WO2017137796A8 - 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム - Google Patents
接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム Download PDFInfo
- Publication number
- WO2017137796A8 WO2017137796A8 PCT/IB2016/001741 IB2016001741W WO2017137796A8 WO 2017137796 A8 WO2017137796 A8 WO 2017137796A8 IB 2016001741 W IB2016001741 W IB 2016001741W WO 2017137796 A8 WO2017137796 A8 WO 2017137796A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- adhesive resin
- adhesive layer
- resin composition
- parts
- Prior art date
Links
- 239000004840 adhesive resin Substances 0.000 title abstract 8
- 229920006223 adhesive resin Polymers 0.000 title abstract 8
- 239000000203 mixture Substances 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 3
- 239000012790 adhesive layer Substances 0.000 abstract 7
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 239000007787 solid Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000001035 drying Methods 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920005672 polyolefin resin Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/56—Non-aqueous solutions or dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
Abstract
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020207027229A KR102265015B1 (ko) | 2016-02-08 | 2016-12-12 | 접착성 수지 조성물, 피착체 접착 방법 및 접착성 수지 필름 |
US16/074,945 US11359117B2 (en) | 2016-02-08 | 2016-12-12 | Adhesive resin composition, method for bonding adherends, and adhesive resin film |
EP16889727.0A EP3415582B1 (en) | 2016-02-08 | 2016-12-12 | Adhesive resin composition, method for bonding adherends, and adhesive resin film |
CN201680080833.0A CN108603082B (zh) | 2016-02-08 | 2016-12-12 | 粘合性树脂组合物、粘合被粘物的方法及粘合性树脂膜 |
CN202010766745.4A CN111925751B (zh) | 2016-02-08 | 2016-12-12 | 粘合性树脂组合物、粘合被粘物的方法及粘合性树脂膜 |
KR1020187022352A KR102160439B1 (ko) | 2016-02-08 | 2016-12-12 | 접착성 수지 조성물, 피착체 접착 방법 및 접착성 수지 필름 |
US17/744,191 US11939492B2 (en) | 2016-02-08 | 2022-05-13 | Adhesive resin composition, method for bonding adherends, and adhesive resin film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016021940A JP6902827B2 (ja) | 2016-02-08 | 2016-02-08 | 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム |
JP2016-021940 | 2016-02-08 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/074,945 A-371-Of-International US11359117B2 (en) | 2016-02-08 | 2016-12-12 | Adhesive resin composition, method for bonding adherends, and adhesive resin film |
US17/744,191 Continuation US11939492B2 (en) | 2016-02-08 | 2022-05-13 | Adhesive resin composition, method for bonding adherends, and adhesive resin film |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2017137796A1 WO2017137796A1 (ja) | 2017-08-17 |
WO2017137796A8 true WO2017137796A8 (ja) | 2017-09-14 |
Family
ID=59563849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2016/001741 WO2017137796A1 (ja) | 2016-02-08 | 2016-12-12 | 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム |
Country Status (7)
Country | Link |
---|---|
US (2) | US11359117B2 (ja) |
EP (1) | EP3415582B1 (ja) |
JP (1) | JP6902827B2 (ja) |
KR (2) | KR102265015B1 (ja) |
CN (2) | CN111925751B (ja) |
TW (2) | TWI773103B (ja) |
WO (1) | WO2017137796A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6621262B2 (ja) * | 2015-08-06 | 2019-12-18 | 藤森工業株式会社 | ホットメルト接着性樹脂フィルムおよびその製造方法 |
JP6902827B2 (ja) * | 2016-02-08 | 2021-07-14 | 藤森工業株式会社 | 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム |
JP7094671B2 (ja) * | 2017-08-23 | 2022-07-04 | 藤森工業株式会社 | 接着性樹脂組成物及び積層体 |
JP6914145B2 (ja) * | 2017-08-23 | 2021-08-04 | 藤森工業株式会社 | 接着性樹脂組成物及び積層体 |
WO2021024978A1 (ja) * | 2019-08-06 | 2021-02-11 | 昭和電工株式会社 | プライマー付き熱可塑性樹脂材及び樹脂-樹脂接合体 |
JP7254670B2 (ja) * | 2019-09-26 | 2023-04-10 | 東洋紡株式会社 | 積層体 |
CN113355032B (zh) * | 2020-03-03 | 2023-02-28 | 利诺士尖端材料有限公司 | 粘结膜、包括其的粘结膜附着层叠体及金属箔层叠体 |
KR102324561B1 (ko) * | 2020-03-03 | 2021-11-10 | (주)이녹스첨단소재 | 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4606953A (en) * | 1983-06-23 | 1986-08-19 | Nippon Steel Corporation | Polypropylene coated steel pipe |
