WO2017137796A1 - 接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム - Google Patents
接着性樹脂組成物、被着体接着方法、及び接着性樹脂フィルム Download PDFInfo
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- WO2017137796A1 WO2017137796A1 PCT/IB2016/001741 IB2016001741W WO2017137796A1 WO 2017137796 A1 WO2017137796 A1 WO 2017137796A1 IB 2016001741 W IB2016001741 W IB 2016001741W WO 2017137796 A1 WO2017137796 A1 WO 2017137796A1
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- adhesive
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- adhesive resin
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- 239000004840 adhesive resin Substances 0.000 title claims abstract description 118
- 229920006223 adhesive resin Polymers 0.000 title claims abstract description 118
- 239000000203 mixture Substances 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000012790 adhesive layer Substances 0.000 claims abstract description 99
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 43
- 239000010410 layer Substances 0.000 claims abstract description 40
- 239000003822 epoxy resin Substances 0.000 claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 29
- 229920003986 novolac Polymers 0.000 claims abstract description 24
- 239000003960 organic solvent Substances 0.000 claims abstract description 21
- 238000002844 melting Methods 0.000 claims abstract description 18
- 230000008018 melting Effects 0.000 claims abstract description 18
- 239000007787 solid Substances 0.000 claims abstract description 18
- 238000001035 drying Methods 0.000 claims abstract description 6
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 claims description 33
- 239000002344 surface layer Substances 0.000 claims description 30
- 125000003700 epoxy group Chemical group 0.000 claims description 29
- 150000001875 compounds Chemical class 0.000 claims description 26
- 238000003860 storage Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 21
- 230000032683 aging Effects 0.000 claims description 16
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 29
- 239000011347 resin Substances 0.000 abstract description 29
- 239000000853 adhesive Substances 0.000 abstract description 17
- 230000001070 adhesive effect Effects 0.000 abstract description 14
- 239000000178 monomer Substances 0.000 description 36
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 24
- 239000002253 acid Substances 0.000 description 22
- 125000000524 functional group Chemical group 0.000 description 19
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 17
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 15
- -1 aliphatic azo compound Chemical class 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 239000011112 polyethylene naphthalate Substances 0.000 description 9
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 150000001336 alkenes Chemical class 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
- 229920005606 polypropylene copolymer Polymers 0.000 description 4
- LPIQIQPLUVLISR-UHFFFAOYSA-N 2-prop-1-en-2-yl-4,5-dihydro-1,3-oxazole Chemical compound CC(=C)C1=NCCO1 LPIQIQPLUVLISR-UHFFFAOYSA-N 0.000 description 3
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KVNYFPKFSJIPBJ-UHFFFAOYSA-N 1,2-diethylbenzene Chemical compound CCC1=CC=CC=C1CC KVNYFPKFSJIPBJ-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- FFWSICBKRCICMR-UHFFFAOYSA-N 5-methyl-2-hexanone Chemical compound CC(C)CCC(C)=O FFWSICBKRCICMR-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- PWATWSYOIIXYMA-UHFFFAOYSA-N Pentylbenzene Chemical compound CCCCCC1=CC=CC=C1 PWATWSYOIIXYMA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000005456 alcohol based solvent Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- NIDNOXCRFUCAKQ-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1C2C=CC1C(C(=O)O)C2C(O)=O NIDNOXCRFUCAKQ-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- MHDVGSVTJDSBDK-UHFFFAOYSA-N dibenzyl ether Chemical compound C=1C=CC=CC=1COCC1=CC=CC=C1 MHDVGSVTJDSBDK-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 238000009820 dry lamination Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- NIDNOXCRFUCAKQ-UMRXKNAASA-N (1s,2r,3s,4r)-bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylic acid Chemical compound C1[C@H]2C=C[C@@H]1[C@H](C(=O)O)[C@@H]2C(O)=O NIDNOXCRFUCAKQ-UMRXKNAASA-N 0.000 description 1
- INCNUEMXRGAHPM-UHFFFAOYSA-N (2,4-dimethyl-5h-1,3-oxazol-4-yl)methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1(C)COC(C)=N1 INCNUEMXRGAHPM-UHFFFAOYSA-N 0.000 description 1
- CYPICXZOCVTPOZ-UHFFFAOYSA-N (2,4-dimethyl-5h-1,3-oxazol-4-yl)methyl prop-2-enoate Chemical compound CC1=NC(C)(COC(=O)C=C)CO1 CYPICXZOCVTPOZ-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-RNGGSSJXSA-N (3ar,4r,7s,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound C1[C@@H]2[C@@H]3C(=O)OC(=O)[C@@H]3[C@H]1C=C2 KNDQHSIWLOJIGP-RNGGSSJXSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- AYPVLWKHTZYRIQ-UHFFFAOYSA-N (4-ethyl-2-prop-1-en-2-yl-5h-1,3-oxazol-4-yl)methanol Chemical compound CCC1(CO)COC(C(C)=C)=N1 AYPVLWKHTZYRIQ-UHFFFAOYSA-N 0.000 description 1
- CYLVUSZHVURAOY-UHFFFAOYSA-N 2,2-dibromoethenylbenzene Chemical compound BrC(Br)=CC1=CC=CC=C1 CYLVUSZHVURAOY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NJBYQXATMUPPBX-UHFFFAOYSA-N 2-(4-ethenylphenyl)-4,4-dimethyl-5h-1,3-oxazole Chemical compound CC1(C)COC(C=2C=CC(C=C)=CC=2)=N1 NJBYQXATMUPPBX-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- SDEXZERWEBDHSL-UHFFFAOYSA-N 2-ethenyl-4,4-dimethyl-5h-1,3-oxazole Chemical compound CC1(C)COC(C=C)=N1 SDEXZERWEBDHSL-UHFFFAOYSA-N 0.000 description 1
- BQBSIHIZDSHADD-UHFFFAOYSA-N 2-ethenyl-4,5-dihydro-1,3-oxazole Chemical compound C=CC1=NCCO1 BQBSIHIZDSHADD-UHFFFAOYSA-N 0.000 description 1
- HMEVYZZCEGUONQ-UHFFFAOYSA-N 2-ethenyl-5-methyl-4,5-dihydro-1,3-oxazole Chemical compound CC1CN=C(C=C)O1 HMEVYZZCEGUONQ-UHFFFAOYSA-N 0.000 description 1
- DDBYLRWHHCWVID-UHFFFAOYSA-N 2-ethylbut-1-enylbenzene Chemical compound CCC(CC)=CC1=CC=CC=C1 DDBYLRWHHCWVID-UHFFFAOYSA-N 0.000 description 1
- KBKNKFIRGXQLDB-UHFFFAOYSA-N 2-fluoroethenylbenzene Chemical compound FC=CC1=CC=CC=C1 KBKNKFIRGXQLDB-UHFFFAOYSA-N 0.000 description 1
- OZPOYKXYJOHGCW-UHFFFAOYSA-N 2-iodoethenylbenzene Chemical compound IC=CC1=CC=CC=C1 OZPOYKXYJOHGCW-UHFFFAOYSA-N 0.000 description 1
- JMMZCWZIJXAGKW-UHFFFAOYSA-N 2-methylpent-2-ene Chemical compound CCC=C(C)C JMMZCWZIJXAGKW-UHFFFAOYSA-N 0.000 description 1
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 description 1
- ZTHJQCDAHYOPIK-UHFFFAOYSA-N 3-methylbut-2-en-2-ylbenzene Chemical compound CC(C)=C(C)C1=CC=CC=C1 ZTHJQCDAHYOPIK-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- UZAAWTQDNCMMEX-UHFFFAOYSA-N 4,4-dimethyl-2-prop-1-en-2-yl-5h-1,3-oxazole Chemical compound CC(=C)C1=NC(C)(C)CO1 UZAAWTQDNCMMEX-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- YAXPDWVRLUOOBJ-UHFFFAOYSA-N 4-ethylhex-3-en-3-ylbenzene Chemical compound CCC(CC)=C(CC)C1=CC=CC=C1 YAXPDWVRLUOOBJ-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- AXPZDYVDTMMLNB-UHFFFAOYSA-N Benzyl ethyl ether Chemical compound CCOCC1=CC=CC=C1 AXPZDYVDTMMLNB-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 0 CCC(CC)(Cc1cc(C(*)(*)c(cc2)ccc2O*)cc(C(CC)(CC)Cc(cc(C(*)(*)c(cc2)ccc2O*)cc2)c2O*)c1O*)c(cc(C(*)(*)c(cc1)ccc1O*)cc1)c1O* Chemical compound CCC(CC)(Cc1cc(C(*)(*)c(cc2)ccc2O*)cc(C(CC)(CC)Cc(cc(C(*)(*)c(cc2)ccc2O*)cc2)c2O*)c1O*)c(cc(C(*)(*)c(cc1)ccc1O*)cc1)c1O* 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XXRCUYVCPSWGCC-UHFFFAOYSA-N Ethyl pyruvate Chemical compound CCOC(=O)C(C)=O XXRCUYVCPSWGCC-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 229920002600 TPX™ Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- YFNONBGXNFCTMM-UHFFFAOYSA-N butoxybenzene Chemical compound CCCCOC1=CC=CC=C1 YFNONBGXNFCTMM-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000003841 chloride salts Chemical class 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 229930007927 cymene Natural products 0.000 description 1
- RTVSUIOGXLXKNM-UHFFFAOYSA-N dec-1-enylbenzene Chemical compound CCCCCCCCC=CC1=CC=CC=C1 RTVSUIOGXLXKNM-UHFFFAOYSA-N 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- UHKJHMOIRYZSTH-UHFFFAOYSA-N ethyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OCC UHKJHMOIRYZSTH-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 229940117360 ethyl pyruvate Drugs 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- KETWBQOXTBGBBN-UHFFFAOYSA-N hex-1-enylbenzene Chemical compound CCCCC=CC1=CC=CC=C1 KETWBQOXTBGBBN-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052622 kaolinite Inorganic materials 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- CWKLZLBVOJRSOM-UHFFFAOYSA-N methyl pyruvate Chemical compound COC(=O)C(C)=O CWKLZLBVOJRSOM-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- KNZIIQMSCLCSGZ-UHFFFAOYSA-N non-1-enylbenzene Chemical compound CCCCCCCC=CC1=CC=CC=C1 KNZIIQMSCLCSGZ-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- RCALDWJXTVCBAZ-UHFFFAOYSA-N oct-1-enylbenzene Chemical compound CCCCCCC=CC1=CC=CC=C1 RCALDWJXTVCBAZ-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- HFPZCAJZSCWRBC-UHFFFAOYSA-N p-cymene Chemical compound CC(C)C1=CC=C(C)C=C1 HFPZCAJZSCWRBC-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- KHMYONNPZWOTKW-UHFFFAOYSA-N pent-1-enylbenzene Chemical compound CCCC=CC1=CC=CC=C1 KHMYONNPZWOTKW-UHFFFAOYSA-N 0.000 description 1
- DLRJIFUOBPOJNS-UHFFFAOYSA-N phenetole Chemical compound CCOC1=CC=CC=C1 DLRJIFUOBPOJNS-UHFFFAOYSA-N 0.000 description 1
- 239000006187 pill Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 229920001384 propylene homopolymer Polymers 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/56—Non-aqueous solutions or dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
Definitions
- the present invention relates to an adhesive resin composition having excellent adhesion to various adherends, particularly to resins and metals, an adherend adhesion method using the adhesive resin composition, and an adhesive resin film. .
