JP2013524493A5 - - Google Patents

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Publication number
JP2013524493A5
JP2013524493A5 JP2013501635A JP2013501635A JP2013524493A5 JP 2013524493 A5 JP2013524493 A5 JP 2013524493A5 JP 2013501635 A JP2013501635 A JP 2013501635A JP 2013501635 A JP2013501635 A JP 2013501635A JP 2013524493 A5 JP2013524493 A5 JP 2013524493A5
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JP
Japan
Prior art keywords
intermediate layer
adhesive layer
wafer
carrier wafer
layer
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Application number
JP2013501635A
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English (en)
Japanese (ja)
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JP2013524493A (ja
JP5763169B2 (ja
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Priority claimed from PCT/EP2010/002055 external-priority patent/WO2011120537A1/de
Publication of JP2013524493A publication Critical patent/JP2013524493A/ja
Publication of JP2013524493A5 publication Critical patent/JP2013524493A5/ja
Application granted granted Critical
Publication of JP5763169B2 publication Critical patent/JP5763169B2/ja
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JP2013501635A 2010-03-31 2010-03-31 二面上にチップを備えたウェハを製造するための方法 Active JP5763169B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2010/002055 WO2011120537A1 (de) 2010-03-31 2010-03-31 Verfahren zur herstellung eines doppelseitig mit chips bestückten wafers

Publications (3)

Publication Number Publication Date
JP2013524493A JP2013524493A (ja) 2013-06-17
JP2013524493A5 true JP2013524493A5 (enExample) 2014-08-14
JP5763169B2 JP5763169B2 (ja) 2015-08-12

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ID=42286741

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013501635A Active JP5763169B2 (ja) 2010-03-31 2010-03-31 二面上にチップを備えたウェハを製造するための方法

Country Status (8)

Country Link
US (1) US9224630B2 (enExample)
EP (1) EP2553719B1 (enExample)
JP (1) JP5763169B2 (enExample)
KR (3) KR20160075845A (enExample)
CN (1) CN102812546B (enExample)
SG (1) SG183820A1 (enExample)
TW (1) TWI518758B (enExample)
WO (1) WO2011120537A1 (enExample)

Families Citing this family (7)

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WO2020178080A1 (en) * 2019-03-05 2020-09-10 Evatec Ag Method for processing fragile substrates employing temporary bonding of the substrates to carriers
KR102824895B1 (ko) 2020-02-18 2025-07-01 에베 그룹 에. 탈너 게엠베하 구성요소 전달을 위한 방법 및 장치
CN118891713A (zh) 2022-03-25 2024-11-01 Ev 集团 E·索尔纳有限责任公司 用于分离载体基板的方法和基板系统
KR102788502B1 (ko) * 2023-07-27 2025-04-01 한국기계연구원 효과적인 디본딩이 가능한 웨이퍼 모듈, 및 이의 본딩 및 디본딩 방법
WO2025228530A1 (de) 2024-05-02 2025-11-06 Ev Group E. Thallner Gmbh Verfahren zum temporären verbinden eines produktsubstrats und eines trägersubstrats, trägersubstrat, produktsubstrat und schichtsystem sowie deren anordnung und eine vorrichtung zum durchführen eines solchen verfahrens

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