ITUD20080136A1 - Impianto per la lavorazione di piastre per circuiti elettronici - Google Patents
Impianto per la lavorazione di piastre per circuiti elettroniciInfo
- Publication number
- ITUD20080136A1 ITUD20080136A1 IT000136A ITUD20080136A ITUD20080136A1 IT UD20080136 A1 ITUD20080136 A1 IT UD20080136A1 IT 000136 A IT000136 A IT 000136A IT UD20080136 A ITUD20080136 A IT UD20080136A IT UD20080136 A1 ITUD20080136 A1 IT UD20080136A1
- Authority
- IT
- Italy
- Prior art keywords
- plant
- electronic circuits
- processing plates
- plates
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4418—Methods for making free-standing articles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Solid Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000136A ITUD20080136A1 (it) | 2008-06-13 | 2008-06-13 | Impianto per la lavorazione di piastre per circuiti elettronici |
US12/997,698 US20110165316A1 (en) | 2008-06-13 | 2009-06-12 | Plant for forming electronic circuits on substrates |
PCT/EP2009/057317 WO2009150239A1 (en) | 2008-06-13 | 2009-06-12 | Plant for forming electronic circuits on substrates |
KR1020117000925A KR20110022051A (ko) | 2008-06-13 | 2009-06-12 | 기판상에 전자 회로를 형성하기 위한 플랜트 |
JP2011512998A JP2011523224A (ja) | 2008-06-13 | 2009-06-12 | 基板上に電子回路を形成するためのプラント |
EP09761800A EP2304073A1 (en) | 2008-06-13 | 2009-06-12 | Plant for forming electronic circuits on substrates |
CN200980124530.4A CN102076881B (zh) | 2008-06-13 | 2009-06-12 | 用于在衬底上形成电子电路的装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000136A ITUD20080136A1 (it) | 2008-06-13 | 2008-06-13 | Impianto per la lavorazione di piastre per circuiti elettronici |
Publications (1)
Publication Number | Publication Date |
---|---|
ITUD20080136A1 true ITUD20080136A1 (it) | 2009-12-14 |
Family
ID=40302209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT000136A ITUD20080136A1 (it) | 2008-06-13 | 2008-06-13 | Impianto per la lavorazione di piastre per circuiti elettronici |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110165316A1 (it) |
EP (1) | EP2304073A1 (it) |
JP (1) | JP2011523224A (it) |
KR (1) | KR20110022051A (it) |
CN (1) | CN102076881B (it) |
IT (1) | ITUD20080136A1 (it) |
WO (1) | WO2009150239A1 (it) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090308860A1 (en) * | 2008-06-11 | 2009-12-17 | Applied Materials, Inc. | Short thermal profile oven useful for screen printing |
US9090114B1 (en) * | 2010-09-08 | 2015-07-28 | Brian A Stumm | Machine including LED-based UV radiation sources to process coatings |
ITUD20110164A1 (it) * | 2011-10-14 | 2013-04-15 | Applied Materials Italia Srl | Impianto e procedimento per la produzione di moduli fotovoltaici |
JP2013137285A (ja) * | 2011-12-28 | 2013-07-11 | Advantest Corp | ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置 |
JP2013137284A (ja) * | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
WO2013103609A1 (en) * | 2012-01-03 | 2013-07-11 | Applied Materials, Inc. | Advanced platform for passivating crystalline silicon solar cells |
NL2009147C2 (nl) | 2012-07-06 | 2014-01-07 | Fico Bv | Inrichting en werkwijze voor het separeren, ten minste gedeeltelijk drogen en inspecteren van elektronische componenten. |
DE102013104577B3 (de) * | 2013-05-03 | 2014-07-24 | Heraeus Noblelight Gmbh | Vorrichtung zum Trocknen und Sintern metallhaltiger Tinte auf einem Substrat |
CN104461153A (zh) * | 2014-12-23 | 2015-03-25 | 合肥鑫晟光电科技有限公司 | Ogs触摸屏及其制作装置和方法 |
ITUB20152223A1 (it) * | 2015-07-16 | 2017-01-16 | Eles Semiconductor Equipment S P A | Sistema di test integrato |
CN107393850A (zh) * | 2017-08-16 | 2017-11-24 | 君泰创新(北京)科技有限公司 | 太阳能电池浆料的干燥方法及系统 |
ES2968179T3 (es) * | 2019-10-07 | 2024-05-08 | Pink Gmbh Thermosysteme | Instalación y procedimiento para unir conjuntos electrónicos |
CN111129222B (zh) * | 2019-12-24 | 2021-07-20 | 浙江芯能光伏科技股份有限公司 | 一种太阳能多晶硅片的生产装置 |
JP7502836B2 (ja) | 2021-01-29 | 2024-06-19 | ピンク ゲーエムベーハー テルモジステーメ | 電子アセンブリを接続するシステムおよび方法 |
US11970303B2 (en) * | 2022-01-26 | 2024-04-30 | The Procter & Gamble Company | Infrared-assisted shrink wrap product bundling |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0469713A (ja) * | 1990-07-11 | 1992-03-04 | Hitachi Ltd | 自走台車及び半導体製造ライン |
JPH0717480Y2 (ja) * | 1990-11-16 | 1995-04-26 | 東海商事株式会社 | 全自動スクリーン印刷機のワーク搬送装置 |
JPH06168874A (ja) * | 1992-11-30 | 1994-06-14 | Dainippon Printing Co Ltd | 半導体装置の製造方法 |
JPH0858062A (ja) * | 1994-08-19 | 1996-03-05 | Nippon Bunka Seiko Kk | Cd多色印刷装置 |
JP3073403B2 (ja) * | 1994-09-05 | 2000-08-07 | 松下電器産業株式会社 | クリーム半田印刷装置 |
JPH11238776A (ja) * | 1998-02-20 | 1999-08-31 | Hirata Corp | 基板製造ラインおよび基板製造方法 |
US6336204B1 (en) * | 1998-05-07 | 2002-01-01 | Applied Materials, Inc. | Method and apparatus for handling deadlocks in multiple chamber cluster tools |
JP2000151070A (ja) * | 1998-11-05 | 2000-05-30 | Kyoei Sangyo Kk | 多面付けプリント配線板の不良面マーキング装置 |
JP2000236008A (ja) * | 1999-02-15 | 2000-08-29 | Mitsubishi Electric Corp | ウエハ自動搬送システムにおける搬送制御方法 |
JP3758463B2 (ja) * | 2000-05-09 | 2006-03-22 | 松下電器産業株式会社 | スクリーン印刷の検査方法 |
JP2002225221A (ja) * | 2001-02-02 | 2002-08-14 | Matsushita Electric Ind Co Ltd | スクリーン印刷機及びスクリーン印刷方法 |
US6841033B2 (en) * | 2001-03-21 | 2005-01-11 | Nordson Corporation | Material handling system and method for a multi-workpiece plasma treatment system |
US20030013285A1 (en) * | 2001-07-16 | 2003-01-16 | Gramarossa Daniel J. | Method of processing and plating wafers and other planar articles |
JP4234934B2 (ja) * | 2002-02-15 | 2009-03-04 | 東京エレクトロン株式会社 | 無人搬送車システム |
JP2004304085A (ja) * | 2003-04-01 | 2004-10-28 | Renesas Technology Corp | 半導体装置の製造方法 |
US6996448B2 (en) * | 2003-12-02 | 2006-02-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Transport system with multiple-load-port stockers |
JP2006140394A (ja) * | 2004-11-15 | 2006-06-01 | Seiko Epson Corp | パターン形成方法、回路基板、パターン形成装置及び電子機器 |
EP1902462B1 (en) * | 2005-07-13 | 2012-06-13 | Fujifilm Dimatix, Inc. | Fluid deposition cluster tool |
US8398355B2 (en) * | 2006-05-26 | 2013-03-19 | Brooks Automation, Inc. | Linearly distributed semiconductor workpiece processing tool |
-
2008
- 2008-06-13 IT IT000136A patent/ITUD20080136A1/it unknown
-
2009
- 2009-06-12 CN CN200980124530.4A patent/CN102076881B/zh not_active Expired - Fee Related
- 2009-06-12 US US12/997,698 patent/US20110165316A1/en not_active Abandoned
- 2009-06-12 WO PCT/EP2009/057317 patent/WO2009150239A1/en active Application Filing
- 2009-06-12 EP EP09761800A patent/EP2304073A1/en not_active Withdrawn
- 2009-06-12 JP JP2011512998A patent/JP2011523224A/ja not_active Ceased
- 2009-06-12 KR KR1020117000925A patent/KR20110022051A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2009150239A1 (en) | 2009-12-17 |
US20110165316A1 (en) | 2011-07-07 |
CN102076881A (zh) | 2011-05-25 |
CN102076881B (zh) | 2014-03-26 |
EP2304073A1 (en) | 2011-04-06 |
JP2011523224A (ja) | 2011-08-04 |
KR20110022051A (ko) | 2011-03-04 |
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