JP2011517125A5 - - Google Patents
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- Publication number
- JP2011517125A5 JP2011517125A5 JP2011504309A JP2011504309A JP2011517125A5 JP 2011517125 A5 JP2011517125 A5 JP 2011517125A5 JP 2011504309 A JP2011504309 A JP 2011504309A JP 2011504309 A JP2011504309 A JP 2011504309A JP 2011517125 A5 JP2011517125 A5 JP 2011517125A5
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- component according
- insulating material
- optoelectronic component
- optoelectronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005693 optoelectronics Effects 0.000 claims 20
- 239000012777 electrically insulating material Substances 0.000 claims 9
- 238000004382 potting Methods 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 239000002318 adhesion promoter Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 229920001296 polysiloxane Polymers 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008019269.4 | 2008-04-17 | ||
| DE102008019269 | 2008-04-17 | ||
| DE102008024704.9 | 2008-05-21 | ||
| DE102008024704A DE102008024704A1 (de) | 2008-04-17 | 2008-05-21 | Optoelektronisches Bauteil und Verfahren zur Herstellung eines optoelektronischen Bauteils |
| PCT/DE2009/000438 WO2009143789A1 (de) | 2008-04-17 | 2009-03-31 | Optoelektronisches bauteil und verfahren zur herstellung eines optoelektronischen bauteils |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011517125A JP2011517125A (ja) | 2011-05-26 |
| JP2011517125A5 true JP2011517125A5 (enExample) | 2012-05-17 |
| JP5490096B2 JP5490096B2 (ja) | 2014-05-14 |
Family
ID=41111908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011504309A Active JP5490096B2 (ja) | 2008-04-17 | 2009-03-31 | オプトエレクトロニクス部品およびオプトエレクトロニクス部品の製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9698282B2 (enExample) |
| EP (1) | EP2266139B1 (enExample) |
| JP (1) | JP5490096B2 (enExample) |
| KR (1) | KR101620113B1 (enExample) |
| CN (1) | CN101971353B (enExample) |
| DE (1) | DE102008024704A1 (enExample) |
| WO (1) | WO2009143789A1 (enExample) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2792128B2 (ja) * | 1989-08-02 | 1998-08-27 | 株式会社豊田自動織機製作所 | ジェットルームにおける緯入れ制御方法 |
| US8194164B2 (en) * | 2009-09-30 | 2012-06-05 | Truesense Imaging, Inc. | Methods for capturing and reading out images from an image sensor |
| JP4747265B2 (ja) * | 2009-11-12 | 2011-08-17 | 電気化学工業株式会社 | 発光素子搭載用基板およびその製造方法 |
| US8319247B2 (en) * | 2010-03-25 | 2012-11-27 | Koninklijke Philips Electronics N.V. | Carrier for a light emitting device |
| DE102010023815A1 (de) * | 2010-06-15 | 2011-12-15 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelements |
| JP2012028744A (ja) * | 2010-06-22 | 2012-02-09 | Panasonic Corp | 半導体装置用パッケージおよびその製造方法ならびに半導体装置 |
| US9224915B2 (en) | 2010-09-17 | 2015-12-29 | Rohm Co., Ltd. | Semiconductor light-emitting device, method for producing same, and display device |
| KR101825473B1 (ko) * | 2011-02-16 | 2018-02-05 | 삼성전자 주식회사 | 발광소자 패키지 및 그 제조방법 |
| WO2012117974A1 (ja) | 2011-02-28 | 2012-09-07 | 日亜化学工業株式会社 | 発光装置 |
| JP5766976B2 (ja) * | 2011-02-28 | 2015-08-19 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| CN102299247A (zh) * | 2011-05-20 | 2011-12-28 | 浙江英特来光电科技有限公司 | 一种全户外led模组 |
