法178に準拠し、負荷用エッジをスパンの中心にして2.0インチの支点幅で試験片を曲げる。オーバーモールド成形された試験片の複合構造成分は、引張側(外側スパン、下向き)で2つの両端支点(2インチ離れている)に載っており、1つの支点(負荷)により、試験片のオーバーモールド成形用樹脂成分面にある圧縮側(内部スパン、上向き)でへこんだ。試験は、1KNの負荷により、2mm/分で、破断まで行った。結果を表1に示す。
上述のとおり得られた、表2の複合構造E1、C1、及びC2を、ダイヤモンドエッジブレードを備えたMK−377 Tile Saw及び潤滑剤として水を使用して、1/2インチ(約12.7mm)×3インチ(約76mm)の長さの試験片(バー)に切り出した。曲げ強さを、三点曲げ試験により試験片に対して試験した。装置及び幾何的形状は、ISO法178に準拠し、負荷用エッジをスパンの中心にして2.0インチの支点幅で試験片を曲げる。複合構造は、2つの両端支点(2インチ離れている)に載っており、1つの支点(負荷)によりへこんだ。試験は、1KNの負荷により、2mm/分で、破断まで行った。結果を表2に示す。
Claims (16)
- オーバーモールド成形複合構造であって、
i)表面を有する第一成分であって、その表面の少なくとも一部分が表面樹脂組成物でできており、不織構造、織物、繊維詰め物、及びこれらの組み合わせから選択される繊維状材料を含み、前記繊維状材料がマトリックス樹脂組成物により含浸されている第一成分と、
ii)オーバーモールド成形用樹脂組成物を含む第二成分とを含み、
前記第二成分が、前記第一成分の表面の少なくとも一部分の上で、前記第一成分に接着しており、
前記マトリックス樹脂組成物と前記表面樹脂組成物とが同一又は異なっており、半芳香族ポリアミドのブレンドを含むポリアミド組成物から選択される、オーバーモールド成形複合構造。 - 前記マトリックス樹脂組成物及び前記表面樹脂組成物が、半芳香族半結晶性ポリアミド(A)と半芳香族非晶性ポリアミド(B)とのブレンドを含むポリアミド組成物から選択される、請求項1に記載のオーバーモールド成形複合構造。
- 前記繊維状材料が、ガラス繊維、炭素繊維、アラミド繊維、天然繊維、又はこれらの混合物でできている、請求項1又は2に記載のオーバーモールド成形複合構造。
- 前記繊維状材料がガラス繊維でできている、請求項1〜3のいずれか一項に記載のオーバーモールド成形複合構造。
- 前記繊維状材料が、前記第一成分の30体積パーセントから60体積パーセントである、請求項1〜4のいずれか一項に記載のオーバーモールド成形複合構造。
- 前記ポリアミド組成物のポリアミド(A)から選択される前記ポリアミドとポリアミド(B)から選択される前記ポリアミドとの重量比(A:B)が、約99:1から約5:95である、請求項1〜5のいずれか一項に記載のオーバーモールド成形複合構造。
- 熱安定剤、酸化安定剤、強化剤、及び難燃剤、又はこれらの組み合わせからなる群から選択される1種以上の添加剤をさらに含む、請求項1〜6のいずれか一項に記載のオーバーモールド成形複合構造。
- 前記1種以上の半芳香族ポリアミドが、PA6/4T、PA6/6T、PA6/10T、PA6/12T、PA610/6T、PA612/6T、PA614/6T、PA6/6I/6T、PAD6/66//6T、PA6TDT、PA1010/10T、PA1010/1210/10T/12T、PA11/4T、PA11/6T、PA11/10T、PA11/12T、PA12/4T、PA12/6T、PA12/10T、PA1212/12T、PA66/6T、PA6I/6T、PA66/6I/6T、PA6T/6Iからなる群から選択される、請求項1〜7のいずれか一項に記載のオーバーモールド成形複合構造。
- 前記1種以上の半芳香族半結晶性ポリアミドが、PA66/6T、PA6TDT、PA6I/6T PA66/6I/6T、並びにこれらの組み合わせ及びコポリマーからなる群から選択され、前記半芳香族非晶性ポリアミド(B)が、前記非晶性半芳香族ポリアミド中のイソフタル酸の量が少なくとも60モル%であるPA6I/6T及びPA66/6T/6I、並びにこれらの組み合わせ及びコポリマーからなる群から選択される、請求項1〜8のいずれか一項に記載のオーバーモールド成形複合構造。
- 自動車、トラック、民間飛行機、航空宇宙、レール、家電製品、コンピューターハードウェア、携帯用端末、レクリエーション及びスポーツ用の構造部品、機械の構造部品、建築物の構造部品、太陽光発電装置の構造部品、又は機械的装置の構造部品の形態である、請求項1〜9のいずれか一項に記載のオーバーモールド成形複合構造。
