JP2013504886A5 - - Google Patents

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Publication number
JP2013504886A5
JP2013504886A5 JP2012529193A JP2012529193A JP2013504886A5 JP 2013504886 A5 JP2013504886 A5 JP 2013504886A5 JP 2012529193 A JP2012529193 A JP 2012529193A JP 2012529193 A JP2012529193 A JP 2012529193A JP 2013504886 A5 JP2013504886 A5 JP 2013504886A5
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JP
Japan
Prior art keywords
opening
conductive
forming
plating seed
seed layer
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JP2012529193A
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English (en)
Japanese (ja)
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JP5444471B2 (ja
JP2013504886A (ja
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Priority claimed from US12/560,878 external-priority patent/US7956463B2/en
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Publication of JP2013504886A publication Critical patent/JP2013504886A/ja
Publication of JP2013504886A5 publication Critical patent/JP2013504886A5/ja
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Publication of JP5444471B2 publication Critical patent/JP5444471B2/ja
Expired - Fee Related legal-status Critical Current
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JP2012529193A 2009-09-16 2010-08-25 相互接続構造およびこれを形成する方法（細い相互接続開口のための導電性構造） Expired - Fee Related JP5444471B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/560,878 US7956463B2 (en) 2009-09-16 2009-09-16 Large grain size conductive structure for narrow interconnect openings
US12/560,878 2009-09-16
PCT/EP2010/062407 WO2011032812A1 (en) 2009-09-16 2010-08-25 Conductive structure for narrow interconnect openings

Publications (3)

Publication Number Publication Date
JP2013504886A JP2013504886A (ja) 2013-02-07
JP2013504886A5 true JP2013504886A5 (enExample) 2013-10-03
JP5444471B2 JP5444471B2 (ja) 2014-03-19

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Family Applications (1)

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JP2012529193A Expired - Fee Related JP5444471B2 (ja) 2009-09-16 2010-08-25 相互接続構造およびこれを形成する方法（細い相互接続開口のための導電性構造）

Country Status (7)

Country Link
US (1) US7956463B2 (enExample)
JP (1) JP5444471B2 (enExample)
CN (1) CN102498560A (enExample)
DE (1) DE112010003659T5 (enExample)
GB (1) GB2485689B (enExample)
TW (1) TWI497673B (enExample)
WO (1) WO2011032812A1 (enExample)

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