KR101184404B1 - Method and apparatus for transfering micro electronic device - Google Patents

Method and apparatus for transfering micro electronic device Download PDF

Info

Publication number
KR101184404B1
KR101184404B1 KR1020120089003A KR20120089003A KR101184404B1 KR 101184404 B1 KR101184404 B1 KR 101184404B1 KR 1020120089003 A KR1020120089003 A KR 1020120089003A KR 20120089003 A KR20120089003 A KR 20120089003A KR 101184404 B1 KR101184404 B1 KR 101184404B1
Authority
KR
South Korea
Prior art keywords
film
microcircuit
light
microcircuits
pickup roll
Prior art date
Application number
KR1020120089003A
Other languages
Korean (ko)
Inventor
오정후
Original Assignee
(주)아이펜
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)아이펜 filed Critical (주)아이펜
Priority to KR1020120089003A priority Critical patent/KR101184404B1/en
Application granted granted Critical
Publication of KR101184404B1 publication Critical patent/KR101184404B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/0231—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to electromagnetic radiation, e.g. UV light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76822—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc.
    • H01L21/76825—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc. by exposing the layer to particle radiation, e.g. ion implantation, irradiation with UV light or electrons etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The present invention relates to a microcircuit transfer method and apparatus capable of collectively transferring in different pitches and patterns onto a substrate targeting a plurality of microcircuits formed at microscopic intervals on a microcircuit substrate.
The transfer method of the microcircuit according to the present invention,
Separating the microcircuit board A separated by the microcircuits C by the dicing process and having the first UV film B1 attached to the microcircuit board carriage 110 below the microcircuits;
Irradiating UV light along a pattern of the microcircuit C1 to be placed on the first UV film;
Transferring the microcircuits C1 attached to the first UV film of the microcircuit board irradiated with UV light while the pickup roll 140 on which the second UV film B2 is wound is rolled on the microcircuit board;
Irradiating UV light onto the second UV film of the pickup roll to which the microcircuits are transferred; And
And the microcircuits transferred to the pickup roll are transferred to the final substrate 200 to be placed while the pickup roll to which the microcircuits are transferred is reversely rolled.

Description

Transfer method and apparatus for microcircuit {Method and apparatus for transfering micro electronic device}

The present invention relates to a microcircuit transfer method and apparatus capable of transferring a batch at different pitches and patterns onto a final substrate which targets a plurality of microcircuits formed at microscopic intervals on a microcircuit substrate such as a wafer.

In general, the pitch is increased when the PLA is placed on the final substrate that targets a plurality of microcircuits formed at a pitch of several tens of microns or less in a microcircuit board, such as a wafer. When is different from each other, the placement of the place is different for each microcircuit is very difficult to batch place.

Therefore, conventionally, a method of separating each of the microcircuits formed on the microcircuit board through a dicing process and then picking up each of the separated microcircuits one by one is placed on the final substrate.

However, when the final substrate is a large display substrate, the microcircuits correspond to the pixels of the display. In this case, the number of microcircuits to be transferred is 6,000,000 or more depending on the display resolution.

Therefore, in order to complete one display substrate, the process of picking up one microcircuit at once and placing it on the final substrate must be repeated several million times or more. Problems arise and hence the quality of the placement is poor.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and a method and apparatus for transferring a microcircuit that can transfer a plurality of microcircuits quickly and accurately in a batch even when the pitches of the microcircuits before and after the placement are different from each other. The purpose is to provide.

In order to achieve the above object, the transfer method of the microcircuit of the present invention is separated by each microcircuit through a dicing process and the microcircuit board with the first UV film attached to the bottom of each microcircuit is mounted on the microcircuit board carriage. And irradiating UV light along the pattern of the microcircuit to be placed on the first UV film, and attaching the pickup roll on which the second UV film is wound onto the first UV film irradiated with UV light while rolling on the microcircuit board. Transferring the transferred micro circuits to the second UV film, irradiating the UV light to the transferred second UV film, and transferring the reverse rolls of the pickup roll to the final substrate. Characterized in that it comprises a step that is configured.