- This application claims the priority based on Japanese Patent Application No. 2006-021940 for which it applied on February 8, 2016, and uses the content here.
- Patent Document 1 discloses a polyolefin multilayer film containing a dibasic carboxylic acid anhydride-modified polyolefin resin having a weight average molecular weight of 15,000 to 150,000 and a solid content acid value of 100 to 300.
- An adhesive resin composition is disclosed.
- patent document 1 it is supposed that favorable adhesiveness can be obtained with respect to organic / inorganic materials, such as resin or a metal, by using the said composition.
- organic / inorganic materials such as resin or a metal
- the adhesion between the adhesive layer made of the adhesive resin composition and the adherend is improved. It is possible depending on conditions.
- the metal adherend is laminated through the adhesive layer, there is a problem that durability may be inferior.
- the adhesive resin composition described in Patent Document 1 does not contain an organic solvent, and forms an adhesive layer by molding by co-extrusion with a lower layer film.
- the present invention has been made in view of the above situation, and for various adherends such as metal, glass, plastic, etc., a solvent-based adhesive resin composition having excellent adhesion and durability,
- An object is to provide an adherend adhesion method and an adhesive resin film.
- the adhesive resin composition according to the first aspect of the present invention comprises an acid-modified polyolefin resin (A) having a melting point of 50 to 100 ° C., having a solid content of more than 50 parts by mass and not more than 99.5 parts by mass. It contains an epoxy resin (B) having a novolac structure and an organic solvent (C) in a solid content of 0.5 parts by mass or more and less than 50 parts by mass.
- the adhesive resin composition of the first aspect is 70 parts by mass or more and 99.5 parts by mass or less of the acid-modified polyolefin resin (A) in solids, and 0.5 parts by mass or more in solids.
- the acid-modified polyolefin resin (A) preferably has a methyl group and an ethyl group in the side chain.
- the value of the storage elastic modulus at 60 ° C. is 1.0 ⁇ 10 6 or more.
- the value of the storage elastic modulus at 150 ° C. is preferably 1.0 ⁇ 10 4 or more.
- an adhesive layer is formed by applying and drying the adhesive resin composition according to the first aspect on the first adherend.
- the adhesive resin film of the third aspect of the present invention is an adhesive resin film comprising a first adhesive layer, a base material layer, and a second adhesive layer in this order.
- One or both of the adhesive layer and the second adhesive layer includes the adhesive resin composition of the first aspect.
- the adhesive resin of the fourth aspect of the invention is an adhesive resin film comprising a first surface layer, a first adhesive layer, a base material layer, a second adhesive layer, and a second surface layer in this order, and the first surface Either one or both of the layer and the second surface layer is a laminate layer containing an acid-modified polyolefin resin, and either one or both of the first adhesive layer or the second adhesive layer is the above-mentioned
- the adhesive resin composition according to the first aspect is included.
- the laminate layer in addition to the acid-modified polyolefin resin, the laminate layer further contains a compound having an epoxy group or an oxazoline group, and the proportion of the compound having the epoxy group or oxazoline group is The content is preferably 1 to 20% by mass with respect to the acid-modified polyolefin resin.
- an adhesive composition it is possible to obtain an adhesive composition, an adherend adhesion method, and an adhesive resin film having excellent adhesion and durability to various adherends such as metal, glass and plastic. It becomes possible.
- the adhesive resin composition of the first aspect of the present invention comprises an acid-modified polyolefin resin (A) having a melting point of 50 to 100 ° C., having a solid content of more than 50 parts by mass and not more than 99.5 parts by mass, It contains 0.5 parts by mass or more and less than 50 parts by mass of the epoxy resin (B) having a novolac structure and the organic solvent (C).
- the acid-modified polyolefin resin (A) is sometimes referred to as “component (A)”
- the epoxy resin (B) having a novolac structure is sometimes referred to as “component (B)”
- the organic solvent is sometimes referred to as “component (C)”.
- the acid-modified polyolefin resin (A) is a polyolefin resin modified with an unsaturated carboxylic acid or a derivative thereof, and an acid functional group such as a carboxy group or a carboxylic anhydride group in the polyolefin resin. It is what has.
- the component (A) is obtained by modifying a polyolefin resin with an unsaturated carboxylic acid or a derivative thereof, or copolymerizing an acid functional group-containing monomer and an olefin.
- (A) component what was obtained by acid-modifying polyolefin resin is preferable.
- Examples of the acid modification method include graft modification in which a polyolefin resin and an acid functional group-containing monomer are melt-kneaded in the presence of a radical polymerization initiator such as an organic peroxide or an aliphatic azo compound.
- a radical polymerization initiator such as an organic peroxide or an aliphatic azo compound.
- polystyrene resin examples include polyethylene, polypropylene, poly-1-butene, polyisobutylene, a copolymer of propylene and ethylene, a copolymer of propylene and an olefin monomer, and the like.
- olefin monomer for copolymerization examples include 1-butene, isobutylene, 1-hexene and the like.
- the copolymer may be a block copolymer or a random copolymer.
- the polyolefin resin is preferably a polypropylene resin polymerized using propylene as a raw material, such as homopolypropylene (propylene homopolymer), a copolymer of propylene and ethylene, a copolymer of propylene and butene,
- a propylene-1-butene copolymer that is, a polyolefin resin having a methyl group and an ethyl group in the side chain is preferable.
- the acid functional group-containing monomer is a compound having an ethylenic double bond and a carboxy group or a carboxylic anhydride group in the same molecule, and includes various unsaturated monocarboxylic acids, dicarboxylic acids, or dicarboxylic acids.
- An acid anhydride is mentioned.
- Acid functional group-containing monomers having carboxy groups include acrylic acid, methacrylic acid, maleic acid, nadic acid, fumaric acid, itaconic acid, citraconic acid, crotonic acid, isocrotonic acid, tetrahydrophthalic acid, endo - ⁇ , ⁇ -unsaturated carboxylic acid monomers such as bicyclo [2.2.1] -5-heptene-2,3-dicarboxylic acid (endic acid).
- acid functional group-containing monomers having carboxylic anhydride groups include unsaturated dicarboxylic acids such as maleic anhydride, nadic anhydride, itaconic anhydride, citraconic anhydride, and endic anhydride An anhydride monomer is mentioned. These acid functional group-containing monomers may be used alone or in combination of two or more in the component (A).
- the acid functional group-containing monomer is preferably a monomer containing an acid functional group that reacts well with the epoxy group in the component (B) described later, and the acid anhydride group is selected because of its high reactivity with the epoxy group.
- the acid functional group-containing monomer is more preferable, the carboxylic anhydride group-containing monomer is more preferable, and maleic anhydride is particularly preferable.
- the unreacted acid functional group-containing monomer was removed in advance in order to prevent a decrease in adhesive strength due to the unreacted acid functional group-containing monomer It is preferable to use those as the component (A).
- the component derived from the polyolefin resin or olefin is preferably 50 parts by mass or more with respect to 100 parts by mass of the total amount of the component (A).
- the melting point of the component (A) is 50 to 100 ° C., preferably 60 to 98 ° C., more preferably 70 to 98 ° C., and further preferably 75 to 95 ° C.
- fusing point of component is 50 to 100 ° C., preferably 60 to 98 ° C., more preferably 70 to 98 ° C., and further preferably 75 to 95 ° C.
- the melting point of the component (A) is set to be equal to or lower than the above upper limit, the component (A) is easily dissolved in the component (C), and as a result, a more uniform adhesive resin composition is obtained.
- Component and (B) component react well to improve adhesion and durability.
- the temperature and heat at the time of thermocompression bonding with the adherend using the adhesive resin film formed from the adhesive resin composition can be made relatively low. As a result, the selection range of the adherend material to be bonded using the adhesive resin film can be expanded.
- the molecular weight of the component (A) is not particularly limited as long as it can satisfy the above melting point, but generally a resin having a molecular weight of 10,000 to 800,000 is used, and 50,000 to 650 is used. , 000 is preferable, 80,000 to 550,000 is more preferable, and 100,000 to 450,000 is more preferable.
- maleic anhydride-modified polypropylene is preferable from the viewpoints of solubility in the component (C) described later, the melting point, adhesion, durability, and the like.
- the component (B) is an epoxy resin having a novolac structure.
- the adhesive resin composition of the present invention contains the component (B)
- the cross-linked structure formed by the adhesive resin composition becomes denser, and the adhesion to the adherend and the durability are further improved.
