JP2012528357A5 - - Google Patents

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Publication number
JP2012528357A5
JP2012528357A5 JP2012513096A JP2012513096A JP2012528357A5 JP 2012528357 A5 JP2012528357 A5 JP 2012528357A5 JP 2012513096 A JP2012513096 A JP 2012513096A JP 2012513096 A JP2012513096 A JP 2012513096A JP 2012528357 A5 JP2012528357 A5 JP 2012528357A5
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JP
Japan
Prior art keywords
speed
mask
image
photosensitive material
along
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JP2012513096A
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English (en)
Japanese (ja)
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JP5690334B2 (ja
JP2012528357A (ja
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Priority claimed from US12/472,618 external-priority patent/US8339573B2/en
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Publication of JP2012528357A publication Critical patent/JP2012528357A/ja
Publication of JP2012528357A5 publication Critical patent/JP2012528357A5/ja
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Publication of JP5690334B2 publication Critical patent/JP5690334B2/ja
Expired - Fee Related legal-status Critical Current
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JP2012513096A 2009-05-27 2010-05-13 基板をフォトイメージングする方法及び装置 Expired - Fee Related JP5690334B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/472,618 US8339573B2 (en) 2009-05-27 2009-05-27 Method and apparatus for photoimaging a substrate
US12/472,618 2009-05-27
PCT/US2010/034707 WO2010138312A1 (en) 2009-05-27 2010-05-13 Method and apparatus for photoimaging a substrate

Publications (3)

Publication Number Publication Date
JP2012528357A JP2012528357A (ja) 2012-11-12
JP2012528357A5 true JP2012528357A5 (enExample) 2013-06-27
JP5690334B2 JP5690334B2 (ja) 2015-03-25

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JP2012513096A Expired - Fee Related JP5690334B2 (ja) 2009-05-27 2010-05-13 基板をフォトイメージングする方法及び装置

Country Status (7)

Country Link
US (1) US8339573B2 (enExample)
EP (1) EP2435881A1 (enExample)
JP (1) JP5690334B2 (enExample)
KR (1) KR20120018200A (enExample)
CN (1) CN102460306B (enExample)
SG (1) SG175986A1 (enExample)
WO (1) WO2010138312A1 (enExample)

Families Citing this family (13)

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JP6056770B2 (ja) * 2011-12-20 2017-01-11 株式会社ニコン 基板処理装置、デバイス製造システム、及びデバイス製造方法
CN103057256B (zh) * 2012-06-21 2015-12-09 深圳市众立生包装科技有限公司 一种高精度印刷系统和印刷方法
JP5963194B2 (ja) * 2012-07-17 2016-08-03 株式会社ブイ・テクノロジー 露光装置
CN106415193B (zh) * 2014-03-21 2019-08-09 卡尔佩迪姆技术有限公司 用于在柔性基板上制造微型结构的系统和方法
JP6510768B2 (ja) * 2014-05-23 2019-05-08 株式会社オーク製作所 露光装置
CN110297403B (zh) * 2014-09-04 2023-07-28 株式会社尼康 处理系统
CN107077080B (zh) * 2015-01-15 2019-04-26 株式会社村田制作所 曝光装置
KR102288354B1 (ko) * 2015-08-10 2021-08-11 삼성디스플레이 주식회사 플렉서블 디스플레이 장치의 제조 방법
CN105549340B (zh) * 2016-02-24 2017-10-24 上海大学 卷对卷柔性衬底光刻方法和装置
JP6332482B2 (ja) * 2017-01-13 2018-05-30 株式会社ニコン 基板処理装置
CN110275388A (zh) * 2018-03-17 2019-09-24 深圳市深龙杰科技有限公司 一种固体介质光学成像的方法
JP7089920B2 (ja) * 2018-03-29 2022-06-23 株式会社オーク製作所 露光装置
DE102019128198B3 (de) * 2019-10-18 2021-02-25 Laser Imaging Systems Gmbh Vorrichtung zur Mustereinbringung mittels Strahlung an einem aufgewickelten Endlossubstrat

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