US5242980A (en) | 1990-02-06 | 1993-09-07 | Exxon Chemical Patents Inc. | Ethylene-unsaturated alcohol or acid copolymer and epoxy crosslinker |
JP4087468B2 (ja) * | 1996-08-02 | 2008-05-21 | 三井化学株式会社 | 接着剤組成物 |
JP4067144B2 (ja) | 1996-08-20 | 2008-03-26 | 三井化学株式会社 | 接着剤組成物 |
KR100635897B1 (ko) * | 1998-12-22 | 2006-10-18 | 히다찌 가세이 고오교 가부시끼가이샤 | 접착제 코팅된 구리 호일, 구리-클래딩된 적층물 및 이를사용한 인쇄 배선판 |
JP4700230B2 (ja) * | 2001-07-17 | 2011-06-15 | 花王株式会社 | 袋 |
JP4333829B2 (ja) * | 2002-03-07 | 2009-09-16 | 日立化成ポリマー株式会社 | 接着剤組成物 |
JP2003272572A (ja) * | 2002-03-20 | 2003-09-26 | Dainippon Printing Co Ltd | 電池用外装体と電池の包装方法 |
JP5695928B2 (ja) * | 2010-04-14 | 2015-04-08 | 東京応化工業株式会社 | 櫛型電極の製造方法 |
JP2012001661A (ja) | 2010-06-18 | 2012-01-05 | Dic Corp | ポリオレフィン多層フィルム用接着性樹脂組成物、ポリオレフィン多層フィルム用接着性樹脂組成物の製造方法、ポリオレフィン多層フィルム、金属蒸着フィルム、及び、オレフィンフィルム用水性コーティング剤。 |
JP5856803B2 (ja) * | 2011-10-25 | 2016-02-10 | 藤森工業株式会社 | 接着性樹脂組成物、接着性樹脂成形体、及び接着性樹脂積層体 |
CN104471011B (zh) * | 2012-07-20 | 2016-08-24 | Dic株式会社 | 热密封剂、使用该热密封剂的层叠体及太阳能电池模块 |
JP5664836B2 (ja) * | 2012-09-25 | 2015-02-04 | Dic株式会社 | ラミネート用接着剤、これを用いた積層体及び二次電池 |
CN104822519A (zh) * | 2012-12-04 | 2015-08-05 | 尤尼吉可株式会社 | 鞋构成部件用底漆、其制造方法、鞋构成部件以及鞋 |
CN104059579B (zh) * | 2013-03-19 | 2017-04-19 | 藤森工业株式会社 | 粘合性树脂组合物、粘合性树脂模制品以及粘合性树脂层压物 |
JP6263806B2 (ja) * | 2013-05-10 | 2018-01-24 | 藤森工業株式会社 | 接着性樹脂フィルム、及び接着性樹脂積層体 |
WO2015190411A1 (ja) * | 2014-06-11 | 2015-12-17 | 東洋紡株式会社 | ポリオレフィン系接着剤組成物 |
JP5700166B1 (ja) | 2014-08-01 | 2015-04-15 | 東洋インキScホールディングス株式会社 | 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス |
CN106459704B (zh) * | 2014-08-27 | 2020-08-25 | 东洋纺株式会社 | 低介电性粘合剂组合物 |
US20170088753A1 (en) | 2014-09-17 | 2017-03-30 | Dic Corporation | Laminating adhesive, laminate using the same, and secondary battery |
JP6718148B2 (ja) * | 2014-09-24 | 2020-07-08 | 東亞合成株式会社 | 接着剤組成物及びこれを用いた接着剤層付き積層体 |
CN106541641A (zh) | 2015-09-17 | 2017-03-29 | 藤森工业株式会社 | 电池外装用层叠体、电池外装体以及电池 |
JP6902827B2 (ja) * | 2016-02-08 | 2021-07-14 | 藤森工業株式会社 | 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム |
US10016955B2 (en) | 2016-04-19 | 2018-07-10 | The Boeing Company | Panel apparatus including multiple panels and mechanical fasteners and methods of assembling the panel apparatus |
JP7094671B2 (ja) * | 2017-08-23 | 2022-07-04 | 藤森工業株式会社 | 接着性樹脂組成物及び積層体 |
KR102524762B1 (ko) * | 2018-01-16 | 2023-04-24 | 도아고세이가부시키가이샤 | 전지용 접착제 조성물 및 그것을 사용한 전지용 접착성 부재 |
-
2016
- 2016-02-08 JP JP2016021940A patent/JP6902827B2/ja active Active
- 2016-12-07 TW TW110102961A patent/TWI773103B/zh active
- 2016-12-07 TW TW105140367A patent/TWI720078B/zh active
- 2016-12-12 WO PCT/IB2016/001741 patent/WO2017137796A1/ja active Application Filing
- 2016-12-12 CN CN202010766745.4A patent/CN111925751B/zh active Active
- 2016-12-12 US US16/074,945 patent/US11359117B2/en active Active
- 2016-12-12 KR KR1020207027229A patent/KR102265015B1/ko active IP Right Grant
- 2016-12-12 EP EP16889727.0A patent/EP3415582B1/en active Active
- 2016-12-12 CN CN201680080833.0A patent/CN108603082B/zh active Active
- 2016-12-12 KR KR1020187022352A patent/KR102160439B1/ko active IP Right Grant
-
2022
- 2022-05-13 US US17/744,191 patent/US11939492B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017141324A (ja) | 2017-08-17 |
CN111925751A (zh) | 2020-11-13 |
TWI773103B (zh) | 2022-08-01 |
EP3415582B1 (en) | 2022-03-02 |
KR102265015B1 (ko) | 2021-06-15 |
CN111925751B (zh) | 2022-10-04 |
CN108603082A (zh) | 2018-09-28 |
WO2017137796A1 (ja) | 2017-08-17 |
KR102160439B1 (ko) | 2020-09-28 |
US11359117B2 (en) | 2022-06-14 |
EP3415582A4 (en) | 2019-09-11 |
EP3415582A1 (en) | 2018-12-19 |
JP6902827B2 (ja) | 2021-07-14 |
US11939492B2 (en) | 2024-03-26 |
TW202120654A (zh) | 2021-06-01 |
US20190031928A1 (en) | 2019-01-31 |
KR20180100190A (ko) | 2018-09-07 |
TW201739877A (zh) | 2017-11-16 |
TWI720078B (zh) | 2021-03-01 |
US20220275258A1 (en) | 2022-09-01 |
CN108603082B (zh) | 2020-08-18 |
KR20200111833A (ko) | 2020-09-29 |
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