In addition, the microcircuit transfer device of the present invention is separated by each microcircuit through a dicing process, and a microcircuit board carriage on which a microcircuit board with a first UV film attached to the lower portion of each microcircuit is mounted, and the fine The first UV light irradiation module for irradiating UV light along the pattern of the microcircuit to be placed on the first UV film of the microcircuit board mounted on the circuit board carriage, and the rolling of the microcircuit board so that the rolling is performed on the microcircuit board A pickup roll installed at the top and wound with the second UV film, a UV film supply roll for supplying the second UV film to the pickup roll, a UV film discharge roll for discharging the second UV film from the pickup roll, and the second UV film And a second UV light irradiation module for irradiating UV light to the second substrate, and a final substrate receiving the fine circuits transferred to the second UV film through the pickup roll.

According to the present invention configured as described above, the UV light is irradiated along the pattern of the microcircuit to be placed on the first UV film of the microcircuit board to collectively cover the second UV film wound on the pickup roll in a state in which adhesive force with the microcircuit is reduced. After transferring to the second UV film and irradiated with UV light to reduce the adhesive strength between the second UV film and the transferred microcircuit in a state that is collectively re-transferred to the final substrate to be placed, the microcircuit formed on the microcircuit board Even if the pitch of the microcircuits and the pitch of the microcircuits to be placed on the final substrate are different from each other, there is an effect of quickly and accurately placing a plurality of microcircuits.

1 is a side view schematically showing the configuration of a transfer device of a microcircuit according to the present invention.
Figure 2 is a view showing another embodiment of the UV light irradiation unit constituting the present invention.
3 is a view showing a state in which the microcircuit of the microcircuit board starts to be transferred to the second UV film of the pickup roll according to the present invention.
4 is a view showing a state in which all of the fine circuits of the microcircuit board is transferred to the second UV film of the pickup roll according to the present invention.
5 is a view showing a state in which the microcircuit transferred to the second UV film of the pickup roll in accordance with the present invention is retransmitted on the final substrate.

The features and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments with reference to the accompanying drawings. Prior to this, terms and words used in the present specification and claims are to be interpreted in accordance with the technical idea of the present invention based on the principle that the inventor can properly define the concept of the term in order to explain his invention in the best way. It must be interpreted in terms of meaning and concept.

DETAILED DESCRIPTION Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. Like reference numerals refer to like elements, and only different parts will be mainly described so as not to overlap for clarity.

As shown in FIG. 1, the transfer apparatus of the microcircuit of the present invention includes a microcircuit board carriage 110 on which the microcircuit board A is mounted.

The microcircuit board carriage 110 is made of a transparent material having excellent UV transmittance such as glass or quartz, and the microcircuit board A is placed in a horizontal state. The microcircuit board carriage 110 is installed to be movable back and forth. At this time, the microcircuit board (A) has undergone a dicing process that is cut using a laser or a diamond wheel, and is separated from each microcircuit (C). 1UV film B1 is attached.

In addition, a first UV light irradiation module 120 is installed under the microcircuit board carriage 110. The first UV light irradiation module 120 irradiates UV light upward along the pattern of the microcircuit C1 to be placed. The UV light generated from the first UV light irradiation module 120 is irradiated to the first UV film B1. The first UV light irradiation module 120 is installed to move together when the microcircuit board carriage 110 moves back and forth.

On the other hand, the photomask 130 may be installed below the microcircuit board carriage 110. The pattern of the microcircuit C1 to be placed is transparently processed on the photomask 130, and the remaining part is opaquely processed to prevent UV light from passing through. In this case, even though the first UV light irradiation module 120 does not irradiate UV light along the pattern of the microcircuit C1 to be directly placed, the UV light generated from the first UV light irradiation module 120 may be photomask 130. It is automatically irradiated along the pattern of the microcircuit (C1) to be placed on the first UV film (B1) located above through.