- オーバーモールド成形複合構造を製造する方法であって、
第一成分の上に、オーバーモールド成形用樹脂組成物を含む第二成分をオーバーモールド成形する工程を含み、
前記第一成分が繊維状材料を含み、表面を有し、前記表面はその少なくとも一部分が表面樹脂組成物でできており、前記繊維状材料が、不織構造、織物、繊維詰め物、及びこれらの組み合わせから選択され、前記繊維状材料がマトリックス樹脂組成物により含浸されており、
前記マトリックス樹脂組成物と前記表面樹脂組成物組成物とが同一又は異なっており、半芳香族ポリアミドのブレンドを含むポリアミド組成物から選択される方法。 - 前記マトリックス樹脂組成物及び前記表面樹脂組成物が、半芳香族半結晶性ポリアミド(A)と半芳香族非晶性ポリアミド(B)とのブレンドを含むポリアミド組成物から選択される、請求項11に記載の方法。
- オーバーモールド成形する前記工程の前に、前記第一成分を付形する工程をさらに含む、請求項11又は12に記載の方法。
- オーバーモールド成形する前記工程が、前記第一成分を前記オーバーモールド成形用樹脂組成物に完全に封入することを含む、請求項11〜13のいずれか一項に記載の方法。
- 前記第一成分が、オーバーモールド成形する前記工程の前に加熱されて、前記オーバーモールド成形用樹脂組成物との界面を形成する表面が軟化又は部分的に溶融される、請求項11〜14のいずれか一項に記載の方法。
- 前記第一成分が、オーバーモールド成形する前記工程の前に加熱されない、請求項11〜14のいずれか一項に記載の方法。
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2011
- 2011-10-27 WO PCT/US2011/057951 patent/WO2012058350A2/en active Application Filing
- 2011-10-27 WO PCT/US2011/057969 patent/WO2012058359A1/en active Application Filing
- 2011-10-27 CN CN201180051274.8A patent/CN103180134B/zh not_active Expired - Fee Related
- 2011-10-27 US US13/282,518 patent/US20120108129A1/en not_active Abandoned
- 2011-10-27 US US13/282,545 patent/US9597861B2/en not_active Expired - Fee Related
- 2011-10-27 US US13/282,511 patent/US20120108136A1/en not_active Abandoned
- 2011-10-27 CN CN2011800509016A patent/CN103237654A/zh active Pending
- 2011-10-27 EP EP11785834.0A patent/EP2632718A1/en not_active Withdrawn
- 2011-10-27 BR BR112013010473A patent/BR112013010473A2/pt not_active IP Right Cessation
- 2011-10-27 BR BR112013010463A patent/BR112013010463A2/pt not_active IP Right Cessation
- 2011-10-27 JP JP2013536794A patent/JP2013540883A/ja active Pending
- 2011-10-27 EP EP11782294.0A patent/EP2632713A1/en not_active Withdrawn
- 2011-10-27 WO PCT/US2011/058005 patent/WO2012058379A2/en active Application Filing
- 2011-10-27 WO PCT/US2011/057979 patent/WO2012058366A1/en active Application Filing
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