| JP5795251B2 (ja) * | 2011-12-14 | 2015-10-14 | 信越化学工業株式会社 | 光学半導体装置用基台及びその製造方法、並びに光学半導体装置 |
| DE102012101889A1 (de) * | 2012-03-06 | 2013-09-12 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
| TW201344971A (zh) * | 2012-04-18 | 2013-11-01 | 隆達電子股份有限公司 | 發光元件之封裝結構 |
| JP5998716B2 (ja) * | 2012-07-31 | 2016-09-28 | 日亜化学工業株式会社 | 発光装置 |
| DE102012109905B4 (de) * | 2012-10-17 | 2021-11-11 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterbauteilen |
| JP6092266B2 (ja) * | 2013-02-06 | 2017-03-08 | シャープ株式会社 | 発光装置の製造方法 |
| DE102014102810A1 (de) | 2014-03-04 | 2015-09-10 | Osram Opto Semiconductors Gmbh | Herstellung optoelektronischer Bauelemente |
| DE102014114520B4 (de) * | 2014-10-07 | 2020-03-05 | Infineon Technologies Austria Ag | Ein elektronisches Modul mit mehreren Einkapselungsschichten und ein Verfahren zu dessen Herstellung |
| TWI570856B (zh) * | 2014-11-10 | 2017-02-11 | 恆勁科技股份有限公司 | 封裝結構及其製法 |
| DE102014116370A1 (de) | 2014-11-10 | 2016-05-12 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines Trägers und Verfahren zum Herstellen eines optoelektronischen Bauelements |
| JP5900586B2 (ja) * | 2014-12-08 | 2016-04-06 | 日亜化学工業株式会社 | 発光装置 |
| DE102015105509A1 (de) | 2015-04-10 | 2016-10-13 | Osram Opto Semiconductors Gmbh | Bauelement und Verfahren zur Herstellung eines Bauelements |
| DE102015107515A1 (de) | 2015-05-13 | 2016-11-17 | Osram Opto Semiconductors Gmbh | Verfahren zum Bearbeiten eines Leiterrahmens und Leiterrahmen |
| DE102015107742A1 (de) * | 2015-05-18 | 2016-11-24 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauteils und optoelektronisches Bauteil |
| DE102015109953A1 (de) * | 2015-06-22 | 2016-12-22 | Osram Opto Semiconductors Gmbh | Herstellung elektronischer Bauelemente |
| DE102015114292A1 (de) * | 2015-08-27 | 2017-03-02 | Osram Opto Semiconductors Gmbh | Laserbauelement und Verfahren zu seiner Herstellung |
| DE102015114579B4 (de) * | 2015-09-01 | 2021-07-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterchip |
| DE102016114478A1 (de) * | 2016-08-04 | 2018-02-08 | Osram Opto Semiconductors Gmbh | Verfahren zum herstellen eines trägers für ein optoelektronisches bauelement |
| JP2016225655A (ja) * | 2016-09-21 | 2016-12-28 | 大日本印刷株式会社 | 光半導体装置用リードフレーム、樹脂付き光半導体装置用リードフレーム、リードフレームの多面付け体、樹脂付きリードフレームの多面付け体、光半導体装置、光半導体装置の多面付け体 |
| JP2017076809A (ja) * | 2016-12-05 | 2017-04-20 | 大日本印刷株式会社 | 樹脂付リードフレーム、半導体装置、照明装置 |
| JP7043225B2 (ja) * | 2017-11-08 | 2022-03-29 | 株式会社東芝 | 半導体装置 |
| JP7116303B2 (ja) | 2018-06-25 | 2022-08-10 | 日亜化学工業株式会社 | パッケージ及び発光装置 |
| EP3840546A4 (en) * | 2018-08-24 | 2021-10-06 | Ningbo Sunny Opotech Co., Ltd. | PRINTED CIRCUIT BOARD AND ITS SEMI-FINISHED PRODUCT, FLOOD LAMP, SHOOTING MODULE AND ITS APPLICATION |
| JP7227474B2 (ja) * | 2019-02-26 | 2023-02-22 | 日亜化学工業株式会社 | 樹脂パッケージ及び発光装置 |
| DE102019121449A1 (de) * | 2019-08-08 | 2021-02-11 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur vereinzelung von bauteilen aus einem bauteilverbund sowie bauteil |
| CN111834329B (zh) * | 2020-06-30 | 2021-12-24 | 江苏长电科技股份有限公司 | 一种半导体封装结构及其制造方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6164145A (ja) * | 1984-09-05 | 1986-04-02 | Mitsubishi Electric Corp | 樹脂封止形半導体装置 |
