WO2012105837A1 - Wafer inspection system - Google Patents

Wafer inspection system Download PDF

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Publication number
WO2012105837A1
WO2012105837A1 PCT/NL2012/050055 NL2012050055W WO2012105837A1 WO 2012105837 A1 WO2012105837 A1 WO 2012105837A1 NL 2012050055 W NL2012050055 W NL 2012050055W WO 2012105837 A1 WO2012105837 A1 WO 2012105837A1
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WO
WIPO (PCT)
Prior art keywords
wafer
assembly
endless belt
cassette
delivery end
Prior art date
Application number
PCT/NL2012/050055
Other languages
French (fr)
Inventor
Eduard Renier Francisca Clerkx
René Maria Wilhelmus ERNST
Original Assignee
Otb Solar B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otb Solar B.V. filed Critical Otb Solar B.V.
Publication of WO2012105837A1 publication Critical patent/WO2012105837A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Definitions

  • the invention relates to a wafer inspection system for inspecting wafers and for transporting wafers from a preceding unit to a subsequent unit.
  • wafer includes silicon wafers for the manufacture of photovoltaic cells and wafers for the manufacture of integrated circuits.
  • Manufacture of photovoltaic cells is performed in various steps.
  • One of the steps is the application of various layers on the main surface the thin silicon wafer.
  • An apparatus with which application of layers can be performed is described in EP- 1365040. From this layer application process, the wafers may be transported to another process, e.g. a screen printing process for applying a pattern of electrically conductive lines, for example, the fingers and bus bars or the like, on the front side and for applying a full metal contact on the back surface.
  • WO2011003484 describes an apparatus and methods of handling a damaged substrate in substrate processing systems, such as screen printing systems for solar cell devices.
  • the damaged substrate handling apparatus includes a container mounted centrally on a rotary actuator assembly.
  • a plurality of substrate supports are arranged around the periphery of the rotary actuator assembly. Damaged substrates are transferred to the container from the substrate supports.
  • the substrate support is a conveyor that completely supports the wafer over its entire surface. Consequently, even when the wafer were broken, the broken parts of it would remain on the substrate support. If the camera would indeed note a crack in the wafer, it would lead to removal of the wafer to container. Certainly, no wafer debris or scrap would fall off the substrate support downwardly in a container that is below the substrate support. On the conveyer substrate support no scrap remains because the conveyor is not endless but a web material that is unrolled from spool and taken-up by spool. In view thereof, remaining scrap is removed in a different manner than will be disclosed in this application.
  • the present invention is directed to a wafer inspection assembly that contributes to the reliability of the production system as a whole.
  • the invention provides a wafer inspection assembly for inspecting wafers and for transporting wafers from a preceding unit to a subsequent unit, the wafer inspection assembly including:
  • ⁇ at least one endless belt assembly that is connected to the frame and extends in a first direction and that includes:
  • At least two endless belts arranged so that a wafer can be placed on the at least two endless belts, the at least two endless belts defining a first delivery end and a second delivery end;
  • At least one drive motor arranged for driving the at least two endless belts in a first direction and in a second direction opposite to the first direction;
  • the wafer inspection assembly further including:
  • a processing unit configured for processing the signals obtained by the camera and configured for providing control signals that correspond with an approved wafer or, alternatively, a rejected wafer, which control signals are inputted to the controller for controlling the drive motor of the associated endless belt assembly, wherein dependent on the control signals, the controller controls the drive motor of the associated endless belt assembly for driving the at least two endless belts in the first direction in case the wafer is approved or, alternatively in the second direction in case the wafer is rejected.
  • Such a wafer inspection assembly is reliable because each wafer is supported by the at least two endless belts of the endless belt assembly and that provides a stable support for the wafer. During transfer of the wafer from the at least two endless belts to the subsequent unit or vice versa, the wafer is not taken up by a separate handling unit. In view thereof, no additional transfer of the wafer is necessary, thus reducing the risk of damage of the wafer.
  • the wafer inspection assembly also has the functionality of providing the possibility to inspect the wafer for breakage or other damage. Such an inspection may lead to approval or rejection of the wafer. In case of a rejected wafer, the wafer may be removed from the process by driving the at least two endless belts in the second direction until the wafer is dispatched in the scrap receiving unit.
  • the invention also provides a method for inspecting wafers, wherein the method includes:
  • controlling the drive motor of the associated endless belt assembly for driving the at least two endless belts thereof in the first direction in case the control signals correspond with an approved wafer until the wafer is transferred to a subsequent unit, or, alternatively, in the second direction in case the control signals correspond with a rejected wafer until the wafer is discharged from the at least two endless belts into the scrap receiving unit.
  • Fig. 1 shows a perspective view of an embodiment of the assembly according to the invention.
  • Fig. 2 shows a perspective view of a detail of Fig. 1.
  • the wafer inspection assembly 10 of which an example of an embodiment is shown in Fig. 1 and a part thereof in more detail in Fig. 2, is intended for inspecting wafers W and for transporting the wafers to a subsequent unit.
  • the subsequent unit may, for example, be a subsequent transporting assembly of a subsequent process assembly, such as for instance a screen printing process assembly.
  • the subsequent unit is a cassette 12.
  • the wafer inspection assembly 10 may be used to load wafers W into at least one cassette 12 and/or for unloading the wafers W from a cassette 12.
  • Such a cassette 12 may include a plurality of slots 12a.
  • Each slot 12a is configured to receive a wafer W.
  • the wafer inspection assembly 10 includes a frame 14 and at least one endless belt assembly 16 that is connected to the frame 14 and that extends in a first direction Dl. In the embodiment shown in Fig. 1, the assembly 10 includes three endless belt assemblies 16. It will be clear that less or more endless belt assemblies 16 are also feasible within the present disclosure.
  • Each endless belt assembly 16 includes at least two endless belts 18, 20 that are arranged so that a wafer W can be placed on the at least two endless belts 18, 20.
  • the at least two endless belts 18, 20 define a first delivery end 22 and a second delivery end 24.
  • Each endless belt assembly 16 further includes at least one drive motor 26 arranged for driving the at least two endless belts 18, 20 in a first direction Dl and in a second direction D2 opposite to the first direction Dl.
  • the upper surface of the individual endless belts may be small so that small scrap will automatically fall off an endless belt. Thus, the individual belts 18, 20 will remain clean.
  • the wafer inspection assembly 10 further may in an embodiment include a cassette carrying unit 28 having a cassette carrying table 30 that is positioned adjacent the first delivery ends 22.
  • a scrap receiving unit 32 is positioned adjacent the second delivery ends 24.
  • the wafer inspection assembly 10 additionally includes a scrap discharge assembly 34 that is positioned under the at least one endless belt assembly 16.
  • the vertical position of the cassette carrying table 30 may be adjustable relative to the first delivery end 22 of the at least one endless belt assembly 16.
  • a controller 36 is provided for controlling the drive motor 26 of the at least one endless belt assembly 16 and optionally for controlling the position of the cassette carrying table 30 relative to the first delivery end 22 of the at least one endless belt assembly 16.
  • the cassette carrying unit 28 may include a lift assembly that is configured to adjust the vertical position of the cassette carrying table 30.
  • the endless belt assemblies 16 could be arranged on a lift assembly and the carrying table 30 may be fixed. It is however advantageous that the carrying table 30 is mounted on a lifting assembly in view of the simplicity of the design of the cassette loading assembly 10.
  • the wafer inspection assembly 10 includes an inspection system 38, 40, 42.
  • the inspection system may include a camera 38 that is directed to an associated one of the at least one endless belt assembly 16.
  • the inspection system may also include a processing unit 40 that is configured for processing the signals obtained by the camera 38 and configured for providing control signals S that correspond with an approved wafer or, alternatively, a rejected wafer. These control signals S are inputted to the controller 36 for controlling the drive motor 26 of the associated endless belt assembly 16.
  • the controller 36 controls the drive motor 26 of the associated endless belt assembly 16 for driving the at least two endless belts 18, 20 in the first direction Dl in case the wafer W is approved or, alternatively in the second direction D2 in case the wafer W is rejected.
  • the inspection system 38, 40, 42 may include a wafer illumination assembly that includes at least one light source 42 that is directed to the at least one endless belt assembly 16.
  • the light source 42 may be positioned above the endless belt assemblies 16.
  • the scrap discharge assembly 34 mentioned above may in an embodiment include an endless conveyor belt 44 having a transport part 44' that extends under the at least one endless belt assembly 16.
  • the transport part 44' of the endless conveyor belt 44 of the scrap discharge assembly 34 includes a transport surface that extends substantially in a horizontal plane and has a transport direction (D3) that is substantially perpendicular to the first and the second direction Dl, D2 respectively.
  • the endless conveyor belt 44 of the scrap discharge assembly 34 may be transmissive for electromagnetic waves that are generated by the at least one light source 42 of the wafer illumination assembly and the at least one light source 42 may be positioned under the transport part 44' of the endless conveyor part 44.
  • the electromagnetic waves produces by the light source 42 may be in the visible spectrum or the infrared spectrum.
  • the cameras 38 of the inspection system 38, 40, 42 may be mounted above the endless belt assemblies 16 as shown in the exemplary embodiment of the figures.
  • the cameras 38 will obtain an image of the wafers W with a very strong contrast.
  • the wafers W include small cracks, it is highly likely that these cracks are indeed observed by the inspection system 38, 40, 42.
  • the contours of the wafer may be inspected by the camera.
  • the camera may also be embodied as an assembly of sensors.
  • the scrap discharge assembly 34 may include a waste tray 46 that is positioned under a discharge end 44a of the endless conveyor belt 44 of the scrap discharge assembly 34.
  • the two endless belts 18, 20 may be embodied as snares or may have a very limited width.
  • the two endless belts 18, 20 with the small width or with the snare configuration are advantageous because virtually no light is blocked by such narrow endless belts 18, 20.
  • an embodiment of the wafer inspection assembly 10 may be configured so that the position of the first delivery end 22 of an associated endless belt assembly 16 is adjustable in the first and the second direction Dl, D2 so that the first delivery end 22 is moveable to an extended position (as shown in the figures)and to a retracted position in which it is moved away from above the cassette carrying table 30.
  • the at least two endless belts 18, 20 of an associated endless belt assembly 16 may include an upper part that extends between and is guided over a first delivery end roller 48 and a second delivery end roller 50.
  • a lower part of the at least two endless belts 18, 20 may be guided in an S-configuration over a first guide roller 52 and a second guide roller 54.
  • the first guide roller 52 has a fixed distance relative to the first delivery end roller 48.
  • the second guide roller 54 has a fixed distance relative to the second delivery end roller 50.
  • the first delivery end roller 48 and the first guide roller 52 are mounted in a guide carriage 56 that is moveable relative to the frame 14 in the first and the second direction Dl, D2 for bringing the first delivery end 22 from the retracted position to the extended position and vice versa.
  • the following method may be used. In a first phase of the method, the wafer inspection assembly 10 as described in the claims and/or here above as well as wafers W are provided.
  • At least one wafer W to be inspected is placed on the associated endless belt assembly 16.
  • the wafers W may, for example, be coming from a preceding processing assembly such as a layer application processing assembly.
  • the placement of the wafers W may, for example, be done by a handler, a belt conveyor or a similar transport assembly.
  • the wafer W that is placed on the associated belt assembly 16 is inspected with the camera 38.
  • the signals obtained by the camera 38 are processed by the processing unit 40 and the processing unit 40 generates control signals S that correspond with an approved wafer W or, alternatively, a rejected wafer W.
  • the control signals S are inputted to the controller 36 for controlling the drive motor 26 of the associated endless belt assembly 16.
  • the drive motor 26 of the associated endless belt assembly 16 is controlled by the controller 36 for driving the at least two endless belts 18, 20 thereof in the first direction Dl in case the control signals S correspond with an approved wafer W until the wafer is transferred to the subsequent unit, or, alternatively, in the second direction D2 in case the control signals S correspond with a rejected wafer W until the wafer W is discharged from the at least two endless belts 18, 20 into the scrap receiving unit 32.
  • the method may include that at least one cassette 12 is provided and placed on the cassette carrying table 30 of the cassette carrying unit 28. Subsequently, the position of the cassette carrying table 30 may be adjusted relative to the associated first delivery end 22 of the endless belt assembly 16 so that a slot 12a of the plurality of slots 12a is positioned in alignment with the at least two endless belts 18, 20 of the endless belt assembly 16. Next, the at least two endless belts 18, 20 of the endless belt assembly 16 may be driven in the first direction Dl to move the wafer W in the associated slot 12a of the cassette 12.
  • the cassette carrying table 30 is moved relative to the associated first delivery end 22 of the endless belt assembly 16 so that a subsequent slot 12a directly below the slot 12a that carries the wafer W is positioned in alignment with the at least two endless belts 18, 20 of the endless belt assembly 16. Also a subsequent wafer W may be placed on the at least two endless belts 18, 20 of the endless belt assembly 16. Subsequently, the next loading step may be performed by driving the drive motor 26 so that wafer W moves in the first direction Dl until the wafer W is received in the slot 12a of the cassette 12.
  • the method may additionally include that the first delivery end 22 is brought from the retracted position to the extended position after the cassette 12 has been placed on the carrying table 30.
  • the first delivery end 22 is brought from the retracted position to the extended position after the cassette 12 has been placed on the carrying table 30.
  • the method may include that the at least one cassette 12 with wafers W is placed on the cassette carrying table 30 of the cassette carrying unit 28.
  • the position of the cassette carrying table 30 is adjusted relative to the associated first delivery end 22 of the endless belt assembly 16 so that a first delivery end 22 of an associated endless belt assembly 16 engages a lower one of the wafers W in the associated cassette 12.
  • the at least two endless belts 18, 20 of the endless belt assembly 16 is driven in the second direction D2 to move the wafer W out of the associated slot 12a of the cassette 12 onto the at least two endless belts 18, 20 of the associated endless belt assembly 16.
  • a handler, a conveyor or similar transport assembly may be used to transport the wafer to a subsequent processing assembly, such as for instance a screen print assembly for applying contacts, bus bars, and fingers on the wafer W.
  • the wafer inspection assembly 10 is a relatively simple and reliable device for inspecting wafers W and for reliably transporting wafers W to a subsequent unit, e.g. a transporting unit of a subsequent process or a cassette 12.
  • the inspection and the transportation may be performed with a minimum of transfers of the wafers W. Because the wafers W are supported by endless belts 18, 20 during the entire loading or unloading process, the chance of breakage of the wafers W is minimized. In the embodiment with the extendible and retractable first delivery end 22, the wafers W are even supported by the at least two endless belts 18, 20 when the wafer W has been moved in the confinement of the cassette 12 or to the subsequent unit. Thus, rubbing of the wafers W along the top wall of the slots 12a of the cassette 12 may be prevented. Consequently, the chance of damaging the wafers W can be minimized.

Abstract

A wafer inspection assembly for loading wafers into at least one cassette and/or for unloading wafers from at least one cassette, each cassette including a plurality of slots, each slot being configured to receive a wafer. The cassette loading assembly includes a frame and at least one endless belt assembly that is connected to the frame. Also provided are a cassette carrying unit having a cassette carrying table that is positioned adjacent the at least one first delivery end, a scrap receiving unit that is positioned adjacent the at least one second delivery end, and a scrap discharge assembly that is positioned under the at least one endless belt assembly. A controller is provided for controlling a drive motor of the endless belt assembly and for controlling the position of the cassette carrying table relative to the first delivery end.

Description

Title: Wafer inspection system
The invention relates to a wafer inspection system for inspecting wafers and for transporting wafers from a preceding unit to a subsequent unit. In this context the term "wafer" includes silicon wafers for the manufacture of photovoltaic cells and wafers for the manufacture of integrated circuits.
Especially, with mass production of photovoltaic cells, handling of wafers is delicate and the chance of breakage of the wafers is always present. Manufacture of photovoltaic cells is performed in various steps. One of the steps is the application of various layers on the main surface the thin silicon wafer. An apparatus with which application of layers can be performed is described in EP- 1365040. From this layer application process, the wafers may be transported to another process, e.g. a screen printing process for applying a pattern of electrically conductive lines, for example, the fingers and bus bars or the like, on the front side and for applying a full metal contact on the back surface.
WO2011003484 describes an apparatus and methods of handling a damaged substrate in substrate processing systems, such as screen printing systems for solar cell devices. The damaged substrate handling apparatus includes a container mounted centrally on a rotary actuator assembly. A plurality of substrate supports are arranged around the periphery of the rotary actuator assembly. Damaged substrates are transferred to the container from the substrate supports. In WO'484 the substrate support is a conveyor that completely supports the wafer over its entire surface. Consequently, even when the wafer were broken, the broken parts of it would remain on the substrate support. If the camera would indeed note a crack in the wafer, it would lead to removal of the wafer to container. Certainly, no wafer debris or scrap would fall off the substrate support downwardly in a container that is below the substrate support. On the conveyer substrate support no scrap remains because the conveyor is not endless but a web material that is unrolled from spool and taken-up by spool. In view thereof, remaining scrap is removed in a different manner than will be disclosed in this application.
In general, it can be stated that between the various process steps that wafers are subjected to, the wafers have to be transported. Such a transport can reliably be done in cassettes. These cassettes are known from practice.
The present invention is directed to a wafer inspection assembly that contributes to the reliability of the production system as a whole.
To that end the invention provides a wafer inspection assembly for inspecting wafers and for transporting wafers from a preceding unit to a subsequent unit, the wafer inspection assembly including:
• a frame;
· at least one endless belt assembly that is connected to the frame and extends in a first direction and that includes:
o at least two endless belts arranged so that a wafer can be placed on the at least two endless belts, the at least two endless belts defining a first delivery end and a second delivery end;
o at least one drive motor arranged for driving the at least two endless belts in a first direction and in a second direction opposite to the first direction;
the wafer inspection assembly further including:
· a scrap receiving unit that is positioned adjacent the at least one second delivery end;
• a scrap discharge assembly that is positioned under the at least one endless belt assembly;
• a controller for controlling the drive motor of the at least one endless belt assembly; • an inspection system that includes:
o a camera that is directed to an associated one of the at least one endless belt assembly; and
o a processing unit configured for processing the signals obtained by the camera and configured for providing control signals that correspond with an approved wafer or, alternatively, a rejected wafer, which control signals are inputted to the controller for controlling the drive motor of the associated endless belt assembly, wherein dependent on the control signals, the controller controls the drive motor of the associated endless belt assembly for driving the at least two endless belts in the first direction in case the wafer is approved or, alternatively in the second direction in case the wafer is rejected.
Such a wafer inspection assembly is reliable because each wafer is supported by the at least two endless belts of the endless belt assembly and that provides a stable support for the wafer. During transfer of the wafer from the at least two endless belts to the subsequent unit or vice versa, the wafer is not taken up by a separate handling unit. In view thereof, no additional transfer of the wafer is necessary, thus reducing the risk of damage of the wafer.
The wafer inspection assembly also has the functionality of providing the possibility to inspect the wafer for breakage or other damage. Such an inspection may lead to approval or rejection of the wafer. In case of a rejected wafer, the wafer may be removed from the process by driving the at least two endless belts in the second direction until the wafer is dispatched in the scrap receiving unit.
The invention also provides a method for inspecting wafers, wherein the method includes:
• providing a wafer inspection assembly according to the invention; • providing wafers;
• inspecting the wafer that is placed on the associated belt assembly with the camera;
• processing the signals obtained by the camera and generating control signals that correspond with an approved wafer or, alternatively, a rejected wafer;
• inputting the control signals to the controller for controlling the drive motor of the associated endless belt assembly;
• controlling the drive motor of the associated endless belt assembly for driving the at least two endless belts thereof in the first direction in case the control signals correspond with an approved wafer until the wafer is transferred to a subsequent unit, or, alternatively, in the second direction in case the control signals correspond with a rejected wafer until the wafer is discharged from the at least two endless belts into the scrap receiving unit.
Such a method has the same advantages as those described in relating to the wafer inspection assembly. Further elaborations of the wafer inspection assembly and of the methods are described in the dependent claims and will be further elucidated in the detailed description.
Fig. 1 shows a perspective view of an embodiment of the assembly according to the invention; and
Fig. 2 shows a perspective view of a detail of Fig. 1.
Generally, the wafer inspection assembly 10, of which an example of an embodiment is shown in Fig. 1 and a part thereof in more detail in Fig. 2, is intended for inspecting wafers W and for transporting the wafers to a subsequent unit. The subsequent unit may, for example, be a subsequent transporting assembly of a subsequent process assembly, such as for instance a screen printing process assembly. In the exemplary embodiment that is shown in Fig. 1, the subsequent unit is a cassette 12. In the non-limiting exemplary embodiment with the cassette 12 as a subsequent unit, the wafer inspection assembly 10 may be used to load wafers W into at least one cassette 12 and/or for unloading the wafers W from a cassette 12. Such a cassette 12 may include a plurality of slots 12a. Each slot 12a is configured to receive a wafer W. The wafer inspection assembly 10 includes a frame 14 and at least one endless belt assembly 16 that is connected to the frame 14 and that extends in a first direction Dl. In the embodiment shown in Fig. 1, the assembly 10 includes three endless belt assemblies 16. It will be clear that less or more endless belt assemblies 16 are also feasible within the present disclosure. Each endless belt assembly 16 includes at least two endless belts 18, 20 that are arranged so that a wafer W can be placed on the at least two endless belts 18, 20. The at least two endless belts 18, 20 define a first delivery end 22 and a second delivery end 24. Each endless belt assembly 16 further includes at least one drive motor 26 arranged for driving the at least two endless belts 18, 20 in a first direction Dl and in a second direction D2 opposite to the first direction Dl. The upper surface of the individual endless belts may be small so that small scrap will automatically fall off an endless belt. Thus, the individual belts 18, 20 will remain clean. The wafer inspection assembly 10 further may in an embodiment include a cassette carrying unit 28 having a cassette carrying table 30 that is positioned adjacent the first delivery ends 22. A scrap receiving unit 32 is positioned adjacent the second delivery ends 24. The wafer inspection assembly 10 additionally includes a scrap discharge assembly 34 that is positioned under the at least one endless belt assembly 16. The vertical position of the cassette carrying table 30 may be adjustable relative to the first delivery end 22 of the at least one endless belt assembly 16. A controller 36 is provided for controlling the drive motor 26 of the at least one endless belt assembly 16 and optionally for controlling the position of the cassette carrying table 30 relative to the first delivery end 22 of the at least one endless belt assembly 16.
In an embodiment, the cassette carrying unit 28 may include a lift assembly that is configured to adjust the vertical position of the cassette carrying table 30. In an alternative embodiment, the endless belt assemblies 16 could be arranged on a lift assembly and the carrying table 30 may be fixed. It is however advantageous that the carrying table 30 is mounted on a lifting assembly in view of the simplicity of the design of the cassette loading assembly 10.
In order to be able to inspect the wafers W before the next process step is initiated, the wafer inspection assembly 10 includes an inspection system 38, 40, 42. The inspection system may include a camera 38 that is directed to an associated one of the at least one endless belt assembly 16. The inspection system may also include a processing unit 40 that is configured for processing the signals obtained by the camera 38 and configured for providing control signals S that correspond with an approved wafer or, alternatively, a rejected wafer. These control signals S are inputted to the controller 36 for controlling the drive motor 26 of the associated endless belt assembly 16.
Dependent on the control signals S, the controller 36 controls the drive motor 26 of the associated endless belt assembly 16 for driving the at least two endless belts 18, 20 in the first direction Dl in case the wafer W is approved or, alternatively in the second direction D2 in case the wafer W is rejected.
In an embodiment, of which an example is shown in the figures, the inspection system 38, 40, 42 may include a wafer illumination assembly that includes at least one light source 42 that is directed to the at least one endless belt assembly 16.
In one example, the light source 42 may be positioned above the endless belt assemblies 16. Another example will be discussed below with reference to the exemplary embodiment shown in the figures. The scrap discharge assembly 34 mentioned above may in an embodiment include an endless conveyor belt 44 having a transport part 44' that extends under the at least one endless belt assembly 16. The transport part 44' of the endless conveyor belt 44 of the scrap discharge assembly 34 includes a transport surface that extends substantially in a horizontal plane and has a transport direction (D3) that is substantially perpendicular to the first and the second direction Dl, D2 respectively.
In an embodiment including a light source 42 for the inspection system 38, 40, 42 and an a scrap discharge assembly 34 with an endless conveyor belt 44, the endless conveyor belt 44 of the scrap discharge assembly 34 may be transmissive for electromagnetic waves that are generated by the at least one light source 42 of the wafer illumination assembly and the at least one light source 42 may be positioned under the transport part 44' of the endless conveyor part 44. Such a configuration is advantageous because the light source 42 will not be soiled by scrap of broken wafers W because the light sources 42 are screened of by the transport part 44'. The electromagnetic waves produces by the light source 42 may be in the visible spectrum or the infrared spectrum. The cameras 38 of the inspection system 38, 40, 42 may be mounted above the endless belt assemblies 16 as shown in the exemplary embodiment of the figures. By virtue of the fact that the light sources 42 shed light on the wafers W from the underside thereof, and the cameras 38 are looking at the wafers W from above, the cameras 38 will obtain an image of the wafers W with a very strong contrast. Thus, if the wafers W include small cracks, it is highly likely that these cracks are indeed observed by the inspection system 38, 40, 42. In an embodiment, the contours of the wafer may be inspected by the camera. The camera may also be embodied as an assembly of sensors.
In an embodiment, of which an example is shown in the figures, the scrap discharge assembly 34 may include a waste tray 46 that is positioned under a discharge end 44a of the endless conveyor belt 44 of the scrap discharge assembly 34.
The two endless belts 18, 20 may be embodied as snares or may have a very limited width. In an embodiment in which the light sources 42 are positioned under the endless belts 18, 20 and the cameras 18 of the inspection system are positioned above the endless belt assemblies 16, the two endless belts 18, 20 with the small width or with the snare configuration are advantageous because virtually no light is blocked by such narrow endless belts 18, 20.
To optimally support the wafers W during transfer from an endless belt 18, 20 to a slot 12a of the cassette 12 and vice versa or to another kind of subsequent unit, an embodiment of the wafer inspection assembly 10 may be configured so that the position of the first delivery end 22 of an associated endless belt assembly 16 is adjustable in the first and the second direction Dl, D2 so that the first delivery end 22 is moveable to an extended position (as shown in the figures)and to a retracted position in which it is moved away from above the cassette carrying table 30. To that end, the at least two endless belts 18, 20 of an associated endless belt assembly 16 may include an upper part that extends between and is guided over a first delivery end roller 48 and a second delivery end roller 50. A lower part of the at least two endless belts 18, 20 may be guided in an S-configuration over a first guide roller 52 and a second guide roller 54. The first guide roller 52 has a fixed distance relative to the first delivery end roller 48. The second guide roller 54 has a fixed distance relative to the second delivery end roller 50. The first delivery end roller 48 and the first guide roller 52 are mounted in a guide carriage 56 that is moveable relative to the frame 14 in the first and the second direction Dl, D2 for bringing the first delivery end 22 from the retracted position to the extended position and vice versa. When a wafer W has to be inspected the following method may be used. In a first phase of the method, the wafer inspection assembly 10 as described in the claims and/or here above as well as wafers W are provided. Next, at least one wafer W to be inspected is placed on the associated endless belt assembly 16. The wafers W may, for example, be coming from a preceding processing assembly such as a layer application processing assembly. The placement of the wafers W may, for example, be done by a handler, a belt conveyor or a similar transport assembly. Subsequently, the wafer W that is placed on the associated belt assembly 16 is inspected with the camera 38. The signals obtained by the camera 38 are processed by the processing unit 40 and the processing unit 40 generates control signals S that correspond with an approved wafer W or, alternatively, a rejected wafer W. The control signals S are inputted to the controller 36 for controlling the drive motor 26 of the associated endless belt assembly 16. The drive motor 26 of the associated endless belt assembly 16 is controlled by the controller 36 for driving the at least two endless belts 18, 20 thereof in the first direction Dl in case the control signals S correspond with an approved wafer W until the wafer is transferred to the subsequent unit, or, alternatively, in the second direction D2 in case the control signals S correspond with a rejected wafer W until the wafer W is discharged from the at least two endless belts 18, 20 into the scrap receiving unit 32.
In case the subsequent unit is a cassette 12 having slots 12a and the wafer inspection assembly 10 include a cassette carrying unit 28, the method may include that at least one cassette 12 is provided and placed on the cassette carrying table 30 of the cassette carrying unit 28. Subsequently, the position of the cassette carrying table 30 may be adjusted relative to the associated first delivery end 22 of the endless belt assembly 16 so that a slot 12a of the plurality of slots 12a is positioned in alignment with the at least two endless belts 18, 20 of the endless belt assembly 16. Next, the at least two endless belts 18, 20 of the endless belt assembly 16 may be driven in the first direction Dl to move the wafer W in the associated slot 12a of the cassette 12.
After the step of moving a wafer W in the associated slot 12a of the cassette 12 has taken place, the cassette carrying table 30 is moved relative to the associated first delivery end 22 of the endless belt assembly 16 so that a subsequent slot 12a directly below the slot 12a that carries the wafer W is positioned in alignment with the at least two endless belts 18, 20 of the endless belt assembly 16. Also a subsequent wafer W may be placed on the at least two endless belts 18, 20 of the endless belt assembly 16. Subsequently, the next loading step may be performed by driving the drive motor 26 so that wafer W moves in the first direction Dl until the wafer W is received in the slot 12a of the cassette 12.
When the wafer inspection assembly 10 includes an extendible and retractable first delivery end 22, the method may additionally include that the first delivery end 22 is brought from the retracted position to the extended position after the cassette 12 has been placed on the carrying table 30. Thus a more reliable transfer of the wafer W to slot 12a may be obtained because the wafer W is supported by the at least two endless belts 18, 20 of the endless belt assembly 16 even when the wafer W is already partly moved into the slot 12a.
When a cassette 12 filled with wafers W has to be unloaded, the method may include that the at least one cassette 12 with wafers W is placed on the cassette carrying table 30 of the cassette carrying unit 28. The position of the cassette carrying table 30 is adjusted relative to the associated first delivery end 22 of the endless belt assembly 16 so that a first delivery end 22 of an associated endless belt assembly 16 engages a lower one of the wafers W in the associated cassette 12. Subsequently, the at least two endless belts 18, 20 of the endless belt assembly 16 is driven in the second direction D2 to move the wafer W out of the associated slot 12a of the cassette 12 onto the at least two endless belts 18, 20 of the associated endless belt assembly 16. When the wafer W is moved out of the cassette 12 and supported by the at least two endless belts 18, 20 of the endless belt assembly, a handler, a conveyor or similar transport assembly may be used to transport the wafer to a subsequent processing assembly, such as for instance a screen print assembly for applying contacts, bus bars, and fingers on the wafer W.
The wafer inspection assembly 10 is a relatively simple and reliable device for inspecting wafers W and for reliably transporting wafers W to a subsequent unit, e.g. a transporting unit of a subsequent process or a cassette 12. The inspection and the transportation may be performed with a minimum of transfers of the wafers W. Because the wafers W are supported by endless belts 18, 20 during the entire loading or unloading process, the chance of breakage of the wafers W is minimized. In the embodiment with the extendible and retractable first delivery end 22, the wafers W are even supported by the at least two endless belts 18, 20 when the wafer W has been moved in the confinement of the cassette 12 or to the subsequent unit. Thus, rubbing of the wafers W along the top wall of the slots 12a of the cassette 12 may be prevented. Consequently, the chance of damaging the wafers W can be minimized.
Although illustrative embodiments of the present invention have been described above, in part with reference to the accompanying drawings, it is to be understood that the invention is not limited to these embodiments. Variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the
embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an
embodiment" in various places throughout this specification are not
necessarily all referring to the same embodiment. Furthermore, it is noted that particular features, structures, or characteristics of one or more embodiments may be combined in any suitable manner to form new, not explicitly described embodiments. The reference numbers in the claims do not limit the scope of the claims.

Claims

Claims
1. A wafer inspection assembly (10) for inspecting wafers (W) and for transporting wafers (W) from a preceding unit to a subsequent unit, the wafer inspection assembly (10) including:
• a frame (14);
• at least one endless belt assembly (16) that is connected to the frame (14) and extends in a first direction (Dl) and that includes: o at least two endless belts (18, 20) that extend parallel to each other, wherein the distance between the at least two endless belts (18, 20) is arranged so that a wafer (W) can be supported by the at least two parallel endless belts (18, 20), the at least two endless belts (18, 20) defining a first delivery end (22) and a second delivery end (24);
o at least one drive motor (26) arranged for driving the at least two endless belts (18, 20) in a first direction (Dl) and in a second direction (D2) opposite to the first direction (Dl);
the wafer inspection assembly (10) further including:
• a scrap receiving unit (32) that is positioned adjacent a second delivery end (24);
• a scrap discharge assembly (34) that is positioned under the at least one endless belt assembly (16);
• a controller (36) for controlling the drive motor (26) of the at least one endless belt assembly (16) ;
• an inspection system (38, 40, 42) including:
o a camera (38) that is directed to an associated one of the at least one endless belt assembly (16); a processing unit (40) configured for processing the signals obtained by the camera (38) and configured for providing control signals (S) that correspond with an approved wafer (W) or, alternatively, a rejected wafer (W), which control signals (S) are inputted to the controller (36) for controlling the drive motor (26) of the associated endless belt assembly (16), wherein dependent on the control signals (S), the controller (36) controls the drive motor (26) of the
associated endless belt assembly (16) for driving the at least two endless belts (18, 20) in the first direction (Dl) in case the wafer (W) is approved or, alternatively, in the second direction (D2) in case the wafer (W) is rejected.
2. The wafer inspection assembly according to claim 1, wherein the inspection system (38, 40, 42) includes:
• a wafer illumination assembly including at least one light source (42) that is directed to the at least one endless belt assembly (16).
3. The wafer inspection assembly according to claim 1 or 2, wherein the scrap discharge assembly (34) includes an endless conveyor belt (44) having a transport part (44') that extends under the at least one endless belt assembly (16).
4. The wafer inspection assembly according to claim 3, wherein the transport part (44') of the endless conveyor belt (44) of the scrap discharge assembly (34) includes a transport surface that extends substantially in a horizontal plane and has a transport direction (D3) that is substantially perpendicular to the first and the second direction (Dl, D2).
5. The wafer inspection assembly according to the combination of claim 2 and one of claims 3 and 4, wherein the endless conveyor belt (44) of the scrap discharge assembly (34) is transmissive for electromagnetic waves that are generated by the at least one light source (42) of the wafer illumination assembly, wherein the at least one light source (42) is positioned under the transport part (44').
6. The wafer inspection assembly according to any one of claims 3-5, wherein the scrap discharge assembly (34) includes a waste tray (46) that is positioned under a discharge end (44a) of the endless conveyor belt (44) of the scrap discharge assembly (34).
7. The wafer inspection assembly according to any one of claims 1-6, including:
• a cassette carrying unit (28) having a cassette carrying table (30) that is positioned adjacent a first delivery end; wherein the vertical position of the cassette carrying table (30) relative to the first delivery end (22) of the at least one endless belt assembly (16) is adjustable and wherein the controller (36) is configured for controlling the position of the cassette carrying table (30) relative to the first delivery end (22) of the at least one endless belt assembly (16).
8. The wafer inspection assembly according to claim 7, wherein the cassette carrying unit (28) includes a lift assembly that is configured to adjust the vertical position of the cassette carrying table (30).
9. The wafer inspection assembly according to any one of the preceding claims, wherein the position of the first delivery end (22) of an associated endless belt assembly (16) is adjustable in the first and the second direction (Dl, D2) so that the first delivery end (22) is moveable to an extended position and in a retracted position .
10. The wafer inspection assembly according to claim 9, wherein the at least two endless belts (18, 20) of an associated endless belt assembly (16) includes:
• an upper part that extends between and is guided over a first delivery end roller (48) and a second delivery end roller (50); and · a lower part that is guided in an S -configuration over a first
guide roller (52) and a second guide roller (54), wherein the first guide roller (52) has a fixed distance relative to the first delivery end roller (48) and wherein the second guide roller (54) has a fixed distance relative to the second delivery end roller (50), wherein the first delivery end roller (48) and first guide roller
(52) are mounted in a guide carriage (56) that is moveable relative to the frame (14) in the first and the second direction (Dl, D2) for bringing the first delivery end (22) from the retracted position to the extended position and vice versa.
11. A method for inspecting wafers (W), the method including:
• providing a wafer inspection assembly (10) according to any one of claims 1-10;
• providing wafers (W);
· placing a wafer (W) on the associated endless belt assembly (16);
• inspecting the wafer (W) that is placed on the associated belt assembly (16) with the camera (38);
• processing the signals obtained by the camera (38) and generating control signals (S) that correspond with an approved wafer (W) or, alternatively, a rejected wafer (W); inputting the control signals (S) to the controller (36) for controlling the drive motor (26) of the associated endless belt assembly (16);
controlling the drive motor (26) of the associated endless belt assembly (16) for driving the at least two endless belts (18, 20) thereof in the first direction (Dl) in case the control signals (S) correspond with an approved wafer (W) until the wafer is transferred to a subsequent unit, or, alternatively, in the second direction (D2) in case the control signals (S) correspond with a rejected wafer (W) until the wafer (W) is discharged from the at least two endless belts (18, 20) into the scrap receiving unit (32).
12. The method of claim 11, wherein the wafer inspection assembly (10) includes the features of claim 8 or 9, wherein the method includes:
· providing at least one cassette (12) as the subsequent unit;
• placing the at least one cassette (12) on the cassette carrying table (30) of the cassette carrying unit (28);
• adjusting the position of the cassette carrying table (30) relative to the associated first delivery end (22) of the endless belt assembly (16) so that a slot (12a) of the plurality of slots (12a) is positioned in alignment with the at least two endless belts (18, 20) of the endless belt assembly (16); and
• driving the at least two endless belts (18, 20) of the endless belt assembly (16) in the first direction (Dl) to move the wafer (W) in the associated slot (12a) of the cassette (12).
13. The method according to claim 12, wherein after the step of moving a wafer (W) in the associated slot (12a) of the cassette (12) has taken place, the cassette carrying table (30) is moved relative to the associated first delivery end (22) of the endless belt assembly (16) so that a subsequent slot (12a) directly below the slot (12a) that carries the wafer (W) is positioned in alignment with the at least two endless belts (18, 20) of the endless belt assembly (16).
14. The method according to any one of claims 12-13, the wafer inspection assembly (10) including the features of claim 10 or 11, wherein the method includes:
• bringing the first delivery end (22) from the retracted position to the extended position after the placing of the cassette (12) on the carrying table (30).
15. A method according to claim 10, wherein the wafer inspection assembly (10) includes the features of claim 8 or 9, the method including:
• providing a cassette (12) that is at least partly filled with wafers (W);
• placing the at least one cassette (12) on the cassette carrying table (30) of the cassette carrying unit (28);
• adjusting the position of the cassette carrying table (30) relative to the associated first delivery end (22) of the endless belt assembly (16) so that a first delivery end (22) of an associated endless belt assembly (16) engages a lower one of the wafers (W) in the associated cassette (12); and
• driving the at least two endless belts (18, 20) of the endless belt assembly (16) in the second direction (D2) to move the wafer (W) out of the associated slot (12a) of the cassette (12) onto the at least two endless belts (18, 20) of the associated endless belt assembly (16).
PCT/NL2012/050055 2011-02-01 2012-02-01 Wafer inspection system WO2012105837A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2006113 2011-02-01
NL2006113A NL2006113C2 (en) 2011-02-01 2011-02-01 Water inspection system.

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NL2006113C2 (en) 2012-08-02

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