The pick-up roll 140 is installed on the microcircuit carriage 110 at a predetermined distance. The pick-up roll 140 is installed to enable the shandong and forward and reverse rotation to the microcircuit board carriage 110 side.

The surface of the pickup roll 140 is provided with a cushion layer 141 made of silicon so as to minimize the damage of the microcircuit C due to the contact pressure generated in the process of transferring or transferring the microcircuit C. It is desirable to.

On the other hand, the UV film supply roll 150 is installed in the rear of the pickup roll 140, the UV film for discharging the second UV film (B2) via the pickup roll 140 to the outside in front of the pickup roll 140 The discharge roll 160 is installed.

Release paper (B3) is attached to the lower portion of the second UV film (B2) supplied to the pickup roll 140 through the UV film supply roll 150. The release paper (B3) is automatically peeled off and discharged to the outside in the process of passing the second UV film (B2) UV film supply roll 150, the second UV film (B2) is peeled off the release paper (B3), the adhesive layer is lowered It is wound on the pickup roll 140 in an exposed state.

According to the invention, the second UV film (B2) is provided with a second UV light irradiation module 170 for irradiating UV light. The second UV light irradiation module 170 may be installed in the pickup roll 140 or as shown in FIG. 2, and may be installed on the discharge path of the second UV film B2.

When the second UV light irradiation module 170 is installed in the pickup roll 140, the pickup roll 140 may be irradiated with UV light to the second UV film B2 wound on the outer circumferential surface of the pickup roll 140. Is made of transparent materials such as glass or quartz. In this case, the second UV light irradiation module 170 is rotatably installed at 360 ° along a rotation axis parallel to the pickup roll 140. When the cushion layer 141 is provided on the surface of the pickup roll 140, the cushion layer 141 is also transparent so that UV light can be irradiated onto the second UV film B2 through the cushion layer 141. Should be made.

On the other hand, when the second UV light irradiation module 170 is installed on the discharge path of the second UV film B2, unlike the case where it is installed inside the pickup roll 140, it is necessary to be rotatably installed at 360 °. None, even when the cushion layer 141 is provided on the surface of the pickup roll 140, the cushion layer 141 may not be manufactured transparently.

A method of transferring the plurality of microcircuits C formed on the microcircuit board A to the final substrate 200 in a batch quickly and accurately using a transfer device of the microcircuit of the present invention configured as described above at a different pitch as desired. Take a look.

First, as shown in FIG. 1, the microcircuit board A is separated by the microcircuits C through the dicing process and the first UV film B1 is attached to the lower portion of each microcircuit C. The microcircuit board carriage 110 is raised.

When the microcircuit board A is placed on the microcircuit board carriage 110, UV light is irradiated along the pattern of the microcircuit C1 to be placed on the first UV film B1.

In this case, the UV light is performed by the first UV irradiation module 120 installed under the microcircuit board carriage 110. The first UV irradiation module 120 may irradiate UV light to the first UV film B1 while moving along the pattern of the microcircuit C1 to be placed, but may be placed on the lower portion of the first UV film B1. The micromask C1 to be placed on the first UV film B1 by providing a photomask 130 having a transparent pattern of the circuit C1 and irradiating UV light to the transparent portion of the photomask 130. It is efficient to irradiate UV light along the pattern of.

As such, when UV light is irradiated along the pattern of the microcircuit C1 to be placed on the first UV film B1, the microcircuits C1 to be irradiated with UV light are irradiated with the first UV film B1. Adhesion is greatly reduced.

When the irradiation of the UV light to the first UV film B1 is completed, the second UV film B2 is supplied to the pickup roll 140 while the second UV film B2 is supplied from the UV film supply roll 150 to the pickup roll 140. It will be rolled up. At this time, the second UV film B2 is in a state in which the release paper B3 is peeled off and the adhesive layer is exposed downward.

