HUE046347T2 - Hûtõdoboz alkatrészek vagy kapcsolások számára - Google Patents

Hûtõdoboz alkatrészek vagy kapcsolások számára

Info

Publication number
HUE046347T2
HUE046347T2 HUE08736309A HUE08736309A HUE046347T2 HU E046347 T2 HUE046347 T2 HU E046347T2 HU E08736309 A HUE08736309 A HU E08736309A HU E08736309 A HUE08736309 A HU E08736309A HU E046347 T2 HUE046347 T2 HU E046347T2
Authority
HU
Hungary
Prior art keywords
circuits
components
cooling box
cooling
box
Prior art date
Application number
HUE08736309A
Other languages
English (en)
Inventor
Claus Peter Kluge
Original Assignee
Ceram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceram Gmbh filed Critical Ceram Gmbh
Publication of HUE046347T2 publication Critical patent/HUE046347T2/hu

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D27/00—Lighting arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
HUE08736309A 2007-04-26 2008-04-17 Hûtõdoboz alkatrészek vagy kapcsolások számára HUE046347T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007020170 2007-04-26

Publications (1)

Publication Number Publication Date
HUE046347T2 true HUE046347T2 (hu) 2020-02-28

Family

ID=39590489

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE08736309A HUE046347T2 (hu) 2007-04-26 2008-04-17 Hûtõdoboz alkatrészek vagy kapcsolások számára

Country Status (11)

Country Link
US (2) US8630092B2 (hu)
EP (2) EP2143139B1 (hu)
JP (2) JP2010526427A (hu)
KR (2) KR20100017414A (hu)
CN (1) CN101689537B (hu)
AU (1) AU2008244383B2 (hu)
DE (1) DE102008001230A1 (hu)
DK (1) DK2143139T3 (hu)
HU (1) HUE046347T2 (hu)
SI (1) SI2143139T1 (hu)
WO (1) WO2008132056A1 (hu)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100017260A (ko) * 2007-04-24 2010-02-16 세람텍 아게 비-시트형의 하나 이상의 성분을 구비하는 복합체를 제조하는 방법
KR20100017414A (ko) * 2007-04-26 2010-02-16 세람텍 아게 구성 요소 또는 회로용 냉각 박스
DE102009036122B4 (de) * 2009-08-05 2011-07-21 BJB GmbH & Co. KG, 59755 Lampensockel und Lampenfassung
RU2013147870A (ru) * 2011-03-29 2015-05-10 Керамтек Гмбх Изготовленные литьем под давлением корпуса светильников с керамическими охладителями и светодиодами
JP5447433B2 (ja) * 2011-05-13 2014-03-19 株式会社安川電機 電子機器および電子機器が設けられた電力変換装置
CN102270679A (zh) * 2011-07-28 2011-12-07 容云 支撑件、支撑组件及太阳能光伏集光器与led发光装置
CN102270690A (zh) * 2011-07-28 2011-12-07 容云 太阳能利用装置
WO2013061409A1 (ja) * 2011-10-25 2013-05-02 富士通株式会社 水冷装置、水冷装置を有する電子機器、及び水冷方法
JP5714119B2 (ja) * 2011-10-28 2015-05-07 京セラ株式会社 流路部材、これを用いた熱交換器および半導体装置ならびに半導体製造装置
US9255741B2 (en) * 2012-01-26 2016-02-09 Lear Corporation Cooled electric assembly
CN102748624A (zh) * 2012-06-28 2012-10-24 王干 一种长度可调拔插式led灯管装置
KR101375956B1 (ko) * 2012-07-05 2014-03-18 엘에스산전 주식회사 자동차용 전장부품 박스
DE102012106244B4 (de) * 2012-07-11 2020-02-20 Rogers Germany Gmbh Metall-Keramik-Substrat
JP6094015B2 (ja) * 2013-04-12 2017-03-15 ホシデン株式会社 端子ボックス
RU2657120C2 (ru) * 2013-05-02 2018-06-08 Конинклейке Филипс Н.В. Охлаждающее устройство для охлаждения лазерной установки и лазерная система, содержащая охлаждающие устройства
JP6164304B2 (ja) * 2013-11-28 2017-07-19 富士電機株式会社 半導体モジュール用冷却器の製造方法、半導体モジュール用冷却器、半導体モジュール及び電気駆動車両
CN103672515B (zh) * 2013-12-10 2016-02-03 林英强 一种高效散热的led灯泡
CN103672516B (zh) * 2013-12-11 2016-08-17 佛山市大明照明电器有限公司 一种led灯及控制系统
FR3015178B1 (fr) * 2013-12-13 2016-01-01 Sagemcom Broadband Sas Equipement electronique a double refroidissement
CN103672520B (zh) * 2013-12-18 2016-01-13 宁波市柯玛士电器实业有限公司 一种led感应灯
CN103672521B (zh) * 2013-12-20 2016-09-14 陈琦 一种双向调配光模组
CN103672523B (zh) * 2013-12-23 2015-12-30 天津中环电子照明科技有限公司 带应急功能的led面包灯
CN103672522B (zh) * 2013-12-23 2015-11-25 天津中环电子照明科技有限公司 智能镜面led平板灯
CN203827682U (zh) * 2014-04-24 2014-09-10 中兴通讯股份有限公司 一种移动通信终端
WO2016083301A1 (de) * 2014-11-24 2016-06-02 Ceramtec Gmbh Thermomanagement im bereich e-mobility
DE102015106552B4 (de) * 2015-04-28 2022-06-30 Infineon Technologies Ag Elektronisches Modul mit Fluid-Kühlkanal und Verfahren zum Herstellen desselben
DE102015107489B4 (de) 2015-05-12 2020-07-02 Infineon Technologies Ag Verfahren zur Reduzierung des Schichtwiderstands in einer elektronischen Vorrichtung
FR3046022B1 (fr) * 2015-12-17 2019-06-28 Valeo Siemens Eautomotive France Sas Circuit de refroidissement et dispositif electrique comprenant le circuit de refroidissement
DK3206468T3 (en) 2016-02-15 2019-04-01 Siemens Ag DC converter with DC voltage
DE102017003854A1 (de) * 2017-04-20 2018-10-25 Leopold Kostal Gmbh & Co. Kg Gehäuse für ein elektrisches oder elektronisches Gerät
CN109413932A (zh) * 2017-08-18 2019-03-01 鹏鼎控股(深圳)股份有限公司 散热结构及其制作方法
US20220149692A1 (en) * 2019-03-22 2022-05-12 Showa Denko Materials Co., Ltd. Cooling structure
CN112444098A (zh) * 2020-10-08 2021-03-05 中山市光大光学仪器有限公司 一种冷却台及其急速冷却方法
CN114699874B (zh) * 2020-12-16 2023-04-07 上海协微环境科技有限公司 一种反应副产品收集系统及方法
DE102021109617A1 (de) 2021-04-16 2022-10-20 Bayerische Motoren Werke Aktiengesellschaft Kühlvorrichtung und Verfahren zum Herstellen einer Kühlvorrichtung
CN114964473A (zh) * 2022-05-20 2022-08-30 东风汽车集团股份有限公司 一种用于振动传感器的热隔离装置

