JP2011207878A - めっき浴および方法 - Google Patents

めっき浴および方法 Download PDF

Info

Publication number
JP2011207878A
JP2011207878A JP2011055906A JP2011055906A JP2011207878A JP 2011207878 A JP2011207878 A JP 2011207878A JP 2011055906 A JP2011055906 A JP 2011055906A JP 2011055906 A JP2011055906 A JP 2011055906A JP 2011207878 A JP2011207878 A JP 2011207878A
Authority
JP
Japan
Prior art keywords
copper
reaction product
alkyl
bath
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011055906A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011207878A5 (https=
Inventor
Zukhra I Niazimbetova
ズクフラ・アイ．ニアジンベトバ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of JP2011207878A publication Critical patent/JP2011207878A/ja
Publication of JP2011207878A5 publication Critical patent/JP2011207878A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
    • C07D295/08—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly bound oxygen or sulfur atoms
    • C07D295/084—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly bound oxygen or sulfur atoms with the ring nitrogen atoms and the oxygen or sulfur atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings
    • C07D295/088—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly bound oxygen or sulfur atoms with the ring nitrogen atoms and the oxygen or sulfur atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/02—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having no double bonds between ring members or between ring members and non-ring members
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C07D233/60—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with hydrocarbon radicals, substituted by oxygen or sulfur atoms, attached to ring nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
    • C07D295/12—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms
    • C07D295/125—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings
    • C07D295/13—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D333/00—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom
    • C07D333/02—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings
    • C07D333/04—Heterocyclic compounds containing five-membered rings having one sulfur atom as the only ring hetero atom not condensed with other rings not substituted on the ring sulphur atom
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2011055906A 2010-03-15 2011-03-14 めっき浴および方法 Withdrawn JP2011207878A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/661312 2010-03-15
US12/661,312 US8268157B2 (en) 2010-03-15 2010-03-15 Plating bath and method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016210569A Division JP2017061487A (ja) 2010-03-15 2016-10-27 めっき浴および方法

Publications (2)

Publication Number Publication Date
JP2011207878A true JP2011207878A (ja) 2011-10-20
JP2011207878A5 JP2011207878A5 (https=) 2016-04-14

Family

ID=43984121

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2011055906A Withdrawn JP2011207878A (ja) 2010-03-15 2011-03-14 めっき浴および方法
JP2016210569A Pending JP2017061487A (ja) 2010-03-15 2016-10-27 めっき浴および方法
JP2018207674A Active JP6797166B2 (ja) 2010-03-15 2018-11-02 めっき浴および方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2016210569A Pending JP2017061487A (ja) 2010-03-15 2016-10-27 めっき浴および方法
JP2018207674A Active JP6797166B2 (ja) 2010-03-15 2018-11-02 めっき浴および方法

Country Status (6)

Country Link
US (1) US8268157B2 (https=)
EP (1) EP2366686B1 (https=)
JP (3) JP2011207878A (https=)
KR (1) KR101739417B1 (https=)
CN (1) CN102276796B (https=)
TW (1) TWI428329B (https=)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011190260A (ja) * 2010-03-15 2011-09-29 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2011213717A (ja) * 2010-03-15 2011-10-27 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2013091850A (ja) * 2011-10-24 2013-05-16 Rohm & Haas Electronic Materials Llc めっき浴および方法
EP2669406A1 (en) 2012-05-31 2013-12-04 Rohm and Haas Electronic Materials LLC Electrolytic copper plating solution and method of electrolytic copper plating
JP2015147761A (ja) * 2013-11-21 2015-08-20 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ グアニジン化合物またはその塩、ポリエポキシドおよびポリハロゲンの反応生成物
JP2016155996A (ja) * 2014-12-30 2016-09-01 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ アミノ酸及びエポキシ類の反応生成物
JP2017036499A (ja) * 2015-08-06 2017-02-16 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ ピリジルアルキルアミンとビスエポキシドとの反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法
JPWO2015162775A1 (ja) * 2014-04-25 2017-04-13 株式会社Ｊｃｕ 銅の高速充填方法
JP2017222925A (ja) * 2016-03-29 2017-12-21 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ メガサイズのフォトレジスト画定フィーチャを電気めっきすることが可能な電気銅めっき浴及び電気めっき方法
KR20180114102A (ko) * 2016-02-12 2018-10-17 맥더미드 엔쏜 인코포레이티드 미세 전자 장치의 제조에서 구리 증착에서의 사용을 위한 평탄제 조성물들
WO2020044416A1 (ja) * 2018-08-28 2020-03-05 株式会社Ｊｃｕ 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法
JP2021185271A (ja) * 2016-08-15 2021-12-09 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH 電解銅めっきのための酸性水性組成物
CN113802158A (zh) * 2021-10-21 2021-12-17 东莞市康迈克电子材料有限公司 一种电镀液及其应用、镀铜工艺及镀件
JPWO2022172823A1 (https=) * 2021-02-15 2022-08-18