When the second UV film B2 is wound on the pickup roll 140, as shown in FIG. 3, the microcircuit board carriage 110 is horizontally moved and at the same time, the pickup roll 140 is wound around the second UV film B2. ) Is lowered and rolls while applying an appropriate load to the microcircuit board A, and among the microcircuits C on the microcircuit board A, only the microcircuits C1 to be placed are weakened, and the adhesive force is relatively low. It is attached to the strong second UV film B2 side. As a result, the plurality of microcircuits C1 are collectively transferred to the second UV film B2 of the pickup roll 140 in a pattern to be placed.

As shown in FIG. 4, when the microcircuits C1 are transferred in a pattern to be placed on the second UV film B2, the pickup roll 140 is raised to its original position, and then UV light is emitted to the second UV film B2. Is investigated. The UV light is irradiated through the second UV light irradiation module 170 installed in the pickup roll 140. In this case, the second UV light irradiation module 170 is irradiated with UV light while rotating at 360 °.

On the other hand, as shown in Figure 2, when the second UV light irradiation module 170 is installed on the discharge path of the second UV film (B2) fine circuits (C1) transferred in the pickup roll 140 is raised state It rotates in the forward direction until it is located in front of the second UV light irradiation module 170, and when the irradiation of the UV light is completed, rotates in the reverse direction to return to the original position.

As shown in FIG. 5, when the irradiation of the UV light to the second UV film B2 of the pickup roll 140 is completed, the pickup roll 140 moves to the final substrate 200 to be placed and then descends to the final substrate. It is rolled back while applying an appropriate load to the substrate 200. The final substrate 200 is formed with an adhesive layer 210 having a stronger adhesive force than the weakened adhesive force exposed to UV light. Accordingly, the microcircuits C1 transferred to the pickup roll 140 exposed to UV light are weakly transferred to the adhesive layer 210 of the final substrate 200 having a relatively strong adhesive force.

As such, the present invention desires a plurality of microcircuits (C) formed on the microcircuit board (A) at a fine pitch on the final substrate 200 by using the principle that the adhesion of the UV film is weakened when exposed to UV light. It is possible to place a batch quickly and accurately at a pitch (pattern).

As described above, preferred embodiments of the present invention are described above with reference to the drawings, but the present invention is not limited to the above-described embodiments, and those skilled in the art may modify the present invention without departing from the spirit of the present invention. Possible, such modifications will fall within the scope of the invention.

110 ... microcircuit board carriage 120 ... 1 UV light irradiation module
130 ... photomask 140 ... pickup roll
150 ... UV film feed roll 160 ... UV film feed roll
170 2nd UV light irradiation module 200 final board
210 ... Adhesive layer A ... Microcircuit board
B1 ... the first UV film B2 ... the second UV film
C ... fine circuit C1 ... fine circuit to be placed

Claims (6)