- the component (B) has a novolak structure at least in part of its structure. Furthermore, although it does not specifically limit as resin which has an epoxy group, A phenol novolak-type epoxy resin etc. are mentioned.
- the phenol novolac type epoxy resin refers to a compound in which a phenol novolac resin obtained by acid condensation of phenol and formaldehyde has a basic structure and an epoxy group is introduced into a part of the structure.
- the amount of epoxy group introduced per molecule in the phenol novolac type epoxy resin is not particularly limited, but it exists in a large amount in the phenol novolac resin by reacting an epoxy group raw material such as epichlorohydrin with the phenol novolac resin. Since many epoxy groups are introduced into the phenolic hydroxyl group, it is usually a polyfunctional epoxy resin.
- a bisphenol A novolak type epoxy resin having a phenol novolak structure as a basic skeleton and also having a bisphenol A structure is preferable.
- the bisphenol A structure in the epoxy resin may be a structure that can be derived from bisphenol A, and the hydroxyl groups at both ends of bisphenol A may be substituted with groups such as an epoxy group-containing group.
- R 1 to R 6 are each independently a hydrogen atom or a methyl group, n is an integer of 0 to 10, and R X is a group having an epoxy group.
- R 1 to R 6 are each independently a hydrogen atom or a methyl group.
- R 3 and R 4 may be the same or different.
- the resin represented by the formula (1) preferably satisfies at least one of the following (i) to (iii).
- Both R 1 and R 2 are methyl groups
- Both R 3 and R 4 are methyl groups
- Both R 5 and R 6 are methyl groups
- a carbon atom to which R 1 and R 2 are bonded and two hydroxyphenyl groups to which the carbon atom is bonded constitute a structure derived from bisphenol A.
- R X is a group having an epoxy group.
- the group having an epoxy group include an epoxy group, a combination of an epoxy group and an alkylene group, and among them, a glycidyl group is preferable.
- the epoxy equivalent of the bisphenol A novolac type epoxy resin is preferably 100 to 300, and more preferably 200 to 300.
- the epoxy equivalent (g / eq) is the molecular weight of the epoxy resin per epoxy group, and the smaller the value, the more epoxy groups in the resin.
- phenol novolac type epoxy resins examples include jER154, jER157S70, jER-157S65 manufactured by Mitsubishi Chemical Corporation, and EPICLON N-730A, EPICLON N-740, EPICLONN-770, EPICLON N-775 (above, manufactured by DIC). Commercial products such as trade names) can also be used.
- both the acid functional group of the component (A) and the epoxy group of the component (B) are to be adhered (particularly functional groups such as hydroxyl groups of the adherend). Therefore, it is considered that excellent adhesiveness can be achieved. Moreover, as a result of the reaction of a part of the acid functional group of the component (A) and a part of the epoxy group of the component (B), a crosslinked structure of the component (A) and the component (B) is formed. It is considered that the strength of the adhesive resin is reinforced by this cross-linked structure, and excellent durability is obtained together with excellent adhesiveness.
- the adhesive resin composition of the present invention contains an organic solvent (C).
- the liquid adhesive resin composition obtained by dissolving the component (A) and the component (B) in the component (C) is bonded by selecting an application instead of extrusion molding in forming an adhesive layer.
- the layer can be formed with a thinner layer, and the adhesive layer can be made thinner and the entire laminate using the adhesive layer can be made thinner.
- the term “liquid” as used in the present invention means a liquid in a temperature range of ⁇ 5 to 50 ° C., preferably in a temperature range of 0 to 40 ° C. That is, the liquid state can be maintained over the entire temperature range. Moreover, it can be set as the adhesive resin composition suitable for dry lamination.
- the component (C) By applying and drying such a liquid adhesive resin composition on the lower layer, an adhesive layer can be formed, and adhesion by dry lamination becomes possible.
- the component (C) the above component (A), component (B), and optional components used as necessary (details will be described later) can be suitably dissolved to form a uniform solution. It does not specifically limit, Arbitrary solvents can be used from the well-known thing as a solvent of a solution type adhesive agent.
- the adhesive resin composition of the present invention can be used by volatilizing the component (C) by heating or the like after being applied on an adherend. Therefore, from the viewpoint of facilitating volatilization, the component (C) is preferably an organic solvent having a boiling point of 150 ° C. or lower.
- the component (C) one type may be used alone, or two or more types may be used in combination as a mixed solvent.
- a mixed solvent it is also preferable to use a combination of an organic solvent that dissolves component (A) well and an organic solvent that dissolves component (B).
- a combination of toluene that dissolves component (A) well and methyl ethyl ketone that dissolves component (B) well is preferable.
- the above component (A), component (B), etc. may be dissolved, or component (A), component (B) After each component is dissolved in each good solvent, a plurality of organic solvents in which each component is dissolved may be mixed.
- the ratio of each organic solvent is not particularly limited.
- the adhesive resin composition of the present invention may further contain other components in addition to the component (A), the component (B), and the component (C).
- other components include miscible additives and additional resins. More specifically, catalysts, crosslinking agents, plasticizers, stabilizers, colorants, and the like can be used.
- the component (A) is contained in an amount of more than 50 parts by mass and 99.5 parts by mass or less, and the component (B) is 0.5 parts by mass or more and less than 50 parts by mass. Contained. That is, in the solid content of the adhesive resin composition of the present invention, more than half of the mass ratio is the component (A), and the adhesive resin composition of the present invention contains the component (A) as a main component. More preferably, the component (B) is 0.5 to 30 parts by mass with respect to 70 to 99.5 parts by mass of the component (A), and more preferably, the component (A) is 80 to 98 parts by mass.
- the component (B) is 2 to 20 parts by mass, and the component (B) is particularly preferably 5 to 10 parts by mass with respect to 90 to 95 parts by mass of the component (A).
- the component (A) is always a main component. Therefore, also when it contains an arbitrary component, the component (A) in the total solid content of the adhesive resin composition is more than 50 parts by mass. For example, in the total solid content, 70 to 99.5 parts by mass of component (A), 0.5 to 29.5 parts by mass of component (B), and 0.5 to 29.5 parts by mass of other components The adhesive resin composition containing these is mentioned.
- the amount of the component (C) used in the adhesive resin composition of the present invention is not particularly limited as long as each component such as the component (A), the component (B), and the optional component can be dissolved satisfactorily.
- the solid content concentration is preferably 3 to 30% by mass, more preferably 5 to 25% by mass, and even more preferably 10 to 20% by mass.
- the adhesive resin composition of the present invention has a storage elastic modulus at 60 ° C. of 1.0 in a dynamic viscoelasticity measurement of an adhesive resin film (adhesive layer) formed using the adhesive resin composition.
- X10 6 or more, and the value of the storage elastic modulus at 150 ° C. is preferably 1.0 ⁇ 10 4 or more. More specifically, the storage elastic modulus at 60 ° C. is 1.0 ⁇ 10 6 to 1.0 ⁇ 10 8 Pa, and the storage elastic modulus at 150 ° C. is 1.0 ⁇ 10 4 to 1. More preferably, it is 0 ⁇ 10 8 Pa. That is, the value of the storage elastic modulus at 150 ° C.
- the adhesive resin composition of the present invention not only has a sufficient elastic modulus at 60 ° C., but also does not decrease the elastic modulus at 150 ° C., and can maintain an appropriate range of elastic modulus. It is preferable.
- the acid functional group of the component (A) and the epoxy group of the component (B) are cross-linked,
- the elastic modulus is maintained even at a relatively high temperature, and the shape of the layer containing the adhesive resin composition (adhesive layer) does not change and is maintained well.
- the shape, adhesiveness, and the like of the adhesive resin film having the adhesive layer are maintained well, and an adhesive resin film having high temperature resistance can be obtained.
- the value of the storage elastic modulus in the dynamic viscoelasticity measurement can be measured as follows, for example. First, the adhesive resin composition of the present invention is applied on a non-adhering substrate such as a fluororesin, heated at 110 ° C. for 300 seconds and dried (the organic solvent is completely volatilized), and then at 80 ° C. for 3 days. After the aging treatment (crosslinking is completed), the base material is peeled to form an adhesive layer (adhesive resin film) having a thickness of 0.3 mm.
- the storage elastic modulus can be measured by measuring the formed adhesive resin film with a known dynamic viscoelasticity measuring device.
- the dynamic viscoelasticity measuring device As the dynamic viscoelasticity measuring device, a dynamic viscoelasticity measuring device “RSA-3” (trade name) manufactured by TA Instrument can be used.
- the vibration frequency when measuring the storage elastic modulus is, for example, 1 Hz.
- the storage elastic modulus of the adhesive in the present invention is preferably 1.0 ⁇ 10 6 to 1.0 ⁇ 10 8 at 60 ° C., and preferably 5.0 ⁇ 10 6 to 5.0 ⁇ 10 7. Is more preferable.
- the storage elastic modulus at 150 ° C. is preferably 1.0 ⁇ 10 4 to 1.0 ⁇ 10 7 and more preferably 5.0 ⁇ 10 4 to 9.5 ⁇ from the viewpoint of adhesiveness and durability. 10 5 , most preferably 3.0 ⁇ 10 5 to 8.0 ⁇ 10 5 .
- the adherend adhesion method according to the second aspect of the present invention is a method of adhering an adherend using the adhesive resin composition according to the first aspect, wherein the adherend is bonded onto the first adherend. After forming the adhesive layer by applying and drying the adhesive resin composition of the first aspect, a second adherend is laminated on the adhesive layer, and the adhesive layer and the second adherend are laminated. It adheres to the kimono.
- the materials of the first adherend and the second adherend are not particularly limited as long as they have sufficient mechanical strength and heat resistance.
- the first adherend and the second adherend may be made of the same material or different materials.
- the thicknesses of the first adherend and the second adherend are not particularly limited, but may be, for example, 10 to 1,000 ⁇ m.
- the method for applying the adhesive resin composition of the first embodiment on the first adherend is not particularly limited, and it is applied by a conventional method using a known application device such as a bar coater, a die coater, or a gravure coater. be able to.