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3604074A1 (de) * 1986-02-08 1987-08-13 Bosch Gmbh Robert Zuendschaltgeraet
DE3709200A1 (de) * 1987-03-20 1988-09-29 Heraeus Gmbh W C Elektronisches bauteil
US5001299A (en) * 1989-04-17 1991-03-19 Explosive Fabricators, Inc. Explosively formed electronic packages
DE9110268U1 (de) 1991-02-23 1991-11-07 ABB Patent GmbH, 6800 Mannheim Anordnung mit flüssigkeitsgekühltem, elektrischem Leistungswiderstand
DE9201158U1 (de) 1992-01-31 1992-03-26 ABB Patent GmbH, 6800 Mannheim Flüssigkeitskühldose aus zwei Keramikdosenhälften
DE29514012U1 (de) 1994-08-03 1995-11-02 ANCeram GmbH & Co KG, 95463 Bindlach Halbzeug aus einer Aluminiumnitridkeramik als Träger mit einer auf mindestens einer seiner Flächen aufgebrachten Leitschicht
JPH08139480A (ja) * 1994-11-08 1996-05-31 Mitsubishi Materials Corp ヒートパイプ構造を有する放熱性セラミック基板
US5566055A (en) * 1995-03-03 1996-10-15 Parker-Hannifin Corporation Shieled enclosure for electronics
DE19527674C2 (de) 1995-07-31 2000-11-02 Anceram Gmbh & Co Kg Kühleinrichtung
DE19643717A1 (de) 1996-10-23 1998-04-30 Asea Brown Boveri Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
US6136128A (en) * 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
AU2001253818A1 (en) * 2000-02-14 2001-08-20 Christina Alvarez Security module system, apparatus and process
EP1225633A1 (de) 2001-01-22 2002-07-24 ABB Schweiz AG Heat sink for cooling a power semiconductor device and method of manufacturing such a heat sink
JP3773797B2 (ja) * 2001-03-02 2006-05-10 三洋電機株式会社 コールドプレートの連結構造及び連結方法
JP3556175B2 (ja) * 2001-03-09 2004-08-18 株式会社日立製作所 半導体モジュール及び電力変換装置
JP2002329938A (ja) * 2001-04-27 2002-11-15 Kyocera Corp セラミック回路基板
DE10334354B4 (de) 2002-07-25 2016-12-22 Gva Leistungselektronik Gmbh Anordnung, enthaltend einen Flüssigkeitskühler und ein Leistungshalbleiter-Element
JP2004116871A (ja) * 2002-09-25 2004-04-15 Sony Corp 熱輸送体および熱輸送体を有する電子機器
JP4325263B2 (ja) * 2003-04-21 2009-09-02 ソニー株式会社 回路装置及び電子機器
US7129422B2 (en) * 2003-06-19 2006-10-31 Wavezero, Inc. EMI absorbing shielding for a printed circuit board
JP4543279B2 (ja) 2004-03-31 2010-09-15 Ｄｏｗａメタルテック株式会社 アルミニウム接合部材の製造方法
US6989991B2 (en) * 2004-05-18 2006-01-24 Raytheon Company Thermal management system and method for electronic equipment mounted on coldplates
JP4549759B2 (ja) 2004-07-08 2010-09-22 富士通株式会社 冷却モジュール
JP2006066464A (ja) * 2004-08-24 2006-03-09 Toyota Industries Corp 半導体装置
US7168152B1 (en) * 2004-10-18 2007-01-30 Lockheed Martin Corporation Method for making an integrated active antenna element
JP4710460B2 (ja) * 2005-07-20 2011-06-29 株式会社村田製作所 セラミック多層基板、その製造方法、およびパワー半導体モジュール
US7551439B2 (en) * 2006-03-28 2009-06-23 Delphi Technologies, Inc. Fluid cooled electronic assembly
US8157001B2 (en) * 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US8004860B2 (en) * 2006-08-29 2011-08-23 Texas Instruments Incorporated Radiofrequency and electromagnetic interference shielding
JP5112101B2 (ja) * 2007-02-15 2013-01-09 株式会社東芝 半導体パッケージ
KR20100017414A (ko) * 2007-04-26 2010-02-16 세람텍 아게 구성 요소 또는 회로용 냉각 박스
US8031485B2 (en) * 2007-09-07 2011-10-04 Autosplice, Inc. Electronic shielding apparatus and methods
US7916484B2 (en) * 2007-11-14 2011-03-29 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity
EP2220430A4 (en) * 2007-11-19 2010-12-22 Nexxus Lighting Inc APPARATUS AND METHODS FOR THE THERMAL MANAGEMENT OF LIGHT EMITTING DIODES
EP2120263A4 (en) * 2007-11-30 2010-10-13 Panasonic Corp BASE PLATE FOR A HITZEABLEITENDE STRUCTURE, MODULE WITH THE BASE PLATE FOR THE HITZEABLEITENDE STRUCTURE AND METHOD FOR THE PRODUCTION OF THE BASE PLATE FOR THE HITZEABLEITENDE STRUCTURE
US7817428B2 (en) * 2008-06-27 2010-10-19 Greer Jr David Randall Enclosure with integrated heat wick
US8081467B2 (en) * 2008-08-20 2011-12-20 Sri Hermetics Inc. Electronics package including heat sink in the housing and related methods
US9196588B2 (en) * 2011-11-04 2015-11-24 Invensas Corporation EMI shield

