KR20160075845A - 양면에 칩이 장착되는 웨이퍼를 제작하기 위한 방법 - Google Patents

양면에 칩이 장착되는 웨이퍼를 제작하기 위한 방법 Download PDF

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Publication number
KR20160075845A
KR20160075845A KR1020167016168A KR20167016168A KR20160075845A KR 20160075845 A KR20160075845 A KR 20160075845A KR 1020167016168 A KR1020167016168 A KR 1020167016168A KR 20167016168 A KR20167016168 A KR 20167016168A KR 20160075845 A KR20160075845 A KR 20160075845A
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South Korea
Prior art keywords
wafer
adhesive layer
rigid carrier
product wafer
product
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Korean (ko)
Inventor
쥐르겐 부르그라프
마르커스 빔플링거
해럴드 비에스바우어
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에베 그룹 에. 탈너 게엠베하
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Publication of KR20160075845A publication Critical patent/KR20160075845A/ko
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0652—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
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    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

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US20130011997A1 (en) 2013-01-10
EP2553719B1 (de) 2019-12-04
SG183820A1 (en) 2012-10-30
CN102812546B (zh) 2015-08-26
JP2013524493A (ja) 2013-06-17
CN102812546A (zh) 2012-12-05
TWI518758B (zh) 2016-01-21
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US9224630B2 (en) 2015-12-29
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KR20170042817A (ko) 2017-04-19

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