- the adhesive resin composition applied on the first adherend is dried, and an adhesive layer is formed by volatilizing at least a part of the organic solvent in the adhesive resin composition.
- the drying conditions may be appropriately set according to the organic solvent to be used (component (C)).
- the organic solvent can be volatilized by heating at a temperature of 40 to 150 ° C. for 5 to 600 seconds. it can.
- the thickness of the adhesive layer to be formed is appropriately determined according to the materials and thicknesses of the first adherend and the second adherend, but is generally 0.5 to 500 ⁇ m.
- thermocompression bonding After laminating the second adherend on the formed adhesive layer, it is preferable to perform thermocompression bonding in order to bring the adhesive layer and the second adherend into close contact with each other.
- the conditions for thermocompression bonding may be appropriately selected as long as the desired adhesive strength can be obtained.
- the adhesive strength can be improved by increasing the thermocompression bonding temperature, increasing the thermocompression bonding pressure, and increasing the time for thermocompression bonding.
- the first adherend and / or the second adherend is a resin film. May cause thermal shrinkage of the resin film, slowing down the processing speed, reducing work efficiency, and requiring a large-scale apparatus. Therefore, it is preferable to select appropriate conditions according to the required adhesive strength.
- the aging temperature and time can be appropriately determined according to the desired adhesive strength.
- the aging temperature and time are preferably allowed to stand for 1 to 5 days under a temperature condition of 30 to 90 ° C.
- the degree of acceleration of the adhesive layer is proportional to the temperature and proportional to the length of processing time. For this reason, it is preferable to appropriately adjust, for example, 30 ° C. for 5 days and 90 ° C. for 1 day, depending on the desired adhesive strength, temperature tolerance of the material used, work efficiency required, and the like.
- the temperature and time required for the aging treatment are inversely proportional to the content of the component (B) contained in the adhesive layer. That is, when the amount of the component (B) blended with the component (A) is large, the crosslinking reaction between the component (A) and the component (B) tends to proceed, so that the temperature is lower and / or the time is shorter. Sufficient aging hardening can be obtained. On the other hand, when the amount of the component (B) blended with the component (A) is small, the number of reaction points between the component (A) and the component (B) is small. May be required.
- the adhesive resin film according to the third aspect of the present invention includes a first adhesive layer, a base material layer, and a second adhesive layer in this order, and the first adhesive layer or the second adhesive layer. Either one or both includes the adhesive resin composition of the first aspect.
- the adhesive resin film of the fourth aspect of the present invention comprises a first surface layer, a first adhesive layer, a base material layer, a second adhesive layer, and a second surface layer in this order. Any one or both of the first surface layer and the second surface layer is a laminate layer containing acid-modified polyolefin, and either one or both of the first adhesive layer or the second adhesive layer is used. Includes the adhesive resin composition of the first aspect.
- the adhesive resin film of the third and fourth aspects is a laminate having at least one adhesive layer containing the adhesive resin composition of the first aspect, and can be used for many purposes.
- At least one of the first adhesive layer and the second adhesive layer in the third and fourth aspects includes the adhesive resin composition of the first aspect, but both are adhesives of the first aspect. It is preferable that a functional resin composition is included.
- the one adhesive layer may be a known urethane-based adhesive or epoxy-based adhesive. It can be set as the contact bonding layer formed using adhesive agents, such as an adhesive agent.
- the base material layer in the third and fourth aspects is not particularly limited as long as it has sufficient mechanical strength, and the first adherend and the second adherend described above in the description of the second aspect.
- the same body can be used.
- a film made of PEN, PET, TPX, PI or the like is preferable because it has a low coefficient of linear expansion and is difficult to cause delamination even when an adherend such as a metal is adhered using the adhesive resin film.
- a PEN film is particularly preferred.
- the resin film preferably contains a particulate or fibrous filler as an additive.
- the filler should just be a filler with high heat resistance, and an organic filler, an inorganic filler, etc. are mentioned.
- the shrinkage force of the adhesive resin film can be further suppressed, and the strength of the adhesive resin film itself can be increased.
- carbonates such as calcium carbonate, magnesium carbonate and barium carbonate
- sulfates such as calcium sulfate, magnesium sulfate and barium sulfate
- chlorides such as sodium chloride, calcium chloride and magnesium chloride
- aluminum oxide calcium oxide
- oxides such as magnesium oxide, zinc oxide, titanium oxide, and silica
- minerals such as talc, smectite, mica, and kaolinite
- carbon compounds such as carbon fiber and carbon particles; and fine particles made of glass.
- the shape of the filler include a spherical shape, a rod shape, and a plate shape, and a plate filler is preferable.
- First and second surface layers Either or both of the first surface layer and the second surface layer in the fourth aspect are laminate layers containing an acid-modified polyolefin resin, but both are laminate layers containing an acid-modified polyolefin resin. It is preferable.
- Acid-modified polyolefin resin As the acid-modified polyolefin resin in the fourth aspect, the same resin as the acid-modified polyolefin resin mentioned as the acid-modified polyolefin resin (A) in the first aspect can be used, and maleic anhydride Modified polypropylene is preferred. It is preferable that the first surface layer and the second surface layer further contain a compound having an epoxy group or a compound having an oxazoline group, in addition to the acid-modified polyolefin resin.
- the compound having an epoxy group is not particularly limited as long as it is a compound having one or more epoxy groups in one molecule.
- a phenoxy resin synthesized from bisphenols and epichlorohydrin; a phenol novolac type epoxy Resin; bisphenol type epoxy resin and the like can be mentioned.
- the phenol novolac type epoxy resin the phenol novolac type epoxy resin (for example, the compound represented by the formula (1)) described above in the first embodiment can be used.
- the compound having an oxazoline group is a compound having an oxazoline group (a monovalent group having a bond at the 2-position of the oxazoline ring (C 3 H 5 NO)) in the structure.
- the oxazoline group reacts with an acid functional group (for example, carboxy group, carboxylic acid group, etc.) of the acid-modified polyolefin resin to form a crosslinked structure.
- an acid functional group for example, carboxy group, carboxylic acid group, etc.
- Specific examples of the compound having an oxazoline group include an oxazoline group-containing styrene-based resin.
- the acid functional group is a carboxy group
- the following crosslinking reaction occurs to form an amide ester bond. Is done.
- the strength of the resin is reinforced by this cross-linked structure, and excellent durability is obtained together with excellent adhesiveness.
- a resin obtained by copolymerizing a styrene monomer and an oxazoline group-containing monomer is preferable.
- Styrene and its derivatives can be used as the styrene monomer.
- alkyl styrene such as styrene, ⁇ -methyl styrene, methyl styrene, dimethyl styrene, trimethyl styrene, ethyl styrene, diethyl styrene, triethyl styrene, propyl styrene, butyl styrene, hexyl styrene, heptyl styrene, octyl styrene; chloro;
- halogenated styrene such as styrene, fluorostyrene, bromostyrene, dibromostyrene, and iodostyrene. Of these, styrene is preferable.
- the oxazoline group-containing monomer is not particularly limited as long as it contains an oxazoline group and can be copolymerized with a styrene monomer, but a monomer having an oxazoline group and a vinyl group is preferable. Can be used.
- Examples of the oxazoline group-containing vinyl monomer include 2-vinyl-2-oxazoline, 5-methyl-2-vinyl-2-oxazoline, 4,4-dimethyl-2-vinyl-2-oxazoline, and 2-isopropenyl-2-oxazoline.
- the styrene monomer and the oxazoline group-containing monomer one kind may be used alone, or two or more kinds may be used in combination.
- the compound which has an oxazoline group may contain 1 or more types of other monomers other than a styrene-type monomer and an oxazoline group containing monomer.
- Other monomers are not particularly limited as long as they are copolymerizable with these monomers, and examples include (meth) acrylate monomers, (meth) acrylic ester monomers, (meth) acrylamide monomers, and the like.
- the constituent ratio of each monomer is not particularly limited, but is 5 to 50% by mass, more preferably 10 to 30% by mass, based on the total monomers constituting the compound having an oxazoline group.
- % Of a resin obtained by copolymerizing 1% of an oxazoline group-containing monomer By using the oxazoline group-containing monomer within the above range, the acid-modified polyolefin resin and the compound having an oxazoline group can be sufficiently cross-linked to obtain good durability.
- the number average molecular weight of the compound having an oxazoline group is preferably 30,000 to 250,000, more preferably 50,000 to 200,000, still more preferably 60,000 to 100,000, and 60,000 to 80,000. Is most preferred.
- the compound having an epoxy group or an oxazoline group is preferably contained in an amount of 1 to 20 parts by mass with respect to the acid-modified polyolefin resin, and more preferably 1 to 10 parts by mass. 1 to 5 parts by mass is preferable.
- the first and second surface layers can appropriately contain miscible additives, additional resins, plasticizers, stabilizers, colorants, and the like as desired.
- the adhesive resin film of the third aspect can be manufactured as follows, for example.
- the adhesive resin composition of one embodiment is preferably formed by coating, and then the composition is dried to volatilize at least a part of the organic solvent, whereby the first adhesive layer and the second adhesive composition are dried.
- the adhesive layer is formed.
- the first adhesive layer and the second adhesive layer can each be formed in the same manner as the adhesive layer described in the second embodiment.
- the adhesive resin film of a 4th aspect can be manufactured as follows, for example. First, similarly to the third aspect, an adhesive resin film including a first adhesive layer, a base material layer, and a second adhesive layer in this order is formed. Next, the first surface layer and the second surface layer are laminated and bonded on the formed first adhesive layer and second adhesive layer, respectively.
- the first surface layer and the second surface layer may be formed by coating on the first adhesive layer and the second adhesive layer, or may be formed in advance as a film. Good.
- the adhesion between the first adhesive layer and the first surface layer and the adhesion between the second adhesive layer and the second surface layer are respectively the adhesive layer and the second adherend described in the second aspect. It can be performed in the same manner as the adhesion. Specifically, it is preferable to adhere through the above-described thermocompression bonding and aging treatment.
