NL2006113C2 - Water inspection system. - Google Patents

Water inspection system. Download PDF

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Publication number
NL2006113C2
NL2006113C2 NL2006113A NL2006113A NL2006113C2 NL 2006113 C2 NL2006113 C2 NL 2006113C2 NL 2006113 A NL2006113 A NL 2006113A NL 2006113 A NL2006113 A NL 2006113A NL 2006113 C2 NL2006113 C2 NL 2006113C2
Authority
NL
Netherlands
Prior art keywords
assembly
wafer
endless belt
cassette
endless
Prior art date
Application number
NL2006113A
Other languages
Dutch (nl)
Inventor
Eduard Renier Francisca Clerkx
Rene Maria Wilhelmus Ernst
Original Assignee
Otb Solar Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Otb Solar Bv filed Critical Otb Solar Bv
Priority to NL2006113A priority Critical patent/NL2006113C2/en
Priority to PCT/NL2012/050055 priority patent/WO2012105837A1/en
Priority to TW101103198A priority patent/TW201250886A/en
Application granted granted Critical
Publication of NL2006113C2 publication Critical patent/NL2006113C2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Description

P93893NL00
Title: Wafer inspection system
The invention relates to a wafer inspection system for inspecting wafers and for transporting wafers from a preceding unit to a subsequent unit. In this context the term “wafer” includes silicon wafers for the manufacture of photovoltaic cells and wafers for the manufacture of integrated circuits.
5 Especially, with mass production of photovoltaic cells, handling of wafers is delicate and the chance of breakage of the wafers is always present. Manufacture of photovoltaic cells is performed in various steps. One of the steps is the application of various layers on the main surface the thin silicon wafer. An apparatus with which application of layers can be performed is 10 described in EP-1365040. From this layer application process, the wafers may be transported to another process, e.g. a screen printing process for applying a pattern of electrically conductive lines, for example, the fingers and bus bars or the like, on the front side and for applying a full metal contact on the back surface.
15 Between the various process steps that the wafers are subjected to, the wafers have to be transported. Such a transport can reliably be done in cassettes. These cassettes are known from practice.
The present invention is directed to a wafer inspection assembly that contributes to the reliability of the production system as a whole.
20 To that end the invention provides a wafer inspection assembly for inspecting wafers and for transporting wafers from a preceding unit to a subsequent unit, the wafer inspection assembly including: • a frame; • at least one endless belt assembly that is connected to the frame 25 and extends in a first direction and that includes: o at least one endless belt arranged so that a wafer can be placed on the at least one endless belt, the at least one 2 endless belt defining a first delivery end and a second delivery end; o at least one drive motor arranged for driving the at least one endless belt in a first direction and in a second 5 direction opposite to the first direction; the wafer inspection assembly further including: • a scrap receiving unit that is positioned adjacent the at least one second delivery end; • a scrap discharge assembly that is positioned under the at least 10 one endless belt assembly; • a controller for controlling the drive motor of the at least one endless belt assembly; • an inspection system that includes: o a camera that is directed to an associated one of the at 15 least one endless belt assembly; and o a processing unit configured for processing the signals obtained by the camera and configured for providing control signals that correspond with an approved wafer or, alternatively, a rejected wafer, which control signals are 20 inputted to the controller for controlling the drive motor of the associated endless belt assembly, wherein dependent on the control signals, the controller controls the drive motor of the associated endless belt assembly for driving the at least one endless belt in the first direction in case the wafer 25 is approved or, alternatively in the second direction in case the wafer is rejected.
Such a wafer inspection assembly is reliable because each wafer is supported by the at least one endless belt of the endless belt assembly and that provides a stable support for the wafer. During transfer of the wafer from the 30 at least one endless belt to the subsequent unit or vice versa, the wafer is not 3 taken up by a separate handling unit. In view thereof, no additional transfer of the wafer is necessary, thus reducing the risk of damage of the wafer.
The wafer inspection assembly also has the functionality of providing the possibility to inspect the wafer for breakage or other damage.
5 Such an inspection may lead to approval or rejection of the wafer. In case of a rejected wafer, the wafer may be removed from the process by driving the at least one endless belt in the second direction until the wafer is dispatched in the scrap receiving unit.
The invention also provides a method for inspecting wafers, wherein 10 the method includes: • providing a wafer inspection assembly according to the invention; • providing wafers; • inspecting the wafer that is placed on the associated belt assembly with the camera; 15 · processing the signals obtained by the camera and generating control signals that correspond with an approved wafer or, alternatively, a rejected wafer; • inputting the control signals to the controller for controlling the drive motor of the associated endless belt assembly; 20 · controlling the drive motor of the associated endless belt assembly for driving the at least one endless belt thereof in the first direction in case the control signals correspond with an approved wafer until the wafer is transferred to a subsequent unit, or, alternatively, in the second direction in case the control 25 signals correspond with a rejected wafer until the wafer is discharged from the at least one endless belt into the scrap receiving unit.
