SI2143139T1 - Hladilna doza za komponente ali vezja - Google Patents

Hladilna doza za komponente ali vezja

Info

Publication number
SI2143139T1
SI2143139T1 SI200832089T SI200832089T SI2143139T1 SI 2143139 T1 SI2143139 T1 SI 2143139T1 SI 200832089 T SI200832089 T SI 200832089T SI 200832089 T SI200832089 T SI 200832089T SI 2143139 T1 SI2143139 T1 SI 2143139T1
Authority
SI
Slovenia
Prior art keywords
circuits
components
cooling box
cooling
box
Prior art date
Application number
SI200832089T
Other languages
English (en)
Inventor
Claus Peter Kluge
Original Assignee
Ceram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceram Gmbh filed Critical Ceram Gmbh
Publication of SI2143139T1 publication Critical patent/SI2143139T1/sl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D27/00—Lighting arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SI200832089T 2007-04-26 2008-04-17 Hladilna doza za komponente ali vezja SI2143139T1 (sl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007020170 2007-04-26
EP08736309.9A EP2143139B1 (de) 2007-04-26 2008-04-17 Kühldose für bauelemente oder schaltungen
PCT/EP2008/054641 WO2008132056A1 (de) 2007-04-26 2008-04-17 Kühldose für bauelemente oder schaltungen

Publications (1)

Publication Number Publication Date
SI2143139T1 true SI2143139T1 (sl) 2019-11-29

Family

ID=39590489

Family Applications (1)

Application Number Title Priority Date Filing Date
SI200832089T SI2143139T1 (sl) 2007-04-26 2008-04-17 Hladilna doza za komponente ali vezja

Country Status (11)

Country Link
US (2) US8630092B2 (sl)
EP (2) EP2535928A3 (sl)
JP (2) JP2010526427A (sl)
KR (2) KR20150036793A (sl)
CN (1) CN101689537B (sl)
AU (1) AU2008244383B2 (sl)
DE (1) DE102008001230A1 (sl)
DK (1) DK2143139T3 (sl)
HU (1) HUE046347T2 (sl)
SI (1) SI2143139T1 (sl)
WO (1) WO2008132056A1 (sl)

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CN103672521B (zh) * 2013-12-20 2016-09-14 陈琦 一种双向调配光模组
CN103672523B (zh) * 2013-12-23 2015-12-30 天津中环电子照明科技有限公司 带应急功能的led面包灯
CN103672522B (zh) * 2013-12-23 2015-11-25 天津中环电子照明科技有限公司 智能镜面led平板灯
CN203827682U (zh) * 2014-04-24 2014-09-10 中兴通讯股份有限公司 一种移动通信终端
EP3224566A1 (de) * 2014-11-24 2017-10-04 CeramTec GmbH Thermomanagement im bereich e-mobility
DE102015106552B4 (de) 2015-04-28 2022-06-30 Infineon Technologies Ag Elektronisches Modul mit Fluid-Kühlkanal und Verfahren zum Herstellen desselben
DE102015107489B4 (de) 2015-05-12 2020-07-02 Infineon Technologies Ag Verfahren zur Reduzierung des Schichtwiderstands in einer elektronischen Vorrichtung
FR3046022B1 (fr) * 2015-12-17 2019-06-28 Valeo Siemens Eautomotive France Sas Circuit de refroidissement et dispositif electrique comprenant le circuit de refroidissement
DK3206468T3 (en) 2016-02-15 2019-04-01 Siemens Ag DC converter with DC voltage
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CN109413932A (zh) * 2017-08-18 2019-03-01 鹏鼎控股(深圳)股份有限公司 散热结构及其制作方法
WO2020196334A1 (ja) * 2019-03-22 2020-10-01 日立化成株式会社 冷却構造体
CN112444098A (zh) * 2020-10-08 2021-03-05 中山市光大光学仪器有限公司 一种冷却台及其急速冷却方法
CN114699874B (zh) * 2020-12-16 2023-04-07 上海协微环境科技有限公司 一种反应副产品收集系统及方法
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Also Published As

Publication number Publication date
DE102008001230A1 (de) 2008-10-30
AU2008244383A1 (en) 2008-11-06
HUE046347T2 (hu) 2020-02-28
JP2014160873A (ja) 2014-09-04
EP2535928A3 (de) 2014-08-20
EP2143139B1 (de) 2019-06-19
AU2008244383B2 (en) 2013-05-30
KR20150036793A (ko) 2015-04-07
WO2008132056A1 (de) 2008-11-06
CN101689537A (zh) 2010-03-31
EP2143139A1 (de) 2010-01-13
JP2010526427A (ja) 2010-07-29
DK2143139T3 (da) 2019-09-23
US20140104811A1 (en) 2014-04-17
KR20100017414A (ko) 2010-02-16
EP2535928A2 (de) 2012-12-19
US8630092B2 (en) 2014-01-14
CN101689537B (zh) 2013-08-21
US20100163210A1 (en) 2010-07-01

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