A microcircuit board separated by microcircuits through a dicing process and having a first UV film attached to a lower portion of each microcircuit on a microcircuit board carriage;
Irradiating UV light along a pattern of a microcircuit to be placed on the first UV film;
Transferring the microcircuits attached to the first UV film irradiated with UV light to the second UV film while the pickup roll wound with the second UV film is rolled on the microcircuit board;
Irradiating UV light onto the second UV film to which the microcircuits are transferred; And
And the microcircuits transferred to the second UV film are retransmitted onto the final substrate while the pickup roll is reversely rolled. The method of claim 1,
UV light is irradiated along the pattern of the microcircuit to be placed on the first UV film
A method of transferring a microcircuit comprising a step of installing a photomask in which the pattern of the microcircuit to be placed on the lower part of the first UV film is transparent and irradiating UV light to the transparent part of the photomask. . A microcircuit board carriage separated by microcircuits through a dicing process and having a microcircuit board with a first UV film attached to a lower portion of each microcircuit;
A first UV light irradiation module for irradiating UV light along a pattern of a microcircuit to be placed on the first UV film of the microcircuit board mounted on the microcircuit carriage;
A pick-up roll installed on the microcircuit board carriage so as to roll on the microcircuit board, and having a second UV film wound thereon;
A UV film supply roll for supplying a second UV film to the pickup roll;
UV film discharge roll for discharging the second UV film from the pickup roll;
A second UV light irradiation module irradiating UV light to the second UV film; And
And a final substrate receiving the fine circuits transferred to the second UV film through the pickup roll. The method of claim 3, wherein
The second UV light irradiation module is rotatably installed in the pickup roll,
The pickup roll is a fine circuit transfer device, characterized in that made of a transparent material. The method of claim 3, wherein
The second UV light irradiation module is a microcircuit transfer device, characterized in that installed on the discharge path of the second UV film. The method of claim 3, wherein
The lower portion of the first UV film is a microcircuit transfer apparatus, characterized in that the photomask is further provided with a transparent processing of the pattern of the microcircuit to be placed.
KR1020120089003A 2012-08-14 2012-08-14 Method and apparatus for transfering micro electronic device KR101184404B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120089003A KR101184404B1 (en) 2012-08-14 2012-08-14 Method and apparatus for transfering micro electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120089003A KR101184404B1 (en) 2012-08-14 2012-08-14 Method and apparatus for transfering micro electronic device

Publications (1)

Publication Number Publication Date
KR101184404B1 true KR101184404B1 (en) 2012-09-20

Family

ID=47113849

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120089003A KR101184404B1 (en) 2012-08-14 2012-08-14 Method and apparatus for transfering micro electronic device

Country Status (1)

Country Link
KR (1) KR101184404B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190120658A (en) 2018-04-16 2019-10-24 한국기계연구원 Method of transferring micro devices
KR20230150417A (en) 2022-04-21 2023-10-31 주식회사 비에스피 Method of transferring device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190120658A (en) 2018-04-16 2019-10-24 한국기계연구원 Method of transferring micro devices
KR20230150417A (en) 2022-04-21 2023-10-31 주식회사 비에스피 Method of transferring device

Similar Documents

Publication Publication Date Title
US20150118847A1 (en) Imprint method, imprint apparatus, and method of manufacturing semiconductor device
TWI549174B (en) A method of manufacturing a semiconductor device
CN105140183A (en) Wafer processing method
CN105261560A (en) Method for machining wafer
JP2007266191A (en) Wafer processing method
KR101184405B1 (en) Method and apparatus for transfering micro electronic device using extention array
JP2012234913A (en) Imprint apparatus, imprint method and manufacturing method of device
KR101184404B1 (en) Method and apparatus for transfering micro electronic device
JP5933060B2 (en) Imprint apparatus and method, and article manufacturing method
JP2021170659A (en) Substrate processing system and substrate processing method
US20160005654A1 (en) System for manufacturing a semiconductor package and method of manufacturing the same
CN105252365A (en) Grinding device, protective belt pasting method and protective belt
TWI623030B (en) Wafer processing method
WO2012105837A1 (en) Wafer inspection system
KR20210018090A (en) Method for forming protection member and apparatus for forming protection member
KR20140042317A (en) Apparatus of transferring flexible integrated circuit device for manufacturing package
JP6888812B2 (en) Flexible device manufacturing equipment and manufacturing method
KR101425177B1 (en) Apparatus of manufacturing flexible integrated circuit device
JP5005904B2 (en) Transfer device and transfer method
KR102354971B1 (en) Method for manufacturing display and manufacturing apparatus of the display for the same
JP2012049541A (en) Resist application apparatus for manufacturing printed circuit board
CN104392905B (en) Method and apparatus for peeling film for semiconductor
JP7134844B2 (en) Molding apparatus and article manufacturing method
JP7286250B2 (en) Protective member forming device
KR20230171385A (en) Apparatus for forming protection member

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20150720

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20160802

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20180703

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20190725

Year of fee payment: 8