| US6667541B1 (en) | 1998-10-21 | 2003-12-23 | Matsushita Electric Industrial Co., Ltd. | Terminal land frame and method for manufacturing the same |
| US6548328B1 (en) * | 2000-01-31 | 2003-04-15 | Sanyo Electric Co., Ltd. | Circuit device and manufacturing method of circuit device |
| TW473951B (en) * | 2001-01-17 | 2002-01-21 | Siliconware Precision Industries Co Ltd | Non-leaded quad flat image sensor package |
| JP4211359B2 (ja) * | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
| CN100372105C (zh) | 2002-04-11 | 2008-02-27 | Nxp股份有限公司 | 半导体器件 |
| FR2854495B1 (fr) * | 2003-04-29 | 2005-12-02 | St Microelectronics Sa | Procede de fabrication d'un boitier semi-conducteur et boitier semi-conducteur a grille. |
| US7102209B1 (en) * | 2003-08-27 | 2006-09-05 | National Semiconductor Corporation | Substrate for use in semiconductor manufacturing and method of making same |
| EP1680811A2 (en) * | 2003-10-28 | 2006-07-19 | Dow Corning Corporation | Method for making a flat-top pad |
| DE10361801A1 (de) | 2003-12-30 | 2005-08-04 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes und/oder strahlungsempfangendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
| TWI275189B (en) | 2003-12-30 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Radiation-emitting and/or radiation-receiving semiconductor component and method for producing such component |
| JP4516320B2 (ja) * | 2004-01-08 | 2010-08-04 | シチズン電子株式会社 | Ｌｅｄ基板 |
| CN1705091A (zh) * | 2004-05-31 | 2005-12-07 | 相互股份有限公司 | Ic封装制程 |
| US20050280016A1 (en) * | 2004-06-17 | 2005-12-22 | Mok Thye L | PCB-based surface mount LED device with silicone-based encapsulation structure |
| JP4486451B2 (ja) * | 2004-09-07 | 2010-06-23 | スタンレー電気株式会社 | 発光装置、その発光装置に使用するリードフレーム、及びリードフレームの製造方法 |
| US7348663B1 (en) * | 2005-07-15 | 2008-03-25 | Asat Ltd. | Integrated circuit package and method for fabricating same |
| KR100601891B1 (ko) * | 2005-08-04 | 2006-07-19 | 삼성전자주식회사 | Ｌｅｄ 패키지 및 그 제조방법 |
| JP2007157940A (ja) * | 2005-12-02 | 2007-06-21 | Nichia Chem Ind Ltd | 発光装置および発光装置の製造方法 |
| TWI294674B (en) * | 2005-12-06 | 2008-03-11 | Subtron Technology Co Ltd | High thermal conducting circuit substrate and manufacturing process thereof |
| JP4890872B2 (ja) | 2006-01-30 | 2012-03-07 | ルネサスエレクトロニクス株式会社 | 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置 |
| KR100735325B1 (ko) * | 2006-04-17 | 2007-07-04 | 삼성전기주식회사 | 발광다이오드 패키지 및 그 제조방법 |
| WO2007145237A1 (ja) | 2006-06-14 | 2007-12-21 | Panasonic Corporation | 放熱配線基板とその製造方法 |
| TW200912204A (en) * | 2007-05-08 | 2009-03-16 | Cree Led Lighting Solutions | Lighting device and lighting method |
-
2008
- 2008-05-21 DE DE102008024704A patent/DE102008024704A1/de not_active Withdrawn
-
2009
- 2009-03-31 KR KR1020107019998A patent/KR101620113B1/ko active Active
- 2009-03-31 US US12/933,510 patent/US9698282B2/en active Active
- 2009-03-31 EP EP09753505.8A patent/EP2266139B1/de active Active
- 2009-03-31 CN CN2009801085697A patent/CN101971353B/zh active Active
- 2009-03-31 JP JP2011504309A patent/JP5490096B2/ja active Active
- 2009-03-31 WO PCT/DE2009/000438 patent/WO2009143789A1/de not_active Ceased
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