Such a method has the same advantages as those described in relating to the wafer inspection assembly.
30 4
Further elaborations of the wafer inspection assembly and of the methods are described in the dependent claims and will be further elucidated in the detailed description.
5 Fig. 1 shows a perspective view of an embodiment of the assembly according to the invention; and
Fig. 2 shows a perspective view of a detail of Fig. 1.
Generally, the wafer inspection assembly 10, of which an example of 10 an embodiment is shown in Fig. 1 and a part thereof in more detail in Fig. 2, is intended for inspecting wafers W and for transporting the wafers to a subsequent unit. The subsequent unit may, for example, be a subsequent transporting assembly of a subsequent process assembly, such as for instance a screen printing process assembly. In the exemplary embodiment that is 15 shown in Fig. 1, the subsequent unit is a cassette 12. In the non-limiting exemplary embodiment with the cassette 12 as a subsequent unit, the wafer inspection assembly 10 may be used to load wafers W into at least one cassette 12 and/or for unloading the wafers W from a cassette 12. Such a cassette 12 may include a plurality of slots 12a. Each slot 12a is configured to receive a 20 wafer W. The wafer inspection assembly 10 includes a frame 14 and at least one endless belt assembly 16 that is connected to the frame 14 and that extends in a first direction Dl. In the embodiment shown in Fig. 1, the assembly 10 includes three endless belt assemblies 16. It will be clear that less or more endless belt assemblies 16 are also feasible within the present 25 disclosure. Each endless belt assembly 16 includes at least one endless belt 18, 20 that is arranged so that a wafer W can be placed on the at least one endless belt 18, 20. The at least one endless belt 18, 20 defines a first delivery end 22 and a second delivery end 24. Each endless belt assembly 16 further includes at least one drive motor 26 arranged for driving the at least one endless belt 30 18, 20 in a first direction Dl and in a second direction D2 opposite to the first 5 direction Dl. The wafer inspection assembly 10 further may in an embodiment include a cassette carrying unit 28 having a cassette carrying table 30 that is positioned adjacent the first delivery ends 22. A scrap receiving unit 32 is positioned adjacent the second delivery ends 24. The wafer inspection 5 assembly 10 additionally includes a scrap discharge assembly 34 that is positioned under the at least one endless belt assembly 16. The vertical position of the cassette carrying table 30 may be adjustable relative to the first delivery end 22 of the at least one endless belt assembly 16. A controller 36 is provided for controlling the drive motor 26 of the at least one endless belt 10 assembly 16 and optionally for controlling the position of the cassette carrying table 30 relative to the first delivery end 22 of the at least one endless belt assembly 16.
In an embodiment, the cassette carrying unit 28 may include a lift assembly that is configured to adjust the vertical position of the cassette 15 carrying table 30. In an alternative embodiment, the endless belt assemblies 16 could be arranged on a lift assembly and the carrying table 30 may be fixed. It is however advantageous that the carrying table 30 is mounted on a lifting assembly in view of the simplicity of the design of the cassette loading assembly 10.
20 In order to be able to inspect the wafers W before the next process step is initiated, the wafer inspection assembly 10 includes an inspection system 38, 40, 42. The inspection system may include a camera 38 that is directed to an associated one of the at least one endless belt assembly 16. The inspection system may also include a processing unit 40 that is configured for 25 processing the signals obtained by the camera 38 and configured for providing control signals S that correspond with an approved wafer or, alternatively, a rejected wafer. These control signals S are inputted to the controller 36 for controlling the drive motor 26 of the associated endless belt assembly 16. Dependent on the control signals S, the controller 36 controls the drive motor 30 26 of the associated endless belt assembly 16 for driving the at least one 6 endless belt 18, 20 in the first direction D1 in case the wafer W is approved or, alternatively in the second direction D2 in case the wafer W is rejected.
In an embodiment, of which an example is shown in the figures, the inspection system 38, 40, 42 may include a wafer illumination assembly that 5 includes at least one light source 42 that is directed to the at least one endless belt assembly 16.
In one example, the light source 42 may be positioned above the endless belt assemblies 16. Another example will be discussed below with reference to the exemplary embodiment shown in the figures.
10 The scrap discharge assembly 34 mentioned above may in an embodiment include an endless conveyor belt 44 having a transport part 44’ that extends under the at least one endless belt assembly 16. The transport part 44’ of the endless conveyor belt 44 of the scrap discharge assembly 34 includes a transport surface that extends substantially in a horizontal plane 15 and has a transport direction (D3) that is substantially perpendicular to the first and the second direction Dl, D2 respectively.
