JP2011511851A5 - - Google Patents
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- Publication number
- JP2011511851A5 JP2011511851A5 JP2010540913A JP2010540913A JP2011511851A5 JP 2011511851 A5 JP2011511851 A5 JP 2011511851A5 JP 2010540913 A JP2010540913 A JP 2010540913A JP 2010540913 A JP2010540913 A JP 2010540913A JP 2011511851 A5 JP2011511851 A5 JP 2011511851A5
- Authority
- JP
- Japan
- Prior art keywords
- actinic radiation
- curable adhesive
- radiation curable
- adhesive composition
- weight percent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 36
- 230000005855 radiation Effects 0.000 claims description 30
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 239000004014 plasticizer Substances 0.000 claims description 12
- 239000000178 monomer Substances 0.000 claims description 11
- 125000001931 aliphatic group Chemical group 0.000 claims description 8
- 239000012986 chain transfer agent Substances 0.000 claims description 8
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 8
- 239000003999 initiator Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 4
- 238000011176 pooling Methods 0.000 claims description 4
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- DKWHHTWSTXZKDW-UHFFFAOYSA-N 1-[2-[2-[2-(2-butoxyethoxy)ethoxymethoxy]ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCOCCOCCOCCCC DKWHHTWSTXZKDW-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- AGWWTUWTOBEQFE-UHFFFAOYSA-N 4-methyl-1h-1,2,4-triazole-5-thione Chemical compound CN1C=NN=C1S AGWWTUWTOBEQFE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- SXNICUVVDOTUPD-UHFFFAOYSA-N CC1=CC(C)=CC(C)=C1C(=O)P(=O)C1=CC=CC=C1 Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)C1=CC=CC=C1 SXNICUVVDOTUPD-UHFFFAOYSA-N 0.000 description 1
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- RUDUCNPHDIMQCY-UHFFFAOYSA-N [3-(2-sulfanylacetyl)oxy-2,2-bis[(2-sulfanylacetyl)oxymethyl]propyl] 2-sulfanylacetate Chemical compound SCC(=O)OCC(COC(=O)CS)(COC(=O)CS)COC(=O)CS RUDUCNPHDIMQCY-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- SCABKEBYDRTODC-UHFFFAOYSA-N bis[2-(2-butoxyethoxy)ethyl] hexanedioate Chemical compound CCCCOCCOCCOC(=O)CCCCC(=O)OCCOCCOCCCC SCABKEBYDRTODC-UHFFFAOYSA-N 0.000 description 1
- BADXJIPKFRBFOT-UHFFFAOYSA-N dimedone Chemical compound CC1(C)CC(=O)CC(=O)C1 BADXJIPKFRBFOT-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- DNJIEGIFACGWOD-UHFFFAOYSA-N ethyl mercaptane Natural products CCS DNJIEGIFACGWOD-UHFFFAOYSA-N 0.000 description 1
- AYEQJLOHMLYKAV-UHFFFAOYSA-N n-(4-sulfanylphenyl)acetamide Chemical compound CC(=O)NC1=CC=C(S)C=C1 AYEQJLOHMLYKAV-UHFFFAOYSA-N 0.000 description 1
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US940607P | 2007-12-28 | 2007-12-28 | |
| US61/009,406 | 2007-12-28 | ||