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011135716A1 (ja) * 2010-04-30 2011-11-03 荏原ユージライト株式会社 新規化合物およびその利用
US10405422B2 (en) 2012-07-09 2019-09-03 Shikoku Chemicals Corporation Copper film-forming agent and method for forming copper film
CN103400906B (zh) * 2012-08-28 2015-11-25 夏洋 一种晶硅太阳能电池栅线的仿生制备方法
CN105229095A (zh) * 2012-12-14 2016-01-06 蓝立方知识产权有限责任公司 高含固量环氧树脂涂料
KR20140092626A (ko) 2013-01-16 2014-07-24 삼성전자주식회사 구리 전해 도금액, 구리 도금 장치 및 이를 이용한 구리 범프 형성 방법
US20140238868A1 (en) 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
US9598787B2 (en) 2013-03-14 2017-03-21 Rohm And Haas Electronic Materials Llc Method of filling through-holes
JP6211185B2 (ja) 2013-11-06 2017-10-11 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ レベラーとしての窒素含有ポリマー
US9783903B2 (en) * 2013-12-06 2017-10-10 Rohm And Haas Electronic Materials Llc Additives for electroplating baths
DE102013226297B3 (de) * 2013-12-17 2015-03-26 Umicore Galvanotechnik Gmbh Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen
US9273407B2 (en) * 2014-03-17 2016-03-01 Hong Kong Applied Science and Technology Research Institute Company Limited Additive for electrodeposition
US9439294B2 (en) 2014-04-16 2016-09-06 Rohm And Haas Electronic Materials Llc Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
US9611560B2 (en) * 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
KR102426521B1 (ko) 2015-04-20 2022-07-27 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 전해 구리 도금 배쓰 조성물 및 그 사용 방법
CN105018977B (zh) * 2015-07-17 2017-09-12 深圳市板明科技有限公司 一种填孔电镀整平剂、制备方法及应用该整平剂的电镀液
CN105002527B (zh) * 2015-07-31 2017-06-16 广东光华科技股份有限公司 整平剂溶液及其制备方法和应用
US9932684B2 (en) 2015-08-06 2018-04-03 Rohm And Haas Electronic Materials Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
US10006136B2 (en) 2015-08-06 2018-06-26 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US10100421B2 (en) * 2015-08-06 2018-10-16 Dow Global Technologies Llc Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
US10738388B2 (en) * 2015-10-08 2020-08-11 Rohm And Haas Electronic Materials Llc Copper electroplating baths containing compounds of reaction products of amines and polyacrylamides
CN117845289A (zh) * 2015-10-08 2024-04-09 罗门哈斯电子材料有限责任公司 含有胺、聚丙烯酰胺和双环氧化物的反应产物的铜电镀浴
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10512174B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10718059B2 (en) * 2017-07-10 2020-07-21 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions with cationic polymers and methods of electroplating nickel
CN107313082B (zh) 2017-07-25 2018-08-17 上海新阳半导体材料股份有限公司 整平剂、含其的金属电镀组合物、制备方法及应用
US20190136397A1 (en) * 2017-11-08 2019-05-09 Rohm And Haas Electronic Materials Llc Electroplated copper
CN109989077A (zh) * 2017-12-29 2019-07-09 广东东硕科技有限公司 一种铜镀液
CN109989076A (zh) * 2017-12-29 2019-07-09 广东东硕科技有限公司 一种整平剂
AU2018399626B2 (en) 2018-01-03 2023-12-07 Ecolab Usa Inc. Benzotriazole derivatives as corrosion inhibitors
CN110129841B (zh) * 2019-06-17 2021-04-27 广东东硕科技有限公司 整平剂及包含其的电镀液
CN111876799A (zh) * 2020-07-07 2020-11-03 广东硕成科技有限公司 一种适用于背板孔金属化组合物及其孔金属化方法
CN113463142B (zh) * 2021-06-03 2022-06-14 广东硕成科技股份有限公司 一种电镀填孔组合物及其电镀填孔方法
KR102339868B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물
KR102339866B1 (ko) * 2021-08-04 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 유리비아홀 기판 도금을 위한 전기도금 조성물
CN115894908B (zh) * 2021-09-30 2025-06-06 华为技术有限公司 聚合物、整平剂及其制备方法、电镀液和电镀方法
CN113737232B (zh) * 2021-11-08 2022-01-11 深圳市板明科技股份有限公司 一种线路板通孔电镀铜整平剂及其应用、制备方法
CN116265620A (zh) * 2023-02-21 2023-06-20 广东硕成科技股份有限公司 一种整平剂、电镀铜药水以及盲孔镀铜方法

Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2640037A (en) * 1951-10-03 1953-05-26 Shell Dev Fatty acid salts of nitrogencontaining polyethers
FR2130095A1 (https=) * 1971-03-24 1972-11-03 Biosedra Lab
GB1307903A (en) * 1970-03-24 1973-02-21 Koninkl Pharmaceutische Fabrik Phenyl naphthyl and tetrahydronaphthyl derivatives
JPS4823000B1 (https=) * 1966-12-27 1973-07-10
US4024083A (en) * 1976-03-08 1977-05-17 Texaco Inc. Substituted phenoxy propanol diamines and amino alcohol detergent additives for fuels and mineral oils
JPS5324399A (en) * 1976-08-18 1978-03-07 Celanese Polymer Special Co Coating composite its producing process and way of coating
US4211725A (en) * 1977-11-10 1980-07-08 Milliken Research Corporation Nitrogen containing compositions
EP0024119A1 (en) * 1979-08-10 1981-02-25 Mobil Oil Corporation Chemically modified imidazole curing catalysts for epoxy resins and powder coatings containing them
JPS58110570A (ja) * 1981-12-15 1983-07-01 チバ−ガイギ−・アクチエンゲゼルシヤフト イミダゾリド、その製造方法および該化合物を含有する硬化性混合物
JPS58147416A (ja) * 1982-02-26 1983-09-02 Hitachi Ltd エポキシ樹脂組成物
JPS59128291A (ja) * 1983-01-06 1984-07-24 日産自動車株式会社 ポリジエン系コンポジツト推進薬の粘結剤
JPS60127134A (ja) * 1983-11-09 1985-07-06 チバ−ガイギ−　アクチエンゲゼルシヤフト パイプまたはパイプ形材の内部表面のライニング方法及び該方法に使用する塩
US5026872A (en) * 1984-02-01 1991-06-25 American Cyanamid Aromatic ether-ketone polyamines, intermediates and products, and methods for preparing same
JPH04221370A (ja) * 1990-04-02 1992-08-11 Schering Ag イミダゾリル誘導体、グリシジル化合物のための硬化剤、硬化性エポキシ樹脂組成物、エポキシ樹脂成形体、及び繊維強化支持材料の製造法
JPH1030015A (ja) * 1996-07-15 1998-02-03 Kansai Paint Co Ltd エポキシ樹脂用硬化触媒及びそれを用いてなる熱硬化性塗料組成物
WO2002090623A1 (fr) * 2001-05-09 2002-11-14 Ebara-Udylite Co., Ltd. Bain galvanoplastique et procede pour substrat de galvanoplastie faisant appel audit bain
WO2005095486A1 (ja) * 2004-03-31 2005-10-13 Asahi Kasei Chemicals Corporation エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
JP2006037232A (ja) * 2004-07-22 2006-02-09 Rohm & Haas Electronic Materials Llc 平滑化剤化合物
JP2007031834A (ja) * 2005-07-08 2007-02-08 Rohm & Haas Electronic Materials Llc メッキ法
JP2008266722A (ja) * 2007-04-20 2008-11-06 Ebara Udylite Kk パルス銅めっき浴用添加剤およびこれを用いたパルス銅めっき浴
JP2010202526A (ja) * 2009-02-27 2010-09-16 Toray Ind Inc Ｃ型肝炎ウイルスの宿主細胞への侵入阻害剤及びこれを含有する医薬組成物
JP2011190260A (ja) * 2010-03-15 2011-09-29 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2011213717A (ja) * 2010-03-15 2011-10-27 Rohm & Haas Electronic Materials Llc めっき浴および方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
FR1566468A (https=) * 1968-03-04 1969-05-09
DE2007968A1 (de) 1970-01-16 1971-07-22 R.T. Vanderbilt Company, Inc., New York, N.Y. (V.St.A.) Propy lenoxid-Imidazol-Reaktionsprodukte, Verfahren zu ihrer Herstellung und ihre Verwendung als Hartungsmittel fur Epoxidharze
US3954575A (en) * 1972-11-10 1976-05-04 Dipsol Chemicals Co., Ltd. Zinc electroplating
US3843667A (en) * 1973-09-12 1974-10-22 M Cupery N-imidazole compounds and their complex metal derivatives
DE2525264C2 (de) * 1975-06-04 1984-02-16 Schering AG, 1000 Berlin und 4709 Bergkamen Alkalisches cyanidfreies Zinkbad und Verfahren zur galvanischen Abscheidung von Zinküberzügen unter Verwendung dieses Bades
SU535301A1 (ru) 1975-07-08 1976-11-15 Днепропетровский Ордена Трудового Красного Знамени Государственный Университет Им.300-Летия Воссоединения Украины С Россией Производные 1,2-диалкилбензимидазола, про вл ющие гипотензивное действие
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
US4038171A (en) * 1976-03-31 1977-07-26 Battelle Memorial Institute Supported plasma sputtering apparatus for high deposition rate over large area
DE2725930C2 (de) 1976-06-12 1986-06-12 Mitsubishi Petrochemical Co., Ltd., Tokio/Tokyo Verfahren zur Herstellung eines Anionenaustauscherharzes und Verwendung derselben zur Herstellung einer Anionenaustauschermembran
BE857754A (fr) * 1976-08-18 1978-02-13 Celanese Polymer Special Co Composition de resine pour revetements, notamment par electrodeposition cathodique
US4169772A (en) * 1978-11-06 1979-10-02 R. O. Hull & Company, Inc. Acid zinc plating baths, compositions useful therein, and methods for electrodepositing bright zinc deposits
US4397717A (en) * 1981-02-10 1983-08-09 Elektro-Brite Gmbh & Co. Kg. Alkaline zinc electroplating bath with or without cyanide content
US4536261A (en) * 1984-08-07 1985-08-20 Francine Popescu Alkaline bath for the electrodeposition of bright zinc
JPS61286369A (ja) 1985-06-11 1986-12-16 Shikoku Chem Corp ２―フェニル―４，５―ジベンジルイミダゾール及び該化合物の合成方法
US4730022A (en) * 1987-03-06 1988-03-08 Mcgean-Rohco, Inc. Polymer compositions and alkaline zinc electroplating baths
US4792383A (en) * 1987-10-27 1988-12-20 Mcgean-Rohco, Inc. Polymer compositions and alkaline zinc electroplating baths and processes
JPH01219188A (ja) * 1988-02-26 1989-09-01 Okuno Seiyaku Kogyo Kk 亜鉛−ニッケル合金めっき浴
JPH03277631A (ja) 1990-08-31 1991-12-09 Mitsubishi Petrochem Co Ltd 新規な高分子四級塩の製造方法
SU1743158A1 (ru) 1990-09-04 1998-02-20 Институт физико-органической химии и углехимии АН УССР 1-глицидилимидазолы в качестве соотвердителей эпоксидных смол
JPH07228572A (ja) 1994-02-18 1995-08-29 Japan Energy Corp 新規ベンズイミダゾールフッ素誘導体及びその製造方法並びにそれを用いる金属表面処理剤
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
DE69703739T2 (de) 1997-10-02 2001-06-13 Hexcel Corp., Pleasanton Epoxidharzhärter
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US6515237B2 (en) * 2000-11-24 2003-02-04 Hitachi Chemical Company, Ltd. Through-hole wiring board
JP2004250777A (ja) * 2002-06-03 2004-09-09 Shipley Co Llc レベラー化合物
JP4249438B2 (ja) * 2002-07-05 2009-04-02 日本ニュークローム株式会社 銅―錫合金めっき用ピロリン酸浴
JP3789107B2 (ja) * 2002-07-23 2006-06-21 株式会社日鉱マテリアルズ 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4183999B2 (ja) * 2002-07-29 2008-11-19 日鉱金属株式会社 イミダゾールアルコールを有効成分とする表面処理剤
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US7662981B2 (en) * 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
JP5497261B2 (ja) 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
DE502008002080D1 (de) * 2008-06-02 2011-02-03 Autotech Deutschland Gmbh Pyrophosphathaltiges Bad zur cyanidfreien Abscheidung von Kupfer-Zinn-Legierungen
KR101274544B1 (ko) * 2008-06-12 2013-06-17 이시하라 야쿠힌 가부시끼가이샤 전해 동피막, 그 제조 방법 및 동전해 피막 제조용의 동 전해액