- each layer in the adhesive resin film is preferably 0.5 to 500 ⁇ m, more preferably 5 to 50 ⁇ m for the first adhesive layer and the second adhesive layer.
- the substrate layer is preferably 20 to 1,000 ⁇ m, more preferably 50 to 200 ⁇ m.
- the first surface layer and the second surface layer are preferably 5 to 200 ⁇ m when a film is previously formed by extrusion or the like, and preferably 0.5 to 100 ⁇ m when manufactured by solution coating.
- Examples 1 to 9, Comparative Examples 1 to 6 (Adhesive resin film) Using each component shown in Table 1, an adhesive resin composition of each example was obtained. Specifically, a solution in which component (A) was dissolved in toluene as component (C) and a solution in which component (B) was dissolved in methyl ethyl ketone as component (C) were prepared, and these solutions were mixed. In Comparative Example 3 not containing the component (B), only methyl ethyl ketone not containing the component (B) was mixed with the toluene solution containing the component (A).
- the adhesive resin composition of the present invention is applied onto a non-adhesive substrate such as a fluororesin, heated at 110 ° C. for 300 seconds and dried (the organic solvent is completely volatilized), and then aged at 80 ° C. for 3 days. After (crosslinking is completed), the base material is peeled to form an adhesive layer (adhesive resin film) having a thickness of 0.3 mm, a width of 4 mm, and a length of 30 mm.
- a non-adhesive substrate such as a fluororesin
- the formed adhesive resin film was set in a dynamic viscoelasticity measuring apparatus with a chuck distance of 20 mm, and the temperature was increased from 20 ° C. to 160 ° C. at a rate of temperature increase of 3 ° C./min.
- the value of the storage elastic modulus (E ′) when a strain of 0.01% was applied was determined.
- a dynamic viscoelasticity measuring apparatus TA Instrument's dynamic viscoelasticity measuring apparatus “RSA-3” (trade name) was used.
- a stainless steel foil having a thickness of 100 ⁇ m was prepared. On one surface of this stainless steel foil, the adhesive resin compositions obtained in the above examples and comparative examples were applied at a coating amount of 20 g / m 2 and dried at 110 ° C. for 1 minute to form a 2 ⁇ m thick adhesive layer. Formed. Next, an aluminum foil having a thickness of 100 ⁇ m was stacked on the formed adhesive layer, and then bonded by thermocompression bonding at 160 ° C. for 3 seconds while applying a pressure of 0.4 MPa. Thereafter, an aging treatment was performed at 80 ° C. for 3 days to obtain a laminate.
- a PEN film having a thickness of 75 ⁇ m was prepared as a base film.
- the adhesive resin compositions obtained in the above Examples and Comparative Examples were applied to both sides of this PEN film at a coating amount of 20 g / m 2 and dried at 110 ° C. for 1 minute to form a 2 ⁇ m thick adhesive layer. It formed on both surfaces of the PEN film. Thereafter, an aging treatment was performed at 80 ° C. for 3 days to obtain a laminate. Next, 100 ⁇ m-thick stainless steel foils were stacked one on each of the adhesive layers on both sides of the formed laminate, and then bonded at 160 ° C. for 3 seconds while applying a pressure of 0.4 MPa.
- a PEN film having a thickness of 75 ⁇ m was prepared as a base film.
- the adhesive resin compositions obtained in the above Examples and Comparative Examples were applied to both sides of this PEN film at a coating amount of 20 g / m 2 and dried at 110 ° C. for 1 minute to form a 2 ⁇ m thick adhesive layer. It formed on both surfaces of the PEN film.
- a surface layer having a thickness of 50 ⁇ m was formed on each surface of the two adhesive layers.
- the surface layer was obtained by copolymerizing 95 parts by mass of maleic anhydride-modified polypropylene (melting point: 140 ° C.) and “Epocross RPS-1005” (trade name; manufactured by Nippon Shokubai Co., Ltd .; styrene and 2-isopropenyl-2-oxazoline.
- a resin obtained by melt-kneading 5 parts by mass of a resin obtained in this manner; number average molecular weight 70,000) and then extrusion-molding. Thereafter, bonding was performed by thermocompression bonding at 150 ° C. for 1 second while applying a pressure of 1 MPa, and then an aging treatment was performed at 80 ° C. for 3 days to obtain a laminate.
- a 100 ⁇ m-thick stainless steel foil is overlaid one by one, and then applied by thermocompression bonding at 160 ° C. for 3 seconds while applying a pressure of 0.4 MPa. Combined.
- the obtained laminate was immersed in hot water at 95 ° C. for 1,000 hours and then evaluated in the same manner as in the above “3 layer durability evaluation”. Shown in
- Examples 10 to 12, Comparative Example 7 In the same manner as in Examples 1 to 9 and the like, adhesive resin compositions of Examples and Comparative Examples shown in Table 2 were obtained. Each abbreviation in Table 2 is the same as the abbreviation in Table 1. Thereafter, the storage elastic modulus at 20 to 160 ° C. was measured in the same manner as the storage elastic modulus measurement. The results are shown in FIG.