In an embodiment including a light source 42 for the inspection system 38, 40, 42 and an a scrap discharge assembly 34 with an endless conveyor belt 44, the endless conveyor belt 44 of the scrap discharge assembly 20 34 may be transmissive for electromagnetic waves that are generated by the at least one light source 42 of the wafer illumination assembly and the at least one light source 42 may be positioned under the transport part 44’ of the endless conveyor part 44. Such a configuration is advantageous because the light source 42 will not be soiled by scrap of broken wafers W because the light 25 sources 42 are screened of by the transport part 44’. The electromagnetic waves produces by the light source 42 may be in the visible spectrum or the infrared spectrum. The cameras 38 of the inspection system 38, 40, 42 may be mounted above the endless belt assemblies 16 as shown in the exemplary embodiment of the figures. By virtue of the fact that the light sources 42 shed 30 light on the wafers W from the underside thereof, and the cameras 38 are 7 looking at the wafers W from above, the cameras 38 will obtain an image of the wafers W with a very strong contrast. Thus, if the wafers W include small cracks, it is highly likely that these cracks are indeed observed by the inspection system 38, 40, 42. In an embodiment, the contours of the wafer may 5 be inspected by the camera. The camera may also be embodied as an assembly of sensors.
In an embodiment, of which an example is shown in the figures, the scrap discharge assembly 34 may include a waste tray 46 that is positioned under a discharge end 44a of the endless conveyor belt 44 of the scrap 10 discharge assembly 34.
In an embodiment, of which an example is shown in the figures, the at least one endless belt 18, 20 of the at least one endless belt assembly 16 includes two endless belts 18, 20 that extend parallel to each other and are driven by the same drive motor 26. The distance between the two endless belts 15 18, 20 is arranged so that a wafer W can be supported by the two parallel belts 18, 20. The two endless belts 18, 20 may be embodied as snares or may have a very limited width. In an embodiment in which the light sources 42 are positioned under the endless belts 18, 20 and the cameras 18 of the inspection system are positioned above the endless belt assemblies 16, the two endless 20 belts 18, 20 with the small width or with the snare configuration are advantageous because virtually no light is blocked by such narrow endless belts 18, 20.
To optimally support the wafers W during transfer from an endless belt 18, 20 to a slot 12a of the cassette 12 and vice versa or to another kind of 25 subsequent unit, an embodiment of the wafer inspection assembly 10 may be configured so that the position of the first delivery end 22 of an associated endless belt assembly 16 is adjustable in the first and the second direction Dl, D2 so that the first delivery end 22 is moveable to an extended position (as shown in the figures)and to a retracted position in which it is moved away 30 from above the cassette carrying table 30. To that end, the at least one endless 8 belt 18, 20 of an associated endless belt assembly 16 may include an upper part that extends between and is guided over a first delivery end roller 48 and a second delivery end roller 50. A lower part of the at least one endless belt 18, 20 may be guided in an S-configuration over a first guide roller 52 and a 5 second guide roller 54. The first guide roller 52 has a fixed distance relative to the first delivery end roller 48. The second guide roller 54 has a fixed distance relative to the second delivery end roller 50. The first delivery end roller 48 and the first guide roller 52 are mounted in a guide carriage 56 that is moveable relative to the frame 14 in the first and the second direction Dl, D2 10 for bringing the first delivery end 22 from the retracted position to the extended position and vice versa.
When a wafer W has to be inspected the following method may be used. In a first phase of the method, the wafer inspection assembly 10 as 15 described in the claims and/or here above as well as wafers W are provided. Next, at least one wafer W to be inspected is placed on the associated endless belt assembly 16. The wafers W may, for example, be coming from a preceding processing assembly such as a layer application processing assembly. The placement of the wafers W may, for example, be done by a handler, a belt 20 conveyor or a similar transport assembly. Subsequently, the wafer W that is placed on the associated belt assembly 16 is inspected with the camera 38. The signals obtained by the camera 38 are processed by the processing unit 40 and the processing unit 40 generates control signals S that correspond with an approved wafer W or, alternatively, a rejected wafer W. The control signals S 25 are inputted to the controller 36 for controlling the drive motor 26 of the associated endless belt assembly 16. The drive motor 26 of the associated endless belt assembly 16 is controlled by the controller 36 for driving the at least one endless belt 18, 20 thereof in the first direction D1 in case the control signals S correspond with an approved wafer W until the wafer is transferred 30 to the subsequent unit, or, alternatively, in the second direction D2 in case the 9 control signals S correspond with a rejected wafer W until the wafer W is discharged from the at least one endless belt 18, 20 into the scrap receiving unit 32.