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2640037A (en) * 1951-10-03 1953-05-26 Shell Dev Fatty acid salts of nitrogencontaining polyethers
JPS4823000B1 (https=) * 1966-12-27 1973-07-10
GB1307903A (en) * 1970-03-24 1973-02-21 Koninkl Pharmaceutische Fabrik Phenyl naphthyl and tetrahydronaphthyl derivatives
FR2130095A1 (https=) * 1971-03-24 1972-11-03 Biosedra Lab
US4024083A (en) * 1976-03-08 1977-05-17 Texaco Inc. Substituted phenoxy propanol diamines and amino alcohol detergent additives for fuels and mineral oils
JPS5324399A (en) * 1976-08-18 1978-03-07 Celanese Polymer Special Co Coating composite its producing process and way of coating
US4211725A (en) * 1977-11-10 1980-07-08 Milliken Research Corporation Nitrogen containing compositions
EP0024119A1 (en) * 1979-08-10 1981-02-25 Mobil Oil Corporation Chemically modified imidazole curing catalysts for epoxy resins and powder coatings containing them
JPS58110570A (ja) * 1981-12-15 1983-07-01 チバ−ガイギ−・アクチエンゲゼルシヤフト イミダゾリド、その製造方法および該化合物を含有する硬化性混合物
JPS58147416A (ja) * 1982-02-26 1983-09-02 Hitachi Ltd エポキシ樹脂組成物
JPS59128291A (ja) * 1983-01-06 1984-07-24 日産自動車株式会社 ポリジエン系コンポジツト推進薬の粘結剤
JPS60127134A (ja) * 1983-11-09 1985-07-06 チバ−ガイギ−　アクチエンゲゼルシヤフト パイプまたはパイプ形材の内部表面のライニング方法及び該方法に使用する塩
US5026872A (en) * 1984-02-01 1991-06-25 American Cyanamid Aromatic ether-ketone polyamines, intermediates and products, and methods for preparing same
JPH04221370A (ja) * 1990-04-02 1992-08-11 Schering Ag イミダゾリル誘導体、グリシジル化合物のための硬化剤、硬化性エポキシ樹脂組成物、エポキシ樹脂成形体、及び繊維強化支持材料の製造法
JPH1030015A (ja) * 1996-07-15 1998-02-03 Kansai Paint Co Ltd エポキシ樹脂用硬化触媒及びそれを用いてなる熱硬化性塗料組成物
WO2002090623A1 (fr) * 2001-05-09 2002-11-14 Ebara-Udylite Co., Ltd. Bain galvanoplastique et procede pour substrat de galvanoplastie faisant appel audit bain
WO2005095486A1 (ja) * 2004-03-31 2005-10-13 Asahi Kasei Chemicals Corporation エポキシ樹脂用硬化剤及びエポキシ樹脂組成物
JP2006037232A (ja) * 2004-07-22 2006-02-09 Rohm & Haas Electronic Materials Llc 平滑化剤化合物
JP2007031834A (ja) * 2005-07-08 2007-02-08 Rohm & Haas Electronic Materials Llc メッキ法
JP2008266722A (ja) * 2007-04-20 2008-11-06 Ebara Udylite Kk パルス銅めっき浴用添加剤およびこれを用いたパルス銅めっき浴
JP2010202526A (ja) * 2009-02-27 2010-09-16 Toray Ind Inc Ｃ型肝炎ウイルスの宿主細胞への侵入阻害剤及びこれを含有する医薬組成物
JP2011190260A (ja) * 2010-03-15 2011-09-29 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2011213717A (ja) * 2010-03-15 2011-10-27 Rohm & Haas Electronic Materials Llc めっき浴および方法

