JP2011523224A - 基板上に電子回路を形成するためのプラント - Google Patents

基板上に電子回路を形成するためのプラント Download PDF

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Publication number
JP2011523224A
JP2011523224A JP2011512998A JP2011512998A JP2011523224A JP 2011523224 A JP2011523224 A JP 2011523224A JP 2011512998 A JP2011512998 A JP 2011512998A JP 2011512998 A JP2011512998 A JP 2011512998A JP 2011523224 A JP2011523224 A JP 2011523224A
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Japan
Prior art keywords
substrate
disposed
support surface
cluster tool
substrate support
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Ceased
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JP2011512998A
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English (en)
Japanese (ja)
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JP2011523224A5 (https=
Inventor
アンドレア バッチーニ，
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アプライド マテリアルズ イタリア エス． アール． エル．
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Application filed by アプライド マテリアルズ イタリア エス． アール． エル． filed Critical アプライド マテリアルズ イタリア エス． アール． エル．
Publication of JP2011523224A publication Critical patent/JP2011523224A/ja
Publication of JP2011523224A5 publication Critical patent/JP2011523224A5/ja
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4418—Methods for making free-standing articles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Solid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2011512998A 2008-06-13 2009-06-12 基板上に電子回路を形成するためのプラント Ceased JP2011523224A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITUD2008A000136 2008-06-13
IT000136A ITUD20080136A1 (it) 2008-06-13 2008-06-13 Impianto per la lavorazione di piastre per circuiti elettronici
PCT/EP2009/057317 WO2009150239A1 (en) 2008-06-13 2009-06-12 Plant for forming electronic circuits on substrates

Publications (2)

Publication Number Publication Date
JP2011523224A true JP2011523224A (ja) 2011-08-04
JP2011523224A5 JP2011523224A5 (https=) 2012-07-26

Family

ID=40302209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011512998A Ceased JP2011523224A (ja) 2008-06-13 2009-06-12 基板上に電子回路を形成するためのプラント

Country Status (7)

Country Link
US (1) US20110165316A1 (https=)
EP (1) EP2304073A1 (https=)
JP (1) JP2011523224A (https=)
KR (1) KR20110022051A (https=)
CN (1) CN102076881B (https=)
IT (1) ITUD20080136A1 (https=)
WO (1) WO2009150239A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013137285A (ja) * 2011-12-28 2013-07-11 Advantest Corp ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2013137284A (ja) * 2011-12-28 2013-07-11 Advantest Corp 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2022544866A (ja) * 2019-10-07 2022-10-21 ピンク ゲーエムベーハー テルモジステーメ 電子アセンブリを接続するためのシステム及び方法
JP2023502353A (ja) * 2019-11-25 2023-01-24 ソイテック ２枚の基板を接合するための方法

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US20090308860A1 (en) * 2008-06-11 2009-12-17 Applied Materials, Inc. Short thermal profile oven useful for screen printing
US9090114B1 (en) * 2010-09-08 2015-07-28 Brian A Stumm Machine including LED-based UV radiation sources to process coatings
ITUD20110164A1 (it) * 2011-10-14 2013-04-15 Applied Materials Italia Srl Impianto e procedimento per la produzione di moduli fotovoltaici
WO2013103609A1 (en) * 2012-01-03 2013-07-11 Applied Materials, Inc. Advanced platform for passivating crystalline silicon solar cells
NL2009147C2 (nl) * 2012-07-06 2014-01-07 Fico Bv Inrichting en werkwijze voor het separeren, ten minste gedeeltelijk drogen en inspecteren van elektronische componenten.
DE102013104577B3 (de) * 2013-05-03 2014-07-24 Heraeus Noblelight Gmbh Vorrichtung zum Trocknen und Sintern metallhaltiger Tinte auf einem Substrat
CN104461153A (zh) * 2014-12-23 2015-03-25 合肥鑫晟光电科技有限公司 Ogs触摸屏及其制作装置和方法
ITUB20152223A1 (it) * 2015-07-16 2017-01-16 Eles Semiconductor Equipment S P A Sistema di test integrato
CN107393850A (zh) * 2017-08-16 2017-11-24 君泰创新（北京）科技有限公司 太阳能电池浆料的干燥方法及系统
CN111129222B (zh) * 2019-12-24 2021-07-20 浙江芯能光伏科技股份有限公司 一种太阳能多晶硅片的生产装置
MY209872A (en) * 2021-01-29 2025-08-08 Pink Gmbh Thermosysteme System and method for connecting electronic assemblies
US11970303B2 (en) * 2022-01-26 2024-04-30 The Procter & Gamble Company Infrared-assisted shrink wrap product bundling

