KR20100112148A - 화학선 경화성 접착제 조성물 - Google Patents

화학선 경화성 접착제 조성물 Download PDF

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Publication number
KR20100112148A
KR20100112148A KR1020107016826A KR20107016826A KR20100112148A KR 20100112148 A KR20100112148 A KR 20100112148A KR 1020107016826 A KR1020107016826 A KR 1020107016826A KR 20107016826 A KR20107016826 A KR 20107016826A KR 20100112148 A KR20100112148 A KR 20100112148A
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KR
South Korea
Prior art keywords
adhesive composition
curable adhesive
actinic
chain transfer
transfer agent
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KR1020107016826A
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English (en)
Korean (ko)
Inventor
로버트 폴 헬드
하싼 모하메드 파라
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이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20100112148A publication Critical patent/KR20100112148A/ko
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020107016826A 2007-12-28 2008-12-29 화학선 경화성 접착제 조성물 Withdrawn KR20100112148A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US940607P 2007-12-28 2007-12-28
US61/009,406 2007-12-28

Publications (1)

Publication Number Publication Date
KR20100112148A true KR20100112148A (ko) 2010-10-18

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KR1020107016826A Withdrawn KR20100112148A (ko) 2007-12-28 2008-12-29 화학선 경화성 접착제 조성물

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Country Link
US (1) US20110201717A1 (https=)
JP (1) JP5735279B2 (https=)
KR (1) KR20100112148A (https=)
CN (1) CN101970590A (https=)
TW (1) TW200942562A (https=)
WO (1) WO2009086491A1 (https=)

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KR20130129841A (ko) * 2012-05-21 2013-11-29 주식회사 동진쎄미켐 광경화형 광투명 점,접착제 조성물 및 이를 포함하는 점,접착 시트
KR101390693B1 (ko) * 2010-12-31 2014-04-30 이터널 케미칼 컴퍼니 리미티드 광경화성 접착제 조성물
KR20150035542A (ko) * 2012-05-22 2015-04-06 헨켈 유에스 아이피 엘엘씨 액체 광학 투명성 광-경화성 접착제에 의한 기판 결합 방법