| PCT/US2008/088387 WO2009086491A1 (en) | 2007-12-28 | 2008-12-29 | Actinically curable adhesive composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011511851A JP2011511851A (ja) | 2011-04-14 |
| JP2011511851A5 true JP2011511851A5 (https=) | 2012-02-23 |
| JP5735279B2 JP5735279B2 (ja) | 2015-06-17 |
Family
ID=40437135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010540913A Expired - Fee Related JP5735279B2 (ja) | 2007-12-28 | 2008-12-29 | 化学線硬化型接着剤組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110201717A1 (https=) |
| JP (1) | JP5735279B2 (https=) |
| KR (1) | KR20100112148A (https=) |
| CN (1) | CN101970590A (https=) |
| TW (1) | TW200942562A (https=) |
| WO (1) | WO2009086491A1 (https=) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120072163A (ko) * | 2010-12-23 | 2012-07-03 | 제일모직주식회사 | Ｏｃａ 필름용 광학 점착제 조성물 |
| KR101362869B1 (ko) | 2010-12-29 | 2014-02-14 | 제일모직주식회사 | 광학 점착제 조성물 |
| KR101351624B1 (ko) * | 2010-12-31 | 2014-01-15 | 제일모직주식회사 | 광경화형 점착제 조성물 및 이를 이용한 모바일 폰의 모듈 조립 방법 |
| US8957156B2 (en) | 2010-12-31 | 2015-02-17 | Cheil Industries, Inc. | Optical adhesive composition for displays, optical adhesive film prepared from the same, and display panel including the same |
| TWI465534B (zh) * | 2010-12-31 | 2014-12-21 | Eternal Materials Co Ltd | 可光固化之黏著組合物 |
| TWI490299B (zh) * | 2011-05-05 | 2015-07-01 | Eternal Materials Co Ltd | 丙烯酸系黏著組合物及其用途 |
| TWI522742B (zh) * | 2011-07-04 | 2016-02-21 | Photocurable resin composition and use thereof | |
| CN102898956A (zh) * | 2011-07-25 | 2013-01-30 | 汉高股份有限公司 | 光固化的粘合剂组合物及其用途 |
| CN102504753B (zh) * | 2011-10-18 | 2014-03-05 | 烟台德邦科技有限公司 | 一种紫外光固化胶及其制备方法 |
| CN104628899B (zh) * | 2011-10-21 | 2017-07-11 | 日本化药株式会社 | 光学构件的制造方法及用于该制造方法的紫外线固化型树脂组合物的应用 |
| KR20140099457A (ko) * | 2011-11-21 | 2014-08-12 | 닛뽄 가야쿠 가부시키가이샤 | 자외선 경화형 수지 조성물, 및 그 경화물의 박리방법 |
| CN105238280A (zh) * | 2011-12-08 | 2016-01-13 | 日本化药株式会社 | 光学构件、紫外线固化型树脂组合物和固化物 |
| CN104992624B (zh) * | 2012-01-25 | 2018-04-27 | 迪睿合电子材料有限公司 | 图像显示装置的制造方法 |
| KR102152357B1 (ko) * | 2012-05-21 | 2020-09-04 | 주식회사 동진쎄미켐 | 광경화형 광투명 점,접착제 조성물 및 이를 포함하는 점,접착 시트 |
| WO2013176436A1 (ko) * | 2012-05-21 | 2013-11-28 | 주식회사 동진쎄미켐 | 광경화형 광투명 점,접착제 조성물 및 이를 포함하는 점,접착 시트 |
| ES2835227T3 (es) * | 2012-05-22 | 2021-06-22 | Henkel IP & Holding GmbH | Proceso para la unión de sustratos con un adhesivo líquido fotopolimerizable ópticamente transparente |
| WO2013173976A1 (en) | 2012-05-22 | 2013-11-28 | Henkel (China) Company Limited | Liquid optically clear photo-curable adhesive |
| WO2013181030A1 (en) | 2012-05-29 | 2013-12-05 | 3M Innovative Properties Company | Liquid optical adhesive compositions |
| CN102703020B (zh) * | 2012-06-12 | 2013-10-23 | 烟台德邦科技有限公司 | 一种具有耐冲击性能的液态光学透明胶及其制备方法 |
| WO2014028024A1 (en) * | 2012-08-16 | 2014-02-20 | E. I. Du Pont De Nemours And Company | Actinically curable adhesive composition and bonding method using same |
| EP2885360A4 (en) * | 2012-08-20 | 2016-04-13 | Henkel Ag & Co Kgaa | OPTICALLY CLEAR, LIQUID, LIGHT-CURABLE ADHESIVE FOR DISPLAY APPLICATIONS |
| KR20150095746A (ko) | 2012-12-10 | 2015-08-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 액체 광학 접착제 조성물 |
| CN104837949A (zh) * | 2012-12-14 | 2015-08-12 | 3M创新有限公司 | 通过使用电离辐射聚合烯键式不饱和材料来制备封装的粘弹性组合物的方法 |
| CN103484051A (zh) * | 2013-09-29 | 2014-01-01 | 苏州华周胶带有限公司 | 一种热封胶带黏合剂 |
| KR102241678B1 (ko) * | 2013-11-27 | 2021-04-19 | 덴카 주식회사 | 조성물 |
| CN104854206B (zh) * | 2013-11-29 | 2019-04-09 | Dic株式会社 | 光固化性光学粘接剂组合物、其固化物、以及液晶显示装置 |
| JP6420480B2 (ja) * | 2014-11-18 | 2018-11-07 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ | 光硬化性接着剤組成物、その調製およびその使用 |
| KR102257987B1 (ko) * | 2014-12-16 | 2021-05-31 | 삼성디스플레이 주식회사 | 광학용 투명 점착 조성물 및 이를 포함하는 표시장치 |
| KR102532767B1 (ko) * | 2015-05-26 | 2023-05-16 | 덴카 주식회사 | 조성물 |
| JP6649964B2 (ja) | 2015-05-26 | 2020-02-19 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ | 光硬化性接着剤組成物、その調製およびその使用 |
| KR102581926B1 (ko) * | 2015-08-24 | 2023-09-22 | 삼성전자주식회사 | 감광성 조성물, 이를 제조하기 위한 방법, 및 이로부터 제조된 양자점-폴리머 복합체 패턴 |
| KR102527764B1 (ko) | 2015-12-17 | 2023-05-02 | 삼성전자주식회사 | 감광성 조성물, 이를 제조하기 위한 방법, 및 이로부터 제조된 양자점-폴리머 복합체 패턴 |
| KR102359125B1 (ko) | 2016-03-15 | 2022-02-08 | 더 보드 오브 리젠츠 오브 더 유니버시티 오브 텍사스 시스템 | 티오우레탄 중합체, 이의 제조 방법, 및 적층 제조 기술에서의 용도 |
| EP3776081A4 (en) * | 2018-03-28 | 2022-03-09 | Benjamin Lund | THIOL ACRYLATE POLYMERS, METHOD OF SYNTHESIS THEREOF AND USE IN ADDITIONAL MANUFACTURING TECHNOLOGIES |
| US11739177B2 (en) | 2018-04-20 | 2023-08-29 | Adaptive 3D Technologies | Sealed isocyanates |
| US11697706B2 (en) | 2018-04-20 | 2023-07-11 | Adaptive 3D Technologies | Sealed isocyanates |
| US11911956B2 (en) | 2018-11-21 | 2024-02-27 | Adaptive 3D Technologies | Using occluding fluids to augment additive manufacturing processes |
| WO2020231417A1 (en) | 2019-05-15 | 2020-11-19 | Hewlett-Packard Development Company, L.P. | Re-workable adhesives for electronic devices |
| CA3145544A1 (en) * | 2019-07-12 | 2021-01-21 | Mondofix Inc. | Thiol-based adhesive formulations for repairing windshields |
| WO2021019868A1 (ja) * | 2019-07-29 | 2021-02-04 | 昭和電工株式会社 | 粘着シートおよび粘着剤組成物 |
| CN115353849A (zh) * | 2022-08-05 | 2022-11-18 | Tcl华星光电技术有限公司 | 一种封装材料、显示面板及其封装方法 |
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| DE2606569A1 (de) * | 1976-02-19 | 1977-08-25 | Degussa | Verfahren zur herstellung von beschussfesten verbund(glas)scheiben |
| JPS63260971A (ja) * | 1987-04-20 | 1988-10-27 | Hitachi Chem Co Ltd | 放射線硬化型粘着剤組成物 |
| JPH01156387A (ja) * | 1987-12-14 | 1989-06-19 | Cemedine Co Ltd | 耐水性を有する光硬化型接着剤組成物 |
| JPH0778202B2 (ja) * | 1988-10-18 | 1995-08-23 | 積水化学工業株式会社 | アクリル系粘着テープもしくはシートの製造方法 |
