ITUD20080136A1 - Impianto per la lavorazione di piastre per circuiti elettronici - Google Patents

Impianto per la lavorazione di piastre per circuiti elettronici

Info

Publication number
ITUD20080136A1
ITUD20080136A1 IT000136A ITUD20080136A ITUD20080136A1 IT UD20080136 A1 ITUD20080136 A1 IT UD20080136A1 IT 000136 A IT000136 A IT 000136A IT UD20080136 A ITUD20080136 A IT UD20080136A IT UD20080136 A1 ITUD20080136 A1 IT UD20080136A1
Authority
IT
Italy
Prior art keywords
plant
electronic circuits
processing plates
plates
processing
Prior art date
Application number
IT000136A
Other languages
English (en)
Italian (it)
Inventor
Andrea Baccini
Original Assignee
Baccini S P A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baccini S P A filed Critical Baccini S P A
Priority to IT000136A priority Critical patent/ITUD20080136A1/it
Priority to US12/997,698 priority patent/US20110165316A1/en
Priority to KR1020117000925A priority patent/KR20110022051A/ko
Priority to PCT/EP2009/057317 priority patent/WO2009150239A1/en
Priority to CN200980124530.4A priority patent/CN102076881B/zh
Priority to JP2011512998A priority patent/JP2011523224A/ja
Priority to EP09761800A priority patent/EP2304073A1/en
Publication of ITUD20080136A1 publication Critical patent/ITUD20080136A1/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4418—Methods for making free-standing articles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Solid Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
IT000136A 2008-06-13 2008-06-13 Impianto per la lavorazione di piastre per circuiti elettronici ITUD20080136A1 (it)

Priority Applications (7)

Application Number Priority Date Filing Date Title
IT000136A ITUD20080136A1 (it) 2008-06-13 2008-06-13 Impianto per la lavorazione di piastre per circuiti elettronici
US12/997,698 US20110165316A1 (en) 2008-06-13 2009-06-12 Plant for forming electronic circuits on substrates
KR1020117000925A KR20110022051A (ko) 2008-06-13 2009-06-12 기판상에 전자 회로를 형성하기 위한 플랜트
PCT/EP2009/057317 WO2009150239A1 (en) 2008-06-13 2009-06-12 Plant for forming electronic circuits on substrates
CN200980124530.4A CN102076881B (zh) 2008-06-13 2009-06-12 用于在衬底上形成电子电路的装置
JP2011512998A JP2011523224A (ja) 2008-06-13 2009-06-12 基板上に電子回路を形成するためのプラント
EP09761800A EP2304073A1 (en) 2008-06-13 2009-06-12 Plant for forming electronic circuits on substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000136A ITUD20080136A1 (it) 2008-06-13 2008-06-13 Impianto per la lavorazione di piastre per circuiti elettronici

Publications (1)

Publication Number Publication Date
ITUD20080136A1 true ITUD20080136A1 (it) 2009-12-14

Family

ID=40302209

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000136A ITUD20080136A1 (it) 2008-06-13 2008-06-13 Impianto per la lavorazione di piastre per circuiti elettronici

Country Status (7)

Country Link
US (1) US20110165316A1 (https=)
EP (1) EP2304073A1 (https=)
JP (1) JP2011523224A (https=)
KR (1) KR20110022051A (https=)
CN (1) CN102076881B (https=)
IT (1) ITUD20080136A1 (https=)
WO (1) WO2009150239A1 (https=)

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* Cited by examiner, † Cited by third party
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US20090308860A1 (en) * 2008-06-11 2009-12-17 Applied Materials, Inc. Short thermal profile oven useful for screen printing
US9090114B1 (en) * 2010-09-08 2015-07-28 Brian A Stumm Machine including LED-based UV radiation sources to process coatings
ITUD20110164A1 (it) * 2011-10-14 2013-04-15 Applied Materials Italia Srl Impianto e procedimento per la produzione di moduli fotovoltaici
JP2013137284A (ja) * 2011-12-28 2013-07-11 Advantest Corp 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置
JP2013137285A (ja) 2011-12-28 2013-07-11 Advantest Corp ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置
WO2013103609A1 (en) * 2012-01-03 2013-07-11 Applied Materials, Inc. Advanced platform for passivating crystalline silicon solar cells
NL2009147C2 (nl) * 2012-07-06 2014-01-07 Fico Bv Inrichting en werkwijze voor het separeren, ten minste gedeeltelijk drogen en inspecteren van elektronische componenten.
DE102013104577B3 (de) * 2013-05-03 2014-07-24 Heraeus Noblelight Gmbh Vorrichtung zum Trocknen und Sintern metallhaltiger Tinte auf einem Substrat
CN104461153A (zh) * 2014-12-23 2015-03-25 合肥鑫晟光电科技有限公司 Ogs触摸屏及其制作装置和方法
ITUB20152223A1 (it) * 2015-07-16 2017-01-16 Eles Semiconductor Equipment S P A Sistema di test integrato
CN107393850A (zh) * 2017-08-16 2017-11-24 君泰创新（北京）科技有限公司 太阳能电池浆料的干燥方法及系统
KR102547210B1 (ko) * 2019-10-07 2023-06-26 핑크 게엠베하 써모시스테메 전자 조립체를 연결하기 위한 시스템 및 방법
FR3103629B1 (fr) * 2019-11-25 2021-10-22 Soitec Silicon On Insulator Procédé de collage de deux substrats
CN111129222B (zh) * 2019-12-24 2021-07-20 浙江芯能光伏科技股份有限公司 一种太阳能多晶硅片的生产装置
MY209872A (en) * 2021-01-29 2025-08-08 Pink Gmbh Thermosysteme System and method for connecting electronic assemblies
US11970303B2 (en) * 2022-01-26 2024-04-30 The Procter & Gamble Company Infrared-assisted shrink wrap product bundling

Family Cites Families (19)

* Cited by examiner, † Cited by third party
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JPH0469713A (ja) * 1990-07-11 1992-03-04 Hitachi Ltd 自走台車及び半導体製造ライン
JPH0717480Y2 (ja) * 1990-11-16 1995-04-26 東海商事株式会社 全自動スクリーン印刷機のワーク搬送装置
JPH06168874A (ja) * 1992-11-30 1994-06-14 Dainippon Printing Co Ltd 半導体装置の製造方法
JPH0858062A (ja) * 1994-08-19 1996-03-05 Nippon Bunka Seiko Kk Ｃｄ多色印刷装置
JP3073403B2 (ja) * 1994-09-05 2000-08-07 松下電器産業株式会社 クリーム半田印刷装置
JPH11238776A (ja) * 1998-02-20 1999-08-31 Hirata Corp 基板製造ラインおよび基板製造方法
US6336204B1 (en) * 1998-05-07 2002-01-01 Applied Materials, Inc. Method and apparatus for handling deadlocks in multiple chamber cluster tools
JP2000151070A (ja) * 1998-11-05 2000-05-30 Kyoei Sangyo Kk 多面付けプリント配線板の不良面マーキング装置
JP2000236008A (ja) * 1999-02-15 2000-08-29 Mitsubishi Electric Corp ウエハ自動搬送システムにおける搬送制御方法
JP3758463B2 (ja) * 2000-05-09 2006-03-22 松下電器産業株式会社 スクリーン印刷の検査方法
JP2002225221A (ja) * 2001-02-02 2002-08-14 Matsushita Electric Ind Co Ltd スクリーン印刷機及びスクリーン印刷方法
US6841033B2 (en) * 2001-03-21 2005-01-11 Nordson Corporation Material handling system and method for a multi-workpiece plasma treatment system
US20030013285A1 (en) * 2001-07-16 2003-01-16 Gramarossa Daniel J. Method of processing and plating wafers and other planar articles
JP4234934B2 (ja) * 2002-02-15 2009-03-04 東京エレクトロン株式会社 無人搬送車システム
JP2004304085A (ja) * 2003-04-01 2004-10-28 Renesas Technology Corp 半導体装置の製造方法
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Also Published As

Publication number Publication date
EP2304073A1 (en) 2011-04-06
US20110165316A1 (en) 2011-07-07
KR20110022051A (ko) 2011-03-04
WO2009150239A1 (en) 2009-12-17
CN102076881B (zh) 2014-03-26
CN102076881A (zh) 2011-05-25
JP2011523224A (ja) 2011-08-04

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