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Abstract
Description
本願は、2016年2月8日に出願された日本国特願2016−021940号に基づく優先権を主張し、その内容をここに援用する。
例えば、特許文献1には、重量平均分子量が15,000~150,000、且つ、固形分酸価が100~300である、二塩基カルボン酸無水物変性ポリオレフィン樹脂を含有する、ポリオレフィン多層フィルム用接着性樹脂組成物が開示されている。
また、特許文献1に記載の接着性樹脂組成物は、有機溶剤を含有せず、下層フィルムとの共押出しによる成形で接着層を形成するものである。押出し成形では安定したフィルム成形をするにあたり、吐出する樹脂量に制限があるため、当該接着層を用いた積層体の薄層化には限界がある。接着層形成においては、押出し成形に代えて塗布を選択することにより、接着層をより薄層で形成可能となる。そのため、塗布により接着層を形成可能な溶剤系の接着性樹脂組成物も求められている。
しかしながら、従来、金属、ガラス、プラスチック等の各種の被着体に対して、優れた接着性及び耐久性を有する溶剤系の接着性樹脂組成物は知られていなかった。
[1]本発明の第一の態様の接着性樹脂組成物は、固形分中50質量部超、99.5質量部以下の、融点が50~100℃である酸変性ポリオレフィン樹脂(A)と、固形分中0.5質量部以上、50質量部未満の、ノボラック構造を有するエポキシ樹脂(B)と、有機溶剤(C)と、を含有することを特徴とする。
[2]第一の態様の接着性樹脂組成物は、固形分中70質量部以上、99.5質量部以下の前記酸変性ポリオレフィン樹脂(A)と、固形分中0.5質量部以上、30質量部以下の前記ノボラック構造を有するエポキシ樹脂(B)と、を含有することが好ましい。
[3]第一の態様において、前記酸変性ポリオレフィン樹脂(A)は、側鎖にメチル基及びエチル基を有することが好ましい。
[4]第一の態様において、前記接着性樹脂組成物を用いて形成された接着性樹脂フィルムの動的粘弾性測定において、60℃における貯蔵弾性率の値が1.0×106以上であり、150℃における貯蔵弾性率の値が1.0×104以上であることが好ましい。
[5]本発明の第二の態様の被着体接着方法は、第1の被着体上に、前記第一の態様の接着性樹脂組成物を塗布して乾燥することにより接着層を形成した後、前記接着層上に第2の被着体を積層して前記接着層と前記第2の被着体とを接着することを特徴とする。
[6]第二の態様において、前記接着層と前記第2の被着体との接着の後、40~90℃で1~5日間加熱してエージング処理を行うことが好ましい。
[7]本発明の第三の態様の接着性樹脂フィルムは、第1の接着層、基材層、及び第2の接着層をこの順に備えてなる接着性樹脂フィルムであって、前記第1の接着層若しくは前記第2の接着層のいずれか一方又は両方が、前記第一の態様の接着性樹脂組成物を含むことを特徴とする
[8]本発明の第四の態様の接着性樹脂フィルムは、第1の表面層、第1の接着層、基材層、第2の接着層、及び第2の表面層をこの順に備えてなる接着性樹脂フィルムであって、前記第1の表面層若しくは前記第2の表面層のいずれか一方又は両方が、酸変性ポリオレフィン樹脂を含有するラミネート層であり、前記第1の接着層若しくは前記第2の接着層のいずれか一方又は両方が、前記第一の態様の接着性樹脂組成物を含むことを特徴とする。
[9]第四の態様において、前記ラミネート層が、前記酸変性ポリオレフィン樹脂に加えて、さらにエポキシ基又はオキサゾリン基を有する化合物を含有し、前記エポキシ基又はオキサゾリン基を有する化合物の割合が、前記酸変性ポリオレフィン樹脂に対して1~20質量%であることが好ましい。
本発明の第一の態様の接着性樹脂組成物は、固形分中50質量部超、99.5質量部以下の、融点が50~100℃である酸変性ポリオレフィン樹脂(A)と、固形分中0.5質量部以上、50質量部未満の、ノボラック構造を有するエポキシ樹脂(B)と、有機溶剤(C)と、を含有するものである。
以下、酸変性ポリオレフィン樹脂(A)を「(A)成分」、ノボラック構造を有するエポキシ樹脂(B)を「(B)成分」、有機溶剤を「(C)成分」ということがある。
本発明において、酸変性ポリオレフィン樹脂(A)とは、不飽和カルボン酸又はその誘導体で変性されたポリオレフィン系樹脂であって、ポリオレフィン系樹脂中に、カルボキシ基又は無水カルボン酸基等の酸官能基を有するものである。
(A)成分は、不飽和カルボン酸又はその誘導体によるポリオレフィン系樹脂の変性、或いは酸官能基含有モノマーとオレフィン類との共重合等により得られる。なかでも(A)成分としては、ポリオレフィン系樹脂を酸変性して得られたものが好ましい。
酸変性方法としては、有機過酸化物又は脂肪族アゾ化合物等のラジカル重合開始剤の存在下で、ポリオレフィン樹脂と酸官能基含有モノマーとを溶融混練するグラフト変性が挙げられる。
共重合する場合の前記オレフィン系モノマーとしては、1−ブテン、イソブチレン、1−ヘキセン等が挙げられる。
共重合体は、ブロック共重合体であってもよく、ランダム共重合体であってもよい。
なかでもポリオレフィン系樹脂としては、ホモポリプロピレン(プロピレン単独重合体)、プロピレンとエチレンとの共重合体、プロピレンとブテンとの共重合体等の、プロピレンを原料として重合されるポリプロピレン系樹脂が好ましく、特に、プロピレン−1−ブテン共重合体、すなわち側鎖にメチル基及びエチル基を有するポリオレフィン樹脂が好ましい。1−ブテンを含有することにより、当該樹脂が加熱された際の分子運動が促進され、(A)成分と(B)成分との架橋点同士が接触する機会が増える結果、被着体への密着性がより向上する。
カルボキシ基を有する酸官能基含有モノマー(カルボキシ基含有モノマー)としては、アクリル酸、メタクリル酸、マレイン酸、ナジック酸、フマル酸、イタコン酸、シトラコン酸、クロトン酸、イソクロトン酸、テトラヒドロフタル酸、エンド−ビシクロ[2.2.1]−5−ヘプテン−2,3−ジカルボン酸(エンディック酸)などのα,β−不飽和カルボン酸モノマーが挙げられる。
カルボン酸無水物基を有する酸官能基含有モノマー(カルボン酸無水物基含有モノマー)としては、無水マレイン酸、無水ナジック酸、無水イタコン酸、無水シトラコン酸、無水エンディック酸などの不飽和ジカルボン酸無水物モノマーが挙げられる。
これらの酸官能基含有モノマーは、(A)成分において1種類を単独で用いてもよく、2種類以上を併用してもよい。
酸変性に用いた酸官能基含有モノマーの一部が未反応である場合は、未反応の酸官能基含有モノマーによる接着力の低下を防ぐため、未反応の酸官能基含有モノマーを予め除去したものを(A)成分として用いることが好ましい。
(A)成分の融点を上記下限値以上とすることにより、接着性樹脂組成物を含む接着層の耐熱性が向上する結果、該接着層と被着体とを接着した後の耐熱性、耐久性を向上させることができる。
一方、(A)成分の融点を上記上限値以下とすることにより、(A)成分が(C)成分に溶解しやすいものとなる結果、より均一な接着性樹脂組成物が得られ、(A)成分と(B)成分とが良好に反応して接着性及び耐久性を向上させることができる。また、上記上限値以下の融点を有する(A)成分を用いることにより、当該接着性樹脂組成物により形成された接着性樹脂フィルムを用いて被着体との熱圧着を行う際の温度及び熱圧着後のエージング温度を比較的低温とすることができる。その結果、当該接着性樹脂フィルムを用いて接着を行う被着体材料の選択の幅を広げることができる。
(B)成分は、ノボラック構造を有するエポキシ樹脂である。本発明の接着性樹脂組成物は、(B)成分を含有することにより、当該接着性樹脂組成物により形成される架橋構造がより緻密となり、被着体への接着性及び耐久性がさらに向上する。
(B)成分は、少なくともその構造の一部にノボラック構造を有する。さらに、エポキシ基を有する樹脂としては、特に限定されるものではないが、フェノールノボラック型エポキシ樹脂等が挙げられる。
本発明においてフェノールノボラック型エポキシ樹脂とは、フェノールとホルムアルデヒドとを酸縮合して得られるフェノールノボラック樹脂を基本構造とし、その構造の一部にエポキシ基が導入された化合物をいう。フェノールノボラック型エポキシ樹脂における1分子あたりのエポキシ基導入量は、特に限定されるものではないが、エピクロルヒドリン等のエポキシ基原料とフェノールノボラック樹脂とを反応させることにより、フェノールノボラック樹脂中に多数存在するフェノール性水酸基に多数のエポキシ基が導入されるため、通常は多官能エポキシ樹脂となる。
[式(1)中、R1~R6は、それぞれ独立に水素原子又はメチル基であり、nは、0~10の整数であり、RXは、エポキシ基を有する基である。]
式(1)で表される樹脂中は、下記(i)~(iii)の少なくともいずれか1つを満たすことが好ましい。
(i)R1及びR2の両方がメチル基
(ii)R3及びR4の両方がメチル基
(iii)R5及びR6の両方がメチル基
例えば、上記(i)を満たすことにより、式(1)において、R1及びR2が結合する炭素原子と、当該炭素原子が結合する2つのヒドロキシフェニル基と、がビスフェノールAから誘導される構造を構成することとなる。
また、上記(A)成分の酸官能基の一部と、(B)成分のエポキシ基の一部とが反応し、(A)成分と(B)成分との架橋構造が形成される結果、この架橋構造により接着性樹脂の強度が補強され、優れた接着性と共に良好な耐久性が得られるものと考えられる。
本発明の接着性樹脂組成物は有機溶剤(C)を含有する。
上記(A)成分及び(B)成分を、(C)成分に溶解して得られる液状の接着性樹脂組成物は、接着層形成においては、押出し成形に代えて塗布を選択することにより、接着層をより薄層で形成可能となり、接着層の薄層化及び接着層を用いた積層体全体の薄膜化が可能である。なお、本発明でいう「液状」とは、−5~50℃の温度範囲、好ましくは0~40℃の温度範囲において液体状のものをいう。すなわち、これらの温度範囲の全域において液体状態を維持できるものである。
また、ドライラミネートに好適な接着性樹脂組成とすることができる。このような液状接着性樹脂組成を、下層となる層の上に塗布及び乾燥することにより、接着層を形成することができ、ドライラミネートにより接着が可能となる。
(C)成分としては、上記(A)成分、(B)成分、及び必要に応じて用いられる任意成分(詳細は後述)を好適に溶解して均一な溶液とすることができるものであれば特に限定されるものではなく、溶液型接着剤の溶剤として公知のものの中から任意の溶剤を用いることができる。また、本発明の接着性樹脂組成物は、被着体上に塗布した後、加熱等により(C)成分を揮発させて用いられ得る。そのため、揮発を容易とする観点から、(C)成分としては150℃以下の沸点を有する有機溶剤が好ましい。
複数種の有機溶剤を混合して用いる場合、各有機溶剤の割合は特に限定されるものではないが、例えば、トルエンとメチルエチルケトンとを組み合わせて用いる場合、これらの混合割合は、トルエン:メチルエチルケトン=60:40~95:5(質量比)が好ましく、トルエン:メチルエチルケトン=70:30~90:10(質量比)がより好ましい。