In case the subsequent unit is a cassette 12 having slots 12a and 5 the wafer inspection assembly 10 include a cassette carrying unit 28, the method may include that at least one cassette 12 is provided and placed on the cassette carrying table 30 of the cassette carrying unit 28. Subsequently, the position of the cassette carrying table 30 may be adjusted relative to the associated first delivery end 22 of the endless belt assembly 16 so that a slot 10 12a of the plurality of slots 12a is positioned in alignment with the at least one endless belt 18, 20 of the endless belt assembly 16. Next, the at least one endless belt 18, 20 of the endless belt assembly 16 may be driven in the first direction D1 to move the wafer W in the associated slot 12a of the cassette 12.
After the step of moving a wafer W in the associated slot 12a of the 15 cassette 12 has taken place, the cassette carrying table 30 is moved relative to the associated first delivery end 22 of the endless belt assembly 16 so that a subsequent slot 12a directly below the slot 12a that carries the wafer W is positioned in alignment with the at least one endless belt 18, 20 of the endless belt assembly 16. Also a subsequent wafer W may be placed on the at least one 20 endless belt 18, 20 of the endless belt assembly 16. Subsequently, the next loading step may be performed by driving the drive motor 26 so that wafer W moves in the first direction D1 until the wafer W is received in the slot 12a of the cassette 12.
When the wafer inspection assembly 10 includes an extendible and 25 retractable first delivery end 22, the method may additionally include that the first delivery end 22 is brought from the retracted position to the extended position after the cassette 12 has been placed on the carrying table 30. Thus a more reliable transfer of the wafer W to slot 12a may be obtained because the wafer W is supported by the at least one endless belt 18, 20 of the endless belt 30 assembly 16 even when the wafer W is already partly moved into the slot 12a.
10
When a cassette 12 filled with wafers W has to be unloaded, the method may include that the at least one cassette 12 with wafers W is placed on the cassette carrying table 30 of the cassette carrying unit 28. The position of the cassette carrying table 30 is adjusted relative to the associated first 5 delivery end 22 of the endless belt assembly 16 so that a first delivery end 22 of an associated endless belt assembly 16 engages a lower one of the wafers W in the associated cassette 12. Subsequently, the at least one endless belt 18, 20 of the endless belt assembly 16 is driven in the second direction D2 to move the wafer W out of the associated slot 12a of the cassette 12 onto the at least one 10 endless belt 18, 20 of the associated endless belt assembly 16. When the wafer W is moved out of the cassette 12 and supported by the at least one endless belt 18, 20 of the endless belt assembly, a handler, a conveyor or similar transport assembly may be used to transport the wafer to a subsequent processing assembly, such as for instance a screen print assembly for applying 15 contacts, bus bars, and fingers on the wafer W.
The wafer inspection assembly 10 is a relatively simple and reliable device for inspecting wafers W and for reliably transporting wafers W to a subsequent unit, e.g. a transporting unit of a subsequent process or a cassette 12. The inspection and the transportation may be performed with a 20 minimum of transfers of the wafers W. Because the wafers W are supported by endless belts 18, 20 during the entire loading or unloading process, the chance of breakage of the wafers W is minimized. In the embodiment with the extendible and retractable first delivery end 22, the wafers W are even supported by the at least one endless belt 18, 20 when the wafer W has been 25 moved in the confinement of the cassette 12 or to the subsequent unit. Thus, rubbing of the wafers W along the top wall of the slots 12a of the cassette 12 may be prevented. Consequently, the chance of damaging the wafers W can be minimized.
Although illustrative embodiments of the present invention have 30 been described above, in part with reference to the accompanying drawings, it 11 is to be understood that the invention is not limited to these embodiments. Variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims. Reference throughout this 5 specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not 10 necessarily all referring to the same embodiment. Furthermore, it is noted that particular features, structures, or characteristics of one or more embodiments may be combined in any suitable manner to form new, not explicitly described embodiments. The reference numbers in the claims do not limit the scope of the claims.