| DE59209143D1 (de) * | 1991-03-27 | 1998-02-26 | Ciba Geigy Ag | Photoempfindliches Gemisch auf Basis von Acrylaten |
| US5747551A (en) * | 1994-12-05 | 1998-05-05 | Acheson Industries, Inc. | UV curable pressure sensitive adhesive composition |
| JP3797628B2 (ja) * | 1995-11-08 | 2006-07-19 | 日東電工株式会社 | 感圧接着剤及びその接着シート |
| JP3177149B2 (ja) * | 1996-03-15 | 2001-06-18 | リンテック株式会社 | 粘着テープ用基材、該基材を用いた粘着テープ、および該基材の製造方法 |
| BR9708589A (pt) * | 1996-04-05 | 1999-08-03 | Minnesota Mining & Mfg | Composição polimerizável por luz visível e processos para revestir um substrato com um revestimento protetor e para reparar um defeito em um substrato revestido |
| JPH09291258A (ja) * | 1996-04-26 | 1997-11-11 | Lintec Corp | 粘着剤組成物およびこれを用いた粘着シート |
| US6180200B1 (en) * | 1998-06-01 | 2001-01-30 | Dsm N. V. | Cationic and hybrid radiation curable pressure sensitive adhesives for bonding of optical discs |
| JP3484985B2 (ja) * | 1998-08-17 | 2004-01-06 | 東亞合成株式会社 | 光硬化型接着剤組成物 |
| JP2000345111A (ja) * | 1999-06-07 | 2000-12-12 | Three M Innovative Properties Co | 接着剤組成物及びそれを用いた光ディスク |
| US6617371B2 (en) * | 2001-06-08 | 2003-09-09 | Addison Clear Wave, Llc | Single component room temperature stable heat-curable acrylate resin adhesive |
| US20060154169A1 (en) * | 2003-06-11 | 2006-07-13 | Hans-Joachim Timpe | Radiation-sensitive compositions comprising a 1,4-dihydropyridine sensitizer and imageable elements based thereon |
| JP2005058288A (ja) * | 2003-08-19 | 2005-03-10 | Three M Innovative Properties Co | 医療用粘着テープのための粘着剤組成物及び粘着テープ |
| JP4433181B2 (ja) * | 2004-09-22 | 2010-03-17 | 株式会社スリーボンド | 放射線硬化型マイクロカプセル含有組成物及びそれを用いたマイクロカプセル含有被覆層の形成方法。 |
| US7241636B2 (en) * | 2005-01-11 | 2007-07-10 | Freescale Semiconductor, Inc. | Method and apparatus for providing structural support for interconnect pad while allowing signal conductance |
| WO2006117156A1 (en) * | 2005-05-02 | 2006-11-09 | Cytec Surface Specialties, S.A. | Radiation curable urethane (meth)acrylate polymer and adhesives formulated with them |
| US7348132B2 (en) * | 2006-01-21 | 2008-03-25 | Gary Ganghui Teng | Laser sensitive lithographic printing plate having specific photopolymer composition |
| AU2007308187A1 (en) * | 2006-10-11 | 2008-04-17 | Collins Ink Corporation | Radiation curable and jettable ink compositions |
-
2008
- 2008-12-29 KR KR1020107016826A patent/KR20100112148A/ko not_active Withdrawn
- 2008-12-29 WO PCT/US2008/088387 patent/WO2009086491A1/en not_active Ceased
- 2008-12-29 US US12/810,175 patent/US20110201717A1/en not_active Abandoned
- 2008-12-29 TW TW097151327A patent/TW200942562A/zh unknown
- 2008-12-29 JP JP2010540913A patent/JP5735279B2/ja not_active Expired - Fee Related
- 2008-12-29 CN CN2008801267830A patent/CN101970590A/zh active Pending
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