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0469713A (ja) * 1990-07-11 1992-03-04 Hitachi Ltd 自走台車及び半導体製造ライン
JPH0477444U (https=) * 1990-11-16 1992-07-07
JPH06168874A (ja) * 1992-11-30 1994-06-14 Dainippon Printing Co Ltd 半導体装置の製造方法
JPH0858062A (ja) * 1994-08-19 1996-03-05 Nippon Bunka Seiko Kk Ｃｄ多色印刷装置
JPH0878834A (ja) * 1994-09-05 1996-03-22 Matsushita Electric Ind Co Ltd クリーム半田印刷装置
JPH11238776A (ja) * 1998-02-20 1999-08-31 Hirata Corp 基板製造ラインおよび基板製造方法
JP2000151070A (ja) * 1998-11-05 2000-05-30 Kyoei Sangyo Kk 多面付けプリント配線板の不良面マーキング装置
JP2000236008A (ja) * 1999-02-15 2000-08-29 Mitsubishi Electric Corp ウエハ自動搬送システムにおける搬送制御方法
JP2001315310A (ja) * 2000-05-09 2001-11-13 Matsushita Electric Ind Co Ltd スクリーン印刷装置
JP2002225221A (ja) * 2001-02-02 2002-08-14 Matsushita Electric Ind Co Ltd スクリーン印刷機及びスクリーン印刷方法
JP2003243474A (ja) * 2002-02-15 2003-08-29 Tokyo Electron Ltd 無人搬送車システム
JP2004304085A (ja) * 2003-04-01 2004-10-28 Renesas Technology Corp 半導体装置の製造方法
JP2006140394A (ja) * 2004-11-15 2006-06-01 Seiko Epson Corp パターン形成方法、回路基板、パターン形成装置及び電子機器

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US6336204B1 (en) * 1998-05-07 2002-01-01 Applied Materials, Inc. Method and apparatus for handling deadlocks in multiple chamber cluster tools
US6841033B2 (en) * 2001-03-21 2005-01-11 Nordson Corporation Material handling system and method for a multi-workpiece plasma treatment system
US20030013285A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Method of processing and plating wafers and other planar articles
US6996448B2 (en) * 2003-12-02 2006-02-07 Taiwan Semiconductor Manufacturing Co., Ltd. Transport system with multiple-load-port stockers
EP1902462B1 (en) * 2005-07-13 2012-06-13 Fujifilm Dimatix, Inc. Fluid deposition cluster tool
US8398355B2 (en) * 2006-05-26 2013-03-19 Brooks Automation, Inc. Linearly distributed semiconductor workpiece processing tool

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0469713A (ja) * 1990-07-11 1992-03-04 Hitachi Ltd 自走台車及び半導体製造ライン
JPH0477444U (https=) * 1990-11-16 1992-07-07
JPH06168874A (ja) * 1992-11-30 1994-06-14 Dainippon Printing Co Ltd 半導体装置の製造方法
JPH0858062A (ja) * 1994-08-19 1996-03-05 Nippon Bunka Seiko Kk Ｃｄ多色印刷装置
JPH0878834A (ja) * 1994-09-05 1996-03-22 Matsushita Electric Ind Co Ltd クリーム半田印刷装置
JPH11238776A (ja) * 1998-02-20 1999-08-31 Hirata Corp 基板製造ラインおよび基板製造方法
JP2000151070A (ja) * 1998-11-05 2000-05-30 Kyoei Sangyo Kk 多面付けプリント配線板の不良面マーキング装置
JP2000236008A (ja) * 1999-02-15 2000-08-29 Mitsubishi Electric Corp ウエハ自動搬送システムにおける搬送制御方法
JP2001315310A (ja) * 2000-05-09 2001-11-13 Matsushita Electric Ind Co Ltd スクリーン印刷装置
JP2002225221A (ja) * 2001-02-02 2002-08-14 Matsushita Electric Ind Co Ltd スクリーン印刷機及びスクリーン印刷方法
JP2003243474A (ja) * 2002-02-15 2003-08-29 Tokyo Electron Ltd 無人搬送車システム
JP2004304085A (ja) * 2003-04-01 2004-10-28 Renesas Technology Corp 半導体装置の製造方法
JP2006140394A (ja) * 2004-11-15 2006-06-01 Seiko Epson Corp パターン形成方法、回路基板、パターン形成装置及び電子機器

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013137285A (ja) * 2011-12-28 2013-07-11 Advantest Corp ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2013137284A (ja) * 2011-12-28 2013-07-11 Advantest Corp 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
US9069010B2 (en) 2011-12-28 2015-06-30 Advantest Corporation Pitch changing apparatus, electronic device handling apparatus, and electronic device testing apparatus
US9340361B2 (en) 2011-12-28 2016-05-17 Advantest Corporation Electronic device transfer apparatus, electronic device handling apparatus, and electronic device testing apparatus
US9586760B2 (en) 2011-12-28 2017-03-07 Advantest Corporation Electronic component transfer shuttle
JP2022544866A (ja) * 2019-10-07 2022-10-21 ピンク ゲーエムベーハー テルモジステーメ 電子アセンブリを接続するためのシステム及び方法
JP7278482B2 (ja) 2019-10-07 2023-05-19 ピンク ゲーエムベーハー テルモジステーメ 電子アセンブリを接続するためのシステム及び方法
JP2023502353A (ja) * 2019-11-25 2023-01-24 ソイテック ２枚の基板を接合するための方法
JP7585320B2 (ja) 2019-11-25 2024-11-18 ソイテック ２枚の基板を接合するための方法

Also Published As

Publication number Publication date
EP2304073A1 (en) 2011-04-06
US20110165316A1 (en) 2011-07-07
KR20110022051A (ko) 2011-03-04
WO2009150239A1 (en) 2009-12-17
CN102076881B (zh) 2014-03-26
CN102076881A (zh) 2011-05-25
ITUD20080136A1 (it) 2009-12-14

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