本発明の接着性樹脂組成物は、上記(A)成分、(B)成分、及び(C)成分に加えて、さらに他の成分を含有していてもよい。他の成分としては、混和性のある添加剤及び付加的な樹脂等が挙げられ、より具体的には、触媒、架橋剤、可塑剤、安定剤、着色剤等を用いることができる。
すなわち、本発明の接着性樹脂組成物は、60℃において十分な弾性率を有するのみならず、150℃においても弾性率が低下しすぎず、適度な範囲の弾性率を維持し得るものであることが好ましい。
上述のような(A)成分及び(B)成分を有する本発明の接着性樹脂組成物によれば、(A)成分の酸官能基と(B)成分のエポキシ基とが架橋することにより、比較的高温においても弾性率が維持され、接着性樹脂組成物を含む層(接着層)の形状が変化せず、良好に維持される。その結果、当該接着層を有する接着性樹脂フィルムの形状、接着性等も良好に保たれ、高温耐性を有する接着性樹脂フィルムを得ることが可能となる。
まず、フッ素樹脂等の接着しない基材上に、本発明の接着性樹脂組成物を塗布し、110℃で300秒間加熱して乾燥(有機溶剤を完全に揮発させる)させ、80℃で3日間エージング処理をした(架橋を完了させた)後、基材を剥離することにより、厚さ0.3mmの接着層(接着性樹脂フィルム)を形成する。形成された接着性樹脂フィルムを、公知の動的粘弾性測定装置で測定することにより、貯蔵弾性率を測定することができる。動的粘弾性測定装置としては、TA Instrument社の動的粘弾性測定装置「RSA−3」(商品名)等を用いることができる。貯蔵弾性率を測定する際の振動周波数は、例えば1Hzである。本発明における接着剤の貯蔵弾性率は、60℃においては1.0×106~1.0×108であることが好ましく、5.0×106~5.0×107であることがさらに好ましい。150℃における貯蔵弾性率は、接着性及び耐久性の観点から、1.0×104~1.0×107であることが好ましく、さらに好ましくは5.0×104~9.5×105であり、最も好ましくは3.0×105~8.0×105である。
本発明の第二の態様の被着体接着方法は、上記第一の態様の接着性樹脂組成物を用いて被着体を接着する方法であって、第1の被着体上に、上記第一の態様の接着性樹脂組成物を塗布して乾燥することにより接着層を形成した後、前記接着層上に第2の被着体を積層して、前記接着層と当該第2の被着体とを接着するものである。
第1の被着体、第2の被着体は、十分な機械強度及び耐熱性を有するものであれば、その材料は特に限定されるものではない。例えば、ポリエチレンナフタレート(PEN)、ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレート(PBT)、環状オレフィンポリマー(COP)、メチルペンテンポリマー(TPX)、ポリイミド(PI)等からなる樹脂フィルム;鉄、銅、アルミニウム、鉛、亜鉛、チタン、クロム等の金属板(金属箔);ステンレス等の合金板(合金板箔);ガラス板等を用いることができる。
第1の被着体、第2の被着体は、同一材料からなるものであってもよく、異なる材料からなるものであってもよい。第1の被着体、第2の被着体の厚みは、特に限定されるものではないが、例えば10~1,000μmとすることができる。
第1の被着体上に塗布された接着性樹脂組成物を乾燥し、接着性樹脂組成物中の有機溶剤の少なくとも一部を揮発させることにより接着層が形成される。乾燥条件は、使用する有機溶剤(前記(C)成分)に応じて適宜設定すればよいが、例えば、40~150℃の温度で5~600秒間加熱することにより、有機溶剤を揮発させることができる。
形成される接着層の厚さは、第1の被着体、第2の被着体の材料及び厚さに応じて適宜決定されるが、一般的には0.5~500μmである。
また、エージング処理に必要な温度及び時間は、接着層が含有する(B)成分の含有量と反比例する。すなわち、(A)成分に対して配合された(B)成分量が多い場合には、(A)成分と(B)成分との架橋反応が進行しやすいため、より低温及び/又はより短時間で十分なエージング硬化を得ることができる。一方、(A)成分に対して配合された(B)成分量が少ない場合には、(A)成分と(B)成分との反応点が少ないため、より高温及び/又はより長時間のエージングが必要となる場合がある。例えば、(A)成分と(B)成分との合計に対して10質量%の(B)成分を用いて、60℃で2~3日程度のエージングを行った場合、(A)成分と(B)成分との合計に対して3質量%の(B)成分を用いて、80℃で4~5日程度のエージングを行った場合と同等の性能となる。
本発明の第三の態様の接着性樹脂フィルムは、第1の接着層、基材層、及び第2の接着層をこの順に備えてなり、前記第1の接着層若しくは第2の接着層のいずれか一方又は両方が、前記第一の態様の接着性樹脂組成物を含む。
また、本発明の第四の態様の接着性樹脂フィルムは、第1の表面層、第1の接着層、基材層、第2の接着層、及び第2の表面層をこの順に備えてなり、前記第1の表面層若しくは第2の表面層のいずれか一方又は両方が、酸変性ポリオレフィンを含有するラミネート層であり、前記第1の接着層若しくは第2の接着層のいずれか一方又は両方が、前記第一の態様の接着性樹脂組成物を含む。
第三及び第四の態様の接着性樹脂フィルムは、前記第一の態様の接着性樹脂組成物を含む接着層を少なくとも一層有する積層体であって、多用途に用いることができるものである。
第三及び第四の態様における第1の接着層及び第2の接着層は、少なくともいずれか一方が前記第一の態様の接着性樹脂組成物を含むものであるが、両方が第一の態様の接着性樹脂組成物を含むことが好ましい。第1の接着層及び第2の接着層のうち、一方が第一の態様の接着性樹脂組成物を含む接着層でない場合、当該一方の接着層としては、公知のウレタン系接着剤、エポキシ系接着剤等の接着剤を用いて形成された接着層とすることができる。
第三及び第四の態様における基材層は、十分な機械強度を有するものであれば特に限定されず、第二の態様の説明中において上述した第1の被着体、第2の被着体と同様のものを用いることができる。
なかでも、線膨張係数が低く、当該接着性樹脂フィルムを用いて金属等の被着体を接着した際にも層間剥離を起こしづらいことから、PEN、PET、TPX、PI等からなるフィルムが好ましく、PENフィルムが特に好ましい。
線膨張係数の低い樹脂を用いることにより、当該接着性樹脂フィルムを含む積層体、特に金属被着体と接着性樹脂フィルムとが接着された積層体の、温度による歪みの発生が低減される。
無機フィラーとしては、炭酸カルシウム、炭酸マグネシウム、炭酸バリウムなどの炭酸塩;硫酸カルシウム、硫酸マグネシウム、硫酸バリウムなどの硫酸塩;塩化ナトリウム、塩化カルシウム、塩化マグネシウムなどの塩化物;酸化アルミニウム、酸化カルシウム、酸化マグネシウム、酸化亜鉛、酸化チタン、シリカなどの酸化物;タルク、スメクタイト、マイカ、カオリナイトなどの鉱物;炭素繊維、炭素粒子等の炭素化合物;ガラスからなる微粒子が挙げられる。
フィラーの形状としては、球状、棒状、板状等が挙げられるが、板状フィラーが好ましい。
第四の態様における第1の表面層及び第2の表面層のいずれか一方又は両方は、酸変性ポリオレフィン樹脂を含有するラミネート層であるが、両方が酸変性ポリオレフィン樹脂を含有するラミネート層であることが好ましい。
第四の態様における酸変性ポリオレフィン樹脂としては、第一の態様において、酸変性ポリオレフィン樹脂(A)として挙げた酸変性ポリオレフィン樹脂と同様の樹脂を用いることができ、無水マレイン酸変性ポリプロピレンが好ましい。
第1の表面層及び第2の表面層は、酸変性ポリオレフィン樹脂に加えて、さらにエポキシ基を有する化合物又はオキサゾリン基を有する化合物を含有することが好ましい。
エポキシ基を有する化合物としては、1分子中にエポキシ基を1以上有する化合物であれば特に限定されず、例えば、ビスフェノール類とエピクロルヒドリンより合成されるフェノキシ樹脂;フェノールノボラック型エポキシ樹脂;ビスフェノール型エポキシ樹脂等が挙げられる。フェノールノボラック型エポキシ樹脂としては、第一の態様において上述したフェノールノボラック型エポキシ樹脂(例えば、前記式(1)で表される化合物)を用いることができる。
本発明においてオキサゾリン基を有する化合物とは、オキサゾリン基(オキサゾリン環(C3H5NO)の2位に結合手を有する1価の基)を構造内に有する化合物である。酸変性ポリオレフィン樹脂と共に用いられる化合物がオキサゾリン基を有することにより、オキサゾリン基と酸変性ポリオレフィン樹脂の酸官能基(例えばカルボキシ基、カルボン酸基、等)とが反応して架橋構造が形成される。
オキサゾリン基を有する化合物として、具体的には、オキサゾリン基含有スチレン系樹脂が挙げられ、例えば、酸官能基がカルボキシ基の場合であれば、以下のような架橋反応が起こり、アミドエステル結合が形成される。その結果として、この架橋構造により樹脂の強度が補強され、優れた接着性と共に良好な耐久性が得られる。
スチレン系モノマーとしては、スチレン及びその誘導体を用いることができる。具体的には、スチレン、α‐メチルスチレン、メチルスチレン、ジメチルスチレン、トリメチルスチレン、エチルスチレン、ジエチルスチレン、トリエチルスチレン、プロピルスチレン、ブチルスチレン、ヘキシルスチレン、ヘプチルスチレン、オクチルスチレン等のアルキルスチレン;クロロスチレン、フルオロスチレン、ブロモスチレン、ジブロモスチレン、ヨードスチレン等のハロゲン化スチレン等が挙げられる。なかでも、スチレンが好ましい。
オキサゾリン基含有ビニルモノマーとしては、2−ビニル−2−オキサゾリン、5−メチル−2−ビニル−2−オキサゾリン、4,4−ジメチル−2−ビニル−2−オキサゾリン、2−イソプロペニル−2−オキサゾリン、4,4−ジメチル−2−イソプロペニル−2−オキサゾリン、4−アクリロイル−オキシメチル−2,4−ジメチル−2−オキサゾリン、4−メタクリロイルオキシメチル−2,4−ジメチル−2−オキサゾリン、4−メタクリロイルオキシメチル−2−フェニル−4−メチル−2−オキサゾリン、2−(4−ビニルフェニル)−4,4−ジメチル−2−オキサゾリン、4−エチル−4−ヒドロキシメチル−2−イソプロペニル−2−オキサゾリン、4−エチル−4−カルボエトキシメチル−2−イソプロペニル−2−オキサゾリン等が挙げられる。なかでも、2−イソプロペニル−2−オキサゾリンが好ましい。
また、オキサゾリン基を有する化合物は、スチレン系モノマー及びオキサゾリン基含有モノマー以外に、その他のモノマーの1種以上を含有していてもよい。その他のモノマーは、これらモノマーと共重合可能なものであれば特に限定されるものではなく、例えば(メタ)アクリレートモノマー、(メタ)アクリルエステルモノマー、(メタ)アクリルアミドモノマー等が挙げられる。
オキサゾリン基を有する化合物において、各モノマーの構成割合は、特に限定されるものではないが、オキサゾリン基を有する化合物を構成する全モノマーに対して、5~50質量%、より好ましくは10~30質量%のオキサゾリン基含有モノマーを共重合させて得られる樹脂が好ましい。上記範囲内のオキサゾリン基含有モノマーを用いることにより、前記酸変性ポリオレフィン樹脂とオキサゾリン基を有する化合物とを十分に架橋させ、良好な耐久性を得ることができる。
第1、第2の表面層は、所望により混和性のある添加剤、付加的な樹脂、可塑剤、安定剤、着色剤等を適宜含有することができる。