15

Claims (16)

1. Een waferinspectiesamenstel (10) voor het inspecteren van wafers (W) en voor het transporteren van wafers (W) van een voorgaande eenheid naar een volgende eenheid, waarbij het waferinspectiesamenstel (10) omvat: • een frame (14) 5. ten minste één eindloos bandsamenstel (16) dat is verbonden met het frame (14) en dat zich uitstrekt in een eerste richting (Dl) and dat omvat: o ten minste één eindloze band (18, 20) die zodanig is opgesteld dat een wafer (W) op de ten minste ene 10 eindloze band (18, 20) kan worden geplaatst, waarbij de ten minste ene eindloze band (18, 20) een eerste afvoereinde (22) en een tweede afvoereinde (24) heeft; o ten minste één aandrijfmotor (26) die is geconfigureerd voor het aandrijven van de ten minste ene eindloze band 15 (18, 20) in een eerste richting (Dl) en in een tweede richting (D2) die tegengesteld is aan de eerste richting (Dl); waarbij het waferinspectiesamenstel (10) verder omvat: • een afvalopneemeenheid (32) die nabij een tweede afvoereinde 20 (24) is gepositioneerd; • een afvalafvoersamenstel (34) dat is gepositioneerd onder het ten minste ene eindloze bandsamenstel (16); • een besturing (36) voor het besturen van de aandrijfmotor (26 van het ten minste ene eindloze bandsamenstel (16); 25. een inspectie systeem (38, 40, 42) omvattend: o een camera (38) die is gericht op een daarmee geassocieerd eindloos bandsamenstel (16) van het ten minste ene eindloze bandsamentel (16); o een verwerkingseenheid (40) die is geconfigureerd voor 5 het verwerken van de signalen die worden verkregen met de camera (38) en die is geconfigureerd voor het verschaffen van besturingssignalen (S) die corresponderen met een goedgekeurde wafer (W) of, alternatief, een afgekeurde wafer (W), welke 10 besturingssignalen (S) worden ingevoerd in de besturing (36) voor het besturen van de aandrijfmotor (26) van het geassocieerde bandsamenstel (16), waarbij afhankelijk van de besturingssignalen (S), de besturing (36) de aandrijfmotor (26) van het geassocieerde bandsamenstel 15 (16) bestuurt voor aandrijving van de tenminste ene eindloze band (18, 20) in de eerste richting (Dl) wanneer de wafer (W) is goedgekeurd, of, alternatief, in de tweede richting (D2) wanneer de wafer (W) is afgekeurd.A wafer inspection assembly (10) for inspecting wafers (W) and for transporting wafers (W) from a previous unit to a next unit, the wafer inspection assembly (10) comprising: • a frame (14) at least one endless belt assembly (16) connected to the frame (14) and extending in a first direction (D1) and comprising: o at least one endless belt (18, 20) arranged such that a wafer ( W) can be placed on the at least one endless belt (18, 20), the at least one endless belt (18, 20) having a first discharge end (22) and a second discharge end (24); o at least one drive motor (26) configured to drive the at least one endless belt 15 (18, 20) in a first direction (D1) and in a second direction (D2) that is opposite to the first direction ( D1); wherein the wafer inspection assembly (10) further comprises: a waste collection unit (32) positioned near a second discharge end 20 (24); • a waste disposal assembly (34) positioned under the at least one endless belt assembly (16); • a control (36) for controlling the drive motor (26 of the at least one endless belt assembly (16); 25. an inspection system (38, 40, 42) comprising: o a camera (38) directed at a associated endless belt assembly (16) of the at least one endless belt assembly (16); a processing unit (40) configured to process the signals obtained with the camera (38) and configured to provide of control signals (S) corresponding to an approved wafer (W) or, alternatively, a rejected wafer (W), which control signals (S) are input to the control (36) for controlling the drive motor (26) of the associated band assembly (16), wherein depending on the control signals (S), the control (36) controls the drive motor (26) of the associated band assembly 15 (16) for driving the at least one endless band (18, 20) in the first direction (Dl) wan when the wafer (W) is approved, or alternatively, in the second direction (D2) when the wafer (W) is rejected. 2. Het waferinspectiesamenstel volgens conclusie 1, waarbij het inspectiesysteem (38, 40, 42) omvat: • een waferverlichtingssamenstel dat is voorzien van ten minste één lichtbron (42) die is gericht naar het ten minste ene eindloze bandsamenstel (16). 25The wafer inspection assembly according to claim 1, wherein the inspection system (38, 40, 42) comprises: a wafer lighting assembly provided with at least one light source (42) facing the at least one endless belt assembly (16). 25 3. Het waferinspectiesamenstel volgens conclusie 1 of 2, waarbij het afvalafvoersamenstel (34) is voorzien van een eindloze transportband (44) dat een transportpart (44’) heeft dat zich uitstrekt onder het ten minste ene eindloze bandsamenstel (16). 