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011190260A (ja) * 2010-03-15 2011-09-29 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2011213717A (ja) * 2010-03-15 2011-10-27 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2013091850A (ja) * 2011-10-24 2013-05-16 Rohm & Haas Electronic Materials Llc めっき浴および方法
EP2669406A1 (en) 2012-05-31 2013-12-04 Rohm and Haas Electronic Materials LLC Electrolytic copper plating solution and method of electrolytic copper plating
JP2015147761A (ja) * 2013-11-21 2015-08-20 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ グアニジン化合物またはその塩、ポリエポキシドおよびポリハロゲンの反応生成物
JPWO2015162775A1 (ja) * 2014-04-25 2017-04-13 株式会社Ｊｃｕ 銅の高速充填方法
JP2016155996A (ja) * 2014-12-30 2016-09-01 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ アミノ酸及びエポキシ類の反応生成物
JP2017036499A (ja) * 2015-08-06 2017-02-16 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ ピリジルアルキルアミンとビスエポキシドとの反応生成物を含有する電気銅めっき浴からフォトレジスト画定フィーチャを電気めっきする方法
KR20180114102A (ko) * 2016-02-12 2018-10-17 맥더미드 엔쏜 인코포레이티드 미세 전자 장치의 제조에서 구리 증착에서의 사용을 위한 평탄제 조성물들
JP2019510875A (ja) * 2016-02-12 2019-04-18 マクダーミッド エンソン インコーポレイテッド マイクロエレクトロニクスの製造における銅析出に使用するためのレベラー組成物
US10519557B2 (en) 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
KR102175377B1 (ko) * 2016-02-12 2020-11-06 맥더미드 엔쏜 인코포레이티드 미세 전자 장치의 제조에서 구리 증착에서의 사용을 위한 평탄제 조성물들
US12398480B2 (en) 2016-02-12 2025-08-26 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
US11168406B2 (en) 2016-02-12 2021-11-09 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
JP2017222925A (ja) * 2016-03-29 2017-12-21 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ メガサイズのフォトレジスト画定フィーチャを電気めっきすることが可能な電気銅めっき浴及び電気めっき方法
JP7223083B2 (ja) 2016-08-15 2023-02-15 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー． カー・ゲー 電解銅めっきのための酸性水性組成物
JP2021185271A (ja) * 2016-08-15 2021-12-09 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH 電解銅めっきのための酸性水性組成物
WO2020044416A1 (ja) * 2018-08-28 2020-03-05 株式会社Ｊｃｕ 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法
JP7208913B2 (ja) 2018-08-28 2023-01-19 株式会社Jcu 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法
JPWO2020044416A1 (ja) * 2018-08-28 2021-08-10 株式会社Ｊｃｕ 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法
JPWO2022172823A1 (https=) * 2021-02-15 2022-08-18
WO2022172823A1 (ja) * 2021-02-15 2022-08-18 株式会社Adeka 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法
JP7808062B2 (ja) 2021-02-15 2026-01-28 株式会社Adeka 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法
CN113802158A (zh) * 2021-10-21 2021-12-17 东莞市康迈克电子材料有限公司 一种电镀液及其应用、镀铜工艺及镀件