Also Published As

Publication number Publication date
EP2535928A3 (de) 2014-08-20
EP2535928A2 (de) 2012-12-19
JP2014160873A (ja) 2014-09-04
JP2010526427A (ja) 2010-07-29
KR20150036793A (ko) 2015-04-07
CN101689537A (zh) 2010-03-31
DK2143139T3 (da) 2019-09-23
WO2008132056A1 (de) 2008-11-06
EP2143139B1 (de) 2019-06-19
EP2143139A1 (de) 2010-01-13
SI2143139T1 (sl) 2019-11-29
US20140104811A1 (en) 2014-04-17
US8630092B2 (en) 2014-01-14
KR20100017414A (ko) 2010-02-16
US20100163210A1 (en) 2010-07-01
AU2008244383A1 (en) 2008-11-06
CN101689537B (zh) 2013-08-21
AU2008244383B2 (en) 2013-05-30
DE102008001230A1 (de) 2008-10-30

Similar Documents

Publication Publication Date Title
HUE046347T2 (hu) Hûtõdoboz alkatrészek vagy kapcsolások számára
PL2091314T3 (pl) Układ chłodzenia dla sprzętu elektronicznego
GB2451708B (en) Cooling methods
EP2204081A4 (en) CONFIGURABLE HOUSING FOR ELECTRONIC COMPONENTS
EP1901599A4 (en) COOLER FOR CABINETS WITH HEATERS
EP2241417A4 (en) GLOVE BOX
EP2068359A4 (en) COOLER
EP2074295A4 (en) COOLING ARRANGEMENT
EP2131073A4 (en) COOLING CIRCUIT FOR HYDROSTATIC GEARBOX
EP2233861A4 (en) COOLER
GB0611264D0 (en) Film cooled component
EP2196649A4 (en) COOLING DEVICE FOR VEHICLE
EP2065935A4 (en) COOLER
GB0821784D0 (en) Cooling electronic circuits
GB0805661D0 (en) Condenser heatsink
TWI365390B (en) Layout circuit
GB0709562D0 (en) Cooling arrangement
IL173991A0 (en) Integrated cooling system
GB0622516D0 (en) Cooling arrangement for electronics
PL1987305T3 (pl) Urządzenie chłodzące
GB2436136B (en) Apparatus for cooling
EP2143313A4 (en) METHOD AND ARRANGEMENT FOR COOLING A DEVICE BOX
PL2168580T3 (pl) Środek do leczenia lub zapobiegania schizofrenii
GB0705050D0 (en) Cooling arrangement
GB201002489D0 (en) Boxes