30The wafer inspection assembly according to claim 1 or 2, wherein the waste discharge assembly (34) is provided with an endless conveyor belt (44) that has a conveyor part (44 ') extending below the at least one endless belt assembly (16). 30 4. Het waferinspectiesamenstel volgens conclusie 3, waarbij het transportpart (44’) van de eindloze transportband (44) van het afvalafvoersamenstel (34) is voorzien van een transportoppervlak dat zich in hoofdzaak in een horizontaal vlak uitstrekt en dat een transportrichting 5 (D3) heeft die in hoofdzaak loodrecht staat op de eerste en de tweede richting (Dl, D2).The wafer inspection assembly according to claim 3, wherein the conveying part (44 ') of the endless conveyor belt (44) of the waste discharge assembly (34) is provided with a conveying surface that extends substantially in a horizontal plane and that a conveying direction 5 (D3) has substantially perpendicular to the first and second directions (D1, D2). 5. Het waferinspectiesamenstel volgens de combinatie van conclusie 2 en één van de conclusies 3 en 4, waarbij de eindloze transportband (44) van 10 het afvalafvoersamenstel (34) doorlatend is voor elektromagnetische golven die worden opgewekt door ten minste één lichtbron (42) van het waferverlichtingssamenstel, waarbij de ten minste ene lichtbron (42) onder het transportpart (44’) is gepositioneerd.The wafer inspection assembly according to the combination of claim 2 and one of claims 3 and 4, wherein the endless conveyor belt (44) of the waste discharge assembly (34) is transmissive to electromagnetic waves generated by at least one light source (42) of the wafer lighting assembly, wherein the at least one light source (42) is positioned below the transport part (44 '). 6. Het waferinspectiesamenstel volgens één van de conclusie 3-5, waarbij het afvalafvoersamenstel (34) een afvalbak (46) omvat die is opgesteld onder een afvoereinde (44a) van de eindloze transportband (44) van het afvalafvoersamenstel (34).The wafer inspection assembly according to any of claims 3-5, wherein the waste discharge assembly (34) comprises a waste bin (46) disposed under a discharge end (44a) of the endless conveyor belt (44) of the waste discharge assembly (34). 7. Het waferinspectiesamenstel volgens één van de voorgaande conclusies, waarbij de ten minste ene eindloze band (18, 20) van het ten minste ene eindloze bandsamenstel (16) twee eindloze banden (18, 20) omvat die zich evenwijdig aan elkaar uitstrekken en die door dezelfde aandrijfmotor (26) worden aangedreven, waarbij de afstand tussen de twee 25 eindloze banden (18, 20) zodanig is dat een wafer (W) kan worden ondersteund door de twee evenwijdige eindloze banden (18, 20).The wafer inspection assembly according to any of the preceding claims, wherein the at least one endless belt (18, 20) of the at least one endless belt assembly (16) comprises two endless bands (18, 20) extending parallel to each other and which are driven by the same drive motor (26), the distance between the two endless bands (18, 20) being such that a wafer (W) can be supported by the two parallel endless bands (18, 20). 8. Het waferinspectiesamenstel volgens één van de conclusies 1-7, omvattend: • een cassettedraageenheid (28) met een cassettedraagtafel (30) die is opgesteld nabij een eerste afvoereinde; waarbij de verticale positie van de cassettedraagtafel (30) ten opzichte van het eerste afvoereinde (22) van het ten minste ene eindloze bandsamenstel 5 (16) instelbaar is en waarbij de besturing (36) is geconfigureerd voor het besturen van de positie van de cassettedraagtafel (30) ten opzichte van het eerste afvoereinde (22) van het ten minste ene eindloze bandsamenstel (16).The wafer inspection assembly according to any of claims 1-7, comprising: • a cassette-carrying unit (28) with a cassette-supporting table (30) arranged near a first discharge end; wherein the vertical position of the cassette supporting table (30) relative to the first discharge end (22) of the at least one endless belt assembly 5 (16) is adjustable and wherein the control (36) is configured to control the position of the cassette supporting table (30) with respect to the first discharge end (22) of the at least one endless belt assembly (16). 9. Het waferinspectiesamenstel volgens conclusie 8, waarbij de 10 cassettedraageenheid (28) is voorzien van een liftsamenstel dat is geconfigureerd voor het instellen van de verticale positie van de cassettedraagtafel (30).9. The wafer inspection assembly according to claim 8, wherein the cassette carrying unit (28) is provided with a lift assembly configured to adjust the vertical position of the cassette carrying table (30). 10. Het waferinspectiesamenstel volgens één van de voorgaande 15 conclusies, waarbij de positie van het eerste afvoereinde (22) van een geassocieerd eindloos bandsamenstel (16) instelbaar is in de eerste en de tweede richting (Dl, D2) zodat het eerste afvoereinde (22) beweegbaar is naar een uitgeschoven en een ingetrokken positie.10. The wafer inspection assembly according to any of the preceding claims, wherein the position of the first discharge end (22) of an associated endless belt assembly (16) is adjustable in the first and the second direction (D1, D2) so that the first discharge end (22 ) is movable to an extended and retracted position. 11. Het waferinspectiesamenstel volgens conclusie 10, waarbij de ten minste ene eindloze band (18, 20) van een geassocieerd bandsamenstel (16) is voorzien van: • een bovenste part dat zich uitstrekt tussen en is geleid over een eerste afvoereinderol (48) en een tweede afvoereinderol (50); en 25. een onderste part dat is geleid in een S-configuratie over een eerste geleiderol (52) en een tweede geleiderol (54), waarbij de eerste geleiderol (52) een vaste afstand heeft ten opzichte van de eerste afvoereinderol (48) en waarbij de tweede geleiderol (54) een vaste afstand heeft ten opzichte van de tweede 30 afvoereinderol (50), waarbij de eerste afvoereinderol (48) en de eerste geleiderol (52) zijn gemonteerd in een geleideslede (56) die beweegbaar is ten opzichte van het frame (14) in de eerste en de tweede richting (Dl, D2) voor het brengen van het eerste afvoereinde (22) van de ingetrokken naar de uitgeschoven 5 positie en omgekeerd.The wafer inspection assembly according to claim 10, wherein the at least one endless belt (18, 20) of an associated belt assembly (16) comprises: • an upper part extending between and guided over a first discharge roller (48) and a second drain roller (50); and 25. a lower part that is guided in an S-configuration over a first guide roller (52) and a second guide roller (54), the first guide roller (52) having a fixed distance from the first discharge roller (48) and wherein the second guide roller (54) has a fixed distance from the second discharge roller (50), the first discharge roller (48) and the first guide roller (52) being mounted in a guide carriage (56) movable relative to the frame (14) in the first and second directions (D1, D2) for bringing the first discharge end (22) from the retracted to the extended position and vice versa. 12. Een werkwijze voor het inspecteren van wafers (W), waarbij de werkwijze omvat: • het verschaffen van een waferinspectiesamenstel (10) volgens 10 één van de conclusies 1-11; • het verschaffen van wafers (W) • het plaatsen van een wafer (W) op het geassocieerde bandsamenstel (16); • het met de camera (38) inspecteren van de wafer (W) die op het 15 geassocieerde bandsamenstel (16) is gesplaatst; • het verwerken van de signalen die zijn verkregen door de camera (38) en het genereren van besturingssignalen (S) die corresponderen met een goedgekeurde wafer (W) of, alternatief, een afgekeurde wafer (W); 20. het invoeren van de besturingssignalen (S) in de besturing (36) voor het besturen van de aandrijfmotor (26) van het geassocieerde eindloze bandsamenstel (16); • het besturen van de aandrijfmotor (26) van het geassocieerde eindloze bandsamenstel (16) voor het aandrijven van de ten 25 minste ene eindloze band (18, 20) daarvan in de eerste richting (Dl) wanneer de besturingssignalen (S) corresponderen met een goedgekeurde wafer (W) totdat de wafer is overgedragen op een volgende eenheid of, alternatief, in een tweede richting (D2) wanneer de besturingssignalen (S) corresponderen met een afgekeurde wafer (W) totdat de wafer (W) is afgevoerd van de ten minste ene eindloze band (18, 20) in de afvalopneemeenheid (32).A method for inspecting wafers (W), the method comprising: • providing a wafer inspection assembly (10) according to any one of claims 1-11; • providing wafers (W) • placing a wafer (W) on the associated tape assembly (16); • inspecting the wafer (W) placed on the associated tape assembly (16) with the camera (38); • processing the signals obtained by the camera (38) and generating control signals (S) corresponding to an approved wafer (W) or, alternatively, a rejected wafer (W); 20. inputting the control signals (S) into the controller (36) for controlling the drive motor (26) of the associated endless belt assembly (16); Controlling the drive motor (26) of the associated endless belt assembly (16) for driving the at least one endless belt (18, 20) thereof in the first direction (D1) when the control signals (S) correspond to a approved wafer (W) until the wafer is transferred to a next unit or, alternatively, in a second direction (D2) when the control signals (S) correspond to a rejected wafer (W) until the wafer (W) is discharged from the at at least one endless belt (18, 20) in the refuse collection unit (32). 