Also Published As

Publication number Publication date
JP2019052374A (ja) 2019-04-04
EP2366686A2 (en) 2011-09-21
US20110220514A1 (en) 2011-09-15
CN102276796B (zh) 2013-04-24
CN102276796A (zh) 2011-12-14
KR101739417B1 (ko) 2017-05-24
EP2366686A3 (en) 2011-11-02
US8268157B2 (en) 2012-09-18
EP2366686B1 (en) 2013-05-08
KR20110103894A (ko) 2011-09-21
TW201139397A (en) 2011-11-16
JP6797166B2 (ja) 2020-12-09
TWI428329B (zh) 2014-03-01
JP2017061487A (ja) 2017-03-30

Similar Documents

Publication Publication Date Title
JP6797166B2 (ja) めっき浴および方法
JP6054594B2 (ja) めっき浴および方法
JP6054595B2 (ja) めっき浴および方法
EP2562294B1 (en) Plating bath and method
JP4907244B2 (ja) メッキ法
JP6278550B2 (ja) めっき浴および方法
JP2016535166A (ja) レベラーとしての窒素含有ポリマー
JP2018531300A (ja) アミン、ポリアクリルアミド、及びビスエポキシドの反応生成物を含有する銅電気めっき浴
TW201638085A (zh) 二胺與單胺及雙酸酐之反應產物的反應產物作爲電鍍浴用添加劑
KR102036001B1 (ko) 전기도금 욕을 위한 첨가제로서의 비스언하이드라이드와 디아민의 반응 생성물
KR101936107B1 (ko) 전기도금 욕을 위한 첨가제로서의 포화 헤테로사이클릭 모이어티를 함유하는 폴리머 및 아민 모노머의 반응 생성물
JP2019039077A (ja) 電気めっき浴用の添加剤としてのビス無水物及びジアミンの反応生成物

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140313

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150204

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150507

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A132

Effective date: 20151126

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160225

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20160225

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160727

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20161027