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KR101362869B1 (ko) 2010-12-29 2014-02-14 제일모직주식회사 광학 점착제 조성물
KR101351624B1 (ko) * 2010-12-31 2014-01-15 제일모직주식회사 광경화형 점착제 조성물 및 이를 이용한 모바일 폰의 모듈 조립 방법
US8957156B2 (en) 2010-12-31 2015-02-17 Cheil Industries, Inc. Optical adhesive composition for displays, optical adhesive film prepared from the same, and display panel including the same
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CN102898956A (zh) * 2011-07-25 2013-01-30 汉高股份有限公司 光固化的粘合剂组合物及其用途
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KR20140099457A (ko) * 2011-11-21 2014-08-12 닛뽄 가야쿠 가부시키가이샤 자외선 경화형 수지 조성물, 및 그 경화물의 박리방법
CN105238280A (zh) * 2011-12-08 2016-01-13 日本化药株式会社 光学构件、紫外线固化型树脂组合物和固化物
CN104992624B (zh) * 2012-01-25 2018-04-27 迪睿合电子材料有限公司 图像显示装置的制造方法
WO2013176436A1 (ko) * 2012-05-21 2013-11-28 주식회사 동진쎄미켐 광경화형 광투명 점,접착제 조성물 및 이를 포함하는 점,접착 시트
WO2013173976A1 (en) 2012-05-22 2013-11-28 Henkel (China) Company Limited Liquid optically clear photo-curable adhesive
WO2013181030A1 (en) 2012-05-29 2013-12-05 3M Innovative Properties Company Liquid optical adhesive compositions
CN102703020B (zh) * 2012-06-12 2013-10-23 烟台德邦科技有限公司 一种具有耐冲击性能的液态光学透明胶及其制备方法
WO2014028024A1 (en) * 2012-08-16 2014-02-20 E. I. Du Pont De Nemours And Company Actinically curable adhesive composition and bonding method using same
EP2885360A4 (en) * 2012-08-20 2016-04-13 Henkel Ag & Co Kgaa OPTICALLY CLEAR, LIQUID, LIGHT-CURABLE ADHESIVE FOR DISPLAY APPLICATIONS
KR20150095746A (ko) 2012-12-10 2015-08-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 액체 광학 접착제 조성물
CN104837949A (zh) * 2012-12-14 2015-08-12 3M创新有限公司 通过使用电离辐射聚合烯键式不饱和材料来制备封装的粘弹性组合物的方法
CN103484051A (zh) * 2013-09-29 2014-01-01 苏州华周胶带有限公司 一种热封胶带黏合剂
KR102241678B1 (ko) * 2013-11-27 2021-04-19 덴카 주식회사 조성물
CN104854206B (zh) * 2013-11-29 2019-04-09 Dic株式会社 光固化性光学粘接剂组合物、其固化物、以及液晶显示装置
JP6420480B2 (ja) * 2014-11-18 2018-11-07 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA 光硬化性接着剤組成物、その調製およびその使用
KR102257987B1 (ko) * 2014-12-16 2021-05-31 삼성디스플레이 주식회사 광학용 투명 점착 조성물 및 이를 포함하는 표시장치
KR102532767B1 (ko) * 2015-05-26 2023-05-16 덴카 주식회사 조성물
JP6649964B2 (ja) 2015-05-26 2020-02-19 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA 光硬化性接着剤組成物、その調製およびその使用
KR102581926B1 (ko) * 2015-08-24 2023-09-22 삼성전자주식회사 감광성 조성물, 이를 제조하기 위한 방법, 및 이로부터 제조된 양자점-폴리머 복합체 패턴
KR102527764B1 (ko) 2015-12-17 2023-05-02 삼성전자주식회사 감광성 조성물, 이를 제조하기 위한 방법, 및 이로부터 제조된 양자점-폴리머 복합체 패턴
KR102359125B1 (ko) 2016-03-15 2022-02-08 더 보드 오브 리젠츠 오브 더 유니버시티 오브 텍사스 시스템 티오우레탄 중합체, 이의 제조 방법, 및 적층 제조 기술에서의 용도
EP3776081A4 (en) * 2018-03-28 2022-03-09 Benjamin Lund THIOL ACRYLATE POLYMERS, METHOD OF SYNTHESIS THEREOF AND USE IN ADDITIONAL MANUFACTURING TECHNOLOGIES
US11739177B2 (en) 2018-04-20 2023-08-29 Adaptive 3D Technologies Sealed isocyanates
US11697706B2 (en) 2018-04-20 2023-07-11 Adaptive 3D Technologies Sealed isocyanates
US11911956B2 (en) 2018-11-21 2024-02-27 Adaptive 3D Technologies Using occluding fluids to augment additive manufacturing processes
WO2020231417A1 (en) 2019-05-15 2020-11-19 Hewlett-Packard Development Company, L.P. Re-workable adhesives for electronic devices
CA3145544A1 (en) * 2019-07-12 2021-01-21 Mondofix Inc. Thiol-based adhesive formulations for repairing windshields
WO2021019868A1 (ja) * 2019-07-29 2021-02-04 昭和電工株式会社 粘着シートおよび粘着剤組成物
CN115353849A (zh) * 2022-08-05 2022-11-18 Tcl华星光电技术有限公司 一种封装材料、显示面板及其封装方法

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101390693B1 (ko) * 2010-12-31 2014-04-30 이터널 케미칼 컴퍼니 리미티드 광경화성 접착제 조성물
KR20130129841A (ko) * 2012-05-21 2013-11-29 주식회사 동진쎄미켐 광경화형 광투명 점,접착제 조성물 및 이를 포함하는 점,접착 시트
KR20150035542A (ko) * 2012-05-22 2015-04-06 헨켈 유에스 아이피 엘엘씨 액체 광학 투명성 광-경화성 접착제에 의한 기판 결합 방법

Also Published As

Publication number Publication date
TW200942562A (en) 2009-10-16
CN101970590A (zh) 2011-02-09
US20110201717A1 (en) 2011-08-18
JP5735279B2 (ja) 2015-06-17
JP2011511851A (ja) 2011-04-14
WO2009086491A1 (en) 2009-07-09

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PA0105 International application

Patent event date: 20100727

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid