JP2011523224A5 - - Google Patents

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Publication number
JP2011523224A5
JP2011523224A5 JP2011512998A JP2011512998A JP2011523224A5 JP 2011523224 A5 JP2011523224 A5 JP 2011523224A5 JP 2011512998 A JP2011512998 A JP 2011512998A JP 2011512998 A JP2011512998 A JP 2011512998A JP 2011523224 A5 JP2011523224 A5 JP 2011523224A5
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JP
Japan
Prior art keywords
substrate
disposed
support surface
transfer element
substrate support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2011512998A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011523224A (ja
Filing date
Publication date
Priority claimed from IT000136A external-priority patent/ITUD20080136A1/it
Application filed filed Critical
Publication of JP2011523224A publication Critical patent/JP2011523224A/ja
Publication of JP2011523224A5 publication Critical patent/JP2011523224A5/ja
Ceased legal-status Critical Current

Links

JP2011512998A 2008-06-13 2009-06-12 基板上に電子回路を形成するためのプラント Ceased JP2011523224A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ITUD2008A000136 2008-06-13
IT000136A ITUD20080136A1 (it) 2008-06-13 2008-06-13 Impianto per la lavorazione di piastre per circuiti elettronici
PCT/EP2009/057317 WO2009150239A1 (en) 2008-06-13 2009-06-12 Plant for forming electronic circuits on substrates

Publications (2)

Publication Number Publication Date
JP2011523224A JP2011523224A (ja) 2011-08-04
JP2011523224A5 true JP2011523224A5 (https=) 2012-07-26

Family

ID=40302209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011512998A Ceased JP2011523224A (ja) 2008-06-13 2009-06-12 基板上に電子回路を形成するためのプラント

Country Status (7)

Country Link
US (1) US20110165316A1 (https=)
EP (1) EP2304073A1 (https=)
JP (1) JP2011523224A (https=)
KR (1) KR20110022051A (https=)
CN (1) CN102076881B (https=)
IT (1) ITUD20080136A1 (https=)
WO (1) WO2009150239A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090308860A1 (en) * 2008-06-11 2009-12-17 Applied Materials, Inc. Short thermal profile oven useful for screen printing
US9090114B1 (en) * 2010-09-08 2015-07-28 Brian A Stumm Machine including LED-based UV radiation sources to process coatings
ITUD20110164A1 (it) * 2011-10-14 2013-04-15 Applied Materials Italia Srl Impianto e procedimento per la produzione di moduli fotovoltaici
JP2013137284A (ja) * 2011-12-28 2013-07-11 Advantest Corp 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2013137285A (ja) 2011-12-28 2013-07-11 Advantest Corp ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置
WO2013103609A1 (en) * 2012-01-03 2013-07-11 Applied Materials, Inc. Advanced platform for passivating crystalline silicon solar cells
NL2009147C2 (nl) * 2012-07-06 2014-01-07 Fico Bv Inrichting en werkwijze voor het separeren, ten minste gedeeltelijk drogen en inspecteren van elektronische componenten.
DE102013104577B3 (de) * 2013-05-03 2014-07-24 Heraeus Noblelight Gmbh Vorrichtung zum Trocknen und Sintern metallhaltiger Tinte auf einem Substrat
CN104461153A (zh) * 2014-12-23 2015-03-25 合肥鑫晟光电科技有限公司 Ogs触摸屏及其制作装置和方法
ITUB20152223A1 (it) * 2015-07-16 2017-01-16 Eles Semiconductor Equipment S P A Sistema di test integrato
CN107393850A (zh) * 2017-08-16 2017-11-24 君泰创新（北京）科技有限公司 太阳能电池浆料的干燥方法及系统
KR102547210B1 (ko) * 2019-10-07 2023-06-26 핑크 게엠베하 써모시스테메 전자 조립체를 연결하기 위한 시스템 및 방법
FR3103629B1 (fr) * 2019-11-25 2021-10-22 Soitec Silicon On Insulator Procédé de collage de deux substrats
CN111129222B (zh) * 2019-12-24 2021-07-20 浙江芯能光伏科技股份有限公司 一种太阳能多晶硅片的生产装置
MY209872A (en) * 2021-01-29 2025-08-08 Pink Gmbh Thermosysteme System and method for connecting electronic assemblies
US11970303B2 (en) * 2022-01-26 2024-04-30 The Procter & Gamble Company Infrared-assisted shrink wrap product bundling

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0469713A (ja) * 1990-07-11 1992-03-04 Hitachi Ltd 自走台車及び半導体製造ライン
JPH0717480Y2 (ja) * 1990-11-16 1995-04-26 東海商事株式会社 全自動スクリーン印刷機のワーク搬送装置
JPH06168874A (ja) * 1992-11-30 1994-06-14 Dainippon Printing Co Ltd 半導体装置の製造方法
JPH0858062A (ja) * 1994-08-19 1996-03-05 Nippon Bunka Seiko Kk Ｃｄ多色印刷装置
JP3073403B2 (ja) * 1994-09-05 2000-08-07 松下電器産業株式会社 クリーム半田印刷装置
JPH11238776A (ja) * 1998-02-20 1999-08-31 Hirata Corp 基板製造ラインおよび基板製造方法
US6336204B1 (en) * 1998-05-07 2002-01-01 Applied Materials, Inc. Method and apparatus for handling deadlocks in multiple chamber cluster tools
JP2000151070A (ja) * 1998-11-05 2000-05-30 Kyoei Sangyo Kk 多面付けプリント配線板の不良面マーキング装置
JP2000236008A (ja) * 1999-02-15 2000-08-29 Mitsubishi Electric Corp ウエハ自動搬送システムにおける搬送制御方法
JP3758463B2 (ja) * 2000-05-09 2006-03-22 松下電器産業株式会社 スクリーン印刷の検査方法
JP2002225221A (ja) * 2001-02-02 2002-08-14 Matsushita Electric Ind Co Ltd スクリーン印刷機及びスクリーン印刷方法
US6841033B2 (en) * 2001-03-21 2005-01-11 Nordson Corporation Material handling system and method for a multi-workpiece plasma treatment system
US20030013285A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Method of processing and plating wafers and other planar articles
JP4234934B2 (ja) * 2002-02-15 2009-03-04 東京エレクトロン株式会社 無人搬送車システム
JP2004304085A (ja) * 2003-04-01 2004-10-28 Renesas Technology Corp 半導体装置の製造方法
US6996448B2 (en) * 2003-12-02 2006-02-07 Taiwan Semiconductor Manufacturing Co., Ltd. Transport system with multiple-load-port stockers
JP2006140394A (ja) * 2004-11-15 2006-06-01 Seiko Epson Corp パターン形成方法、回路基板、パターン形成装置及び電子機器
EP1902462B1 (en) * 2005-07-13 2012-06-13 Fujifilm Dimatix, Inc. Fluid deposition cluster tool
US8398355B2 (en) * 2006-05-26 2013-03-19 Brooks Automation, Inc. Linearly distributed semiconductor workpiece processing tool

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