まず、第三の態様と同様にして、第1の接着層、基材層、及び第2の接着層をこの順に備えてなる接着性樹脂フィルムを形成する。次いで、形成された第1の接着層及び第2の接着層上に、第1の表面層及び第2の表面層をそれぞれ積層して接着する。第1の表面層及び第2の表面層は、第1の接着層及び第2の接着層上に塗布により形成されるものであってもよく、或いは予めフィルムとして形成されたものであってもよい。第1の接着層と第1の表面層との接着、及び第2の接着層と第2の表面層との接着は、それぞれ、第二の態様において説明した接着層と第2の被着体との接着と同様にして行うことができる。具体的には、上述のような熱圧着、エージング処理を経て接着されることが好ましい。
(接着性樹脂フィルム)
表1中に示す各成分を用いて、各例の接着剤樹脂組成物を得た。具体的には、(A)成分を(C)成分のトルエンに溶解した溶液と、(B)成分を(C)成分のメチルエチルケトンに溶解した溶液とをそれぞれ用意し、これら溶液を混合した。(B)成分を含有しない比較例3では、(B)成分を含まないメチルエチルケトンのみを、(A)成分を含有するトルエン溶液と混合した。
(A)−1:無水マレイン酸変性1−ブテン−プロピレン共重合体(融点80℃)
(A)−2:無水マレイン酸変性ポリプロピレン(融点85℃)
(A)−3:無水マレイン酸変性1−ブテン−エチレン共重合体(融点80℃)
(A)−4:無水マレイン酸変性1−ブテン−プロピレン共重合体(融点50℃)
(A)−5:無水マレイン酸変性1−ブテン−プロピレン共重合体(融点100℃)
(A)−6:無水マレイン酸変性1−ブテン−プロピレン共重合体(融点40℃)
(A)−7:無水マレイン酸変性1−ブテン−プロピレン共重合体(融点120℃)
(B)−1:「jER157S70」(商品名;三菱化学社製;ビスフェノールA構造を有するフェノールノボラック型エポキシ樹脂;粘度=80;エポキシ当量=210)
(B)−2:エポキシ基を有さず、末端のエポキシ基を開環させたフェノキシ樹脂
(C)−1:トルエン/メチルエチルケトン=80/20(質量比)の混合溶剤
JIS K7244「プラスチック−動的機械特性の試験方法」に準ずる。
まず、フッ素樹脂等の接着しない基材上に、本発明の接着性樹脂組成物を塗布し、110℃で300秒間加熱して乾燥(有機溶剤を完全に揮発させる)させ、80℃3日間エージング(架橋を完了させる)後、基材を剥離することにより、厚さ0.3mm、幅4mm、長さ30mmの接着層(接着性樹脂フィルム)を形成する。形成された接着性樹脂フィルムを、チャック間20mmの動的粘弾性測定装置にセットし、大気圧下において、20℃から160℃まで昇温速度3℃/minで昇温させながら、周波数1Hz、ひずみ0.01%を印加した際の貯蔵弾性率(E’)の値を求めた。
動的粘弾性測定装置としては、TA Instrument社の動的粘弾性測定装置「RSA−3」(商品名)を用いた。
まず、厚さ100μmのステンレス箔を用意した。このステンレス箔の片面に、上記各実施例及び比較例で得られた接着性樹脂組成物を塗布量20g/m2で塗布し、110℃で1分間乾燥して、厚さ2μmの接着層を形成した。
次いで、形成された接着層上に厚さ100μmのアルミニウム箔を重ねた後、0.4MPaの圧力をかけながら、160℃で3秒間の熱圧着により貼り合わせを行った。その後、80℃で3日間エージング処理を行い、積層体とした。
上記のようにして得られた各例の積層体を、JIS C6471「フレキシブルプリント配線板用銅張積層板試験方法」に規定された引き剥がし測定方法A(90°方向引き剥がし)に準拠し、引張試験機(日本電産シンポ(株)社製、商品名:FGS−50E−H)を用いて行った。以下の評価基準で評価を行った結果を、「(単層)接着性」として表1に示す。
1:10N/15mm以上。
2:5N/15mm以上、10N/15mm未満。
3:5N/15mm未満。
上記のようにして得られた各例の積層体を、95℃の熱水に1,000時間浸漬した後、JIS C6471「フレキシブルプリント配線板用銅張積層板試験方法」に規定された引き剥がし測定方法A(90°方向引き剥がし)に準拠し、引張試験機(日本電産シンポ(株)社製;商品名「FGS−50E−H」)を用いて行った。以下の評価基準で評価を行った結果を、「(単層)耐久性」として表1に示す。
A:10N/15mm以上。
B:5N/15mm以上、10N/15mm未満。
C:1N/15mm以上、5N/15mm未満。
D:完全に剥離してしまっているため、測定不可。
基材フィルムとして厚さ75μmのPENフィルムを用意した。このPENフィルムの両面に、上記各実施例及び比較例で得られた接着性樹脂組成物を塗布量20g/m2で塗布し、110℃で1分間乾燥して、厚さ2μmの接着層をPENフィルムの両面に形成した。その後、80℃で3日間エージング処理を行い、積層体とした。
次いで、形成された積層体の両面の接着層上に、厚さ100μmのステンレス箔をそれぞれ一枚ずつ重ねた後、0.4MPaの圧力をかけながら、160℃で3秒間貼り合わせを行った。
得られた積層体を95℃の熱水に1,000時間浸漬した後、目視により観察を行い、以下の評価基準で評価を行った結果を、「(3層)耐久性」として表1に示す。
A:層間の剥がれが全く認められない。
B:層間の剥がれがごく僅かに認められるが許容範囲である。
C:層間が剥離してしまっている部分がある。
D:完全に剥離してしまっている。
基材フィルムとして厚さ75μmのPENフィルムを用意した。このPENフィルムの両面に、上記各実施例及び比較例で得られた接着性樹脂組成物を塗布量20g/m2で塗布し、110℃で1分間乾燥して、厚さ2μmの接着層をPENフィルムの両面に形成した。
次いで、接着層二層の表面にそれぞれ、厚さ50μmの表面層を形成した。表面層は、無水マレイン酸変性ポリプロピレン(融点140℃)の95質量部と、「エポクロス RPS−1005」(商品名;日本触媒社製;スチレンと2−イソプロペニル−2−オキサゾリンとを共重合させて得られた樹脂;数平均分子量=7万)の5質量部とを溶融混練後、押出し成形により得られたフィルムである。
その後、1MPaの圧力をかけながら、150℃で1秒間の熱圧着により貼り合わせを行った後、80℃で3日間エージング処理を行い、積層体とした。
次いで、形成された積層体の両面の各表面層上に、厚さ100μmのステンレス箔をそれぞれ一枚ずつ重ねた後、0.4MPaの圧力をかけながら、160℃で3秒間の熱圧着により貼り合わせを行った。
得られた積層体を95℃の熱水に1,000時間浸漬した後、上記「3層耐久性評価」と同様にして評価を行った結果を、「(5層)耐久性」として表1に示す。
上記実施例1~9等と同様にして、表2に示す各実施例及び比較例の接着剤樹脂組成物を得た。表2中の各略号は前記表1の略号と同様である。
その後、前記貯蔵弾性率測定と同様にして、20~160℃における貯蔵弾性率を測定した。結果を図1に示す。
Claims (9)
- 固形分中50質量部超、99.5質量部以下の、融点が50~100℃である酸変性ポリオレフィン樹脂(A)と、
固形分中0.5質量部以上、50質量部未満の、ノボラック構造を有するエポキシ樹脂(B)と、
有機溶剤(C)と、
を含有することを特徴とする接着性樹脂組成物。 - 固形分中70質量部以上、99.5質量部以下の前記酸変性ポリオレフィン樹脂(A)と、
固形分中0.5質量部以上、30質量部以下の前記ノボラック構造を有するエポキシ樹脂(B)と、を含有する、請求項1記載の接着性樹脂組成物。 - 前記酸変性ポリオレフィン樹脂(A)が、側鎖にメチル基及びエチル基を有する、請求項1又は2に記載の接着性樹脂組成物。
- 前記接着性樹脂組成物を用いて形成された接着性樹脂フィルムの動的粘弾性測定において、60℃における貯蔵弾性率の値が1.0×106以上であり、
150℃における貯蔵弾性率の値が1.0×104以上である、請求項1~3のいずれか一項に記載の接着性樹脂組成物。 - 第1の被着体上に、請求項1~4のいずれか一項に記載の接着性樹脂組成物を塗布して乾燥することにより接着層を形成した後、前記接着層上に第2の被着体を積層して前記接着層と前記第2の被着体とを接着することを特徴とする被着体接着方法。
- 前記接着層と前記第2の被着体との接着の後、40~90℃で1~5日間加熱してエージング処理を行う、請求項5に記載の被着体接着方法。
- 第1の接着層、基材層、及び第2の接着層をこの順に備えてなる接着性樹脂フィルムであって、
前記第1の接着層若しくは前記第2の接着層のいずれか一方又は両方が、請求項1~4のいずれか一項に記載の接着性樹脂組成物を含むことを特徴とする接着性樹脂フィルム。 - 第1の表面層、第1の接着層、基材層、第2の接着層、及び第2の表面層をこの順に備えてなる接着性樹脂フィルムであって、
前記第1の表面層若しくは前記第2の表面層のいずれか一方又は両方が、酸変性ポリオレフィン樹脂を含有するラミネート層であり、
前記第1の接着層若しくは前記第2の接着層のいずれか一方又は両方が、請求項1~4のいずれか一項に記載の接着性樹脂組成物を含むことを特徴とする接着性樹脂フィルム。 - 前記ラミネート層が、前記酸変性ポリオレフィン樹脂に加えて、さらにエポキシ基又はオキサゾリン基を有する化合物を含有し、
前記エポキシ基又はオキサゾリン基を有する化合物の割合が、前記酸変性ポリオレフィン樹脂に対して1~20質量%である、請求項8に記載の接着性樹脂フィルム。
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Publication number | Publication date |
---|---|
JP2017141324A (ja) | 2017-08-17 |
CN111925751A (zh) | 2020-11-13 |
TWI773103B (zh) | 2022-08-01 |
EP3415582B1 (en) | 2022-03-02 |
KR102265015B1 (ko) | 2021-06-15 |
CN111925751B (zh) | 2022-10-04 |
CN108603082A (zh) | 2018-09-28 |
KR102160439B1 (ko) | 2020-09-28 |
US11359117B2 (en) | 2022-06-14 |
EP3415582A4 (en) | 2019-09-11 |
EP3415582A1 (en) | 2018-12-19 |
JP6902827B2 (ja) | 2021-07-14 |
US11939492B2 (en) | 2024-03-26 |
TW202120654A (zh) | 2021-06-01 |
US20190031928A1 (en) | 2019-01-31 |
WO2017137796A8 (ja) | 2017-09-14 |
KR20180100190A (ko) | 2018-09-07 |
TW201739877A (zh) | 2017-11-16 |
TWI720078B (zh) | 2021-03-01 |
US20220275258A1 (en) | 2022-09-01 |
CN108603082B (zh) | 2020-08-18 |
KR20200111833A (ko) | 2020-09-29 |
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