13. De werkwijze volgens conclusie 12, waarbij het waferinspectiesamenstel de maatregelen van conclusie 8 of 9 omvat, waarbij de werkwijze omvat: • het verschaffen van ten minste één cassette (12) als een volgende eenheid; 10. het plaatsen van de ten minste ene cassette (12) op een cassettedraagtafel (30) van de cassettedraageenheid (28); • het instellen van de positie van de cassettedraagtafel (30) ten opzichte van het geassocieerde eerste afvoereinde (22) van het eindloze bandsamenstel (16) zodat een sleuf (12a) van een 15 veelvoud van sleuven (12a) in lijn is gepositioneerd met de ten minste ene eindloze band (18, 20) van het eindloze bandsamenstel (16); en • het aandrijven van de ten minste ene eindloze band (18, 20) van het eindloze bandsamenstel (16) in de eerste richting (Dl) 20 om de wafer (W) in de geassocieerde sleuf (12a) van de cassette (12) te bewegen.The method of claim 12, wherein the wafer inspection assembly comprises the features of claim 8 or 9, the method comprising: • providing at least one cassette (12) as a next unit; 10. placing the at least one cassette (12) on a cassette support table (30) of the cassette support unit (28); • adjusting the position of the cassette support table (30) relative to the associated first discharge end (22) of the endless belt assembly (16) so that a slot (12a) of a plurality of slots (12a) is positioned in line with the at least one endless band (18, 20) of the endless band assembly (16); and • driving the at least one endless belt (18, 20) of the endless belt assembly (16) in the first direction (D1) 20 around the wafer (W) in the associated slot (12a) of the cassette (12) to move. 14. De werkwijze volgens conclusie 13, waarbij na de stap van het bewegen van de wafer (W) in de geassocieerde sleuf (12a) van de cassette 25 (12) heeft plaatsgevonden, de cassettedraagtafel (30) ten opzichte van het geassocieerde eerste afvoereinde (22) van het eindloze bandsamenstel (16) wordt bewogen zodat een volgende sleuf (12a) direct onder de sleuf (12a) die de wafer (W) draagt in lijn wordt gepositioneerd met de ten minste ene eindloze band (18, 20) van het eindloze bandsamenstel (16). 30The method of claim 13, wherein after the step of moving the wafer (W) into the associated slot (12a) of the cassette 25 (12), the cassette supporting table (30) relative to the associated first discharge end (22) of the endless belt assembly (16) is moved so that a subsequent slot (12a) is positioned directly below the slot (12a) carrying the wafer (W) in line with the at least one endless belt (18, 20) of the endless belt assembly (16). 30 15. De werkwijze volgens één der conclusies 13-14,,waarbij het waferinspectiesamenstel (10) de maatregelen van conclusie 10 of 11 omvat, waarbij de werkwijze omvat: • het brengen van het eerste afvoereinde (22) van de ingetrokken 5 positie naar de uitgeschoven positie na het plaatsen van de cassette (12) op de draagtafel (30).The method of any one of claims 13-14, wherein the wafer inspection assembly (10) comprises the features of claim 10 or 11, the method comprising: • bringing the first discharge end (22) from the retracted position to the extended position after placing the cassette (12) on the carrier table (30). 16. De werkwijze volgens conclusie 11, waarbij het waferinspectiesamenstel (10) de maatregelen van conclusie 8 of 9 omvat, 10 waarbij de werkwijze omvat: • het verschaffen van een cassette (12) die althans ten dele is gevuld met wafers (3); • het plaatsen van de ten minste ene cassette (12) op de cassettedraagtafel (3) van de cassettedraageenheid (28); 15. het instellen van de positie van de cassettedraagtafel (3) ten opzichte van het eerste afvoereinde (22) het eindloze bandsamenstel (16) zodat een eerste afvoereinde (22) van een geassocieerd bandsamenstel (16) een onderste van de wafers in de geassocieerde cassette (12) aangrijpt; en 20. het aandrijven van de ten minste ene eindloze band (18, 20) van het eindloze bandsamenstel (16) in de tweede richting (D2) om de wafer (W) uit de geassocieerde sleuf (12a) van de cassette (12) te bewegen op de ten minste ene eindloze band (18, 20) van het geassocieerde eindloze bandsamenstel (16).The method of claim 11, wherein the wafer inspection assembly (10) comprises the features of claim 8 or 9, the method comprising: • providing a cassette (12) that is at least partially filled with wafers (3); • placing the at least one cassette (12) on the cassette support table (3) of the cassette support unit (28); 15. adjusting the position of the cassette support table (3) relative to the first discharge end (22) the endless belt assembly (16) such that a first discharge end (22) of an associated belt assembly (16) has a lower one of the wafers in the associated cassette (12); and 20. driving the at least one endless belt (18, 20) of the endless belt assembly (16) in the second direction (D2) around the wafer (W) from the associated slot (12a) of the cassette (12) to move on the at least one endless belt (18, 20) of the associated endless belt assembly (16).
NL2006113A 2011-02-01 2011-02-01 Water inspection system. NL2006113C2 (en)

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CN110646436B (en) * 2019-09-29 2023-11-21 东莞市庆颖智能自动化科技有限公司 Detection marking equipment and detection method for defects in solar crystal column
CN111463151A (en) * 2020-04-13 2020-07-28 江苏止芯科技有限公司 Chip processing device for unmanned aerial vehicle

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