DE69703739T2 - Epoxidharzhärter - Google Patents

Epoxidharzhärter

Info

Publication number
DE69703739T2
DE69703739T2 DE69703739T DE69703739T DE69703739T2 DE 69703739 T2 DE69703739 T2 DE 69703739T2 DE 69703739 T DE69703739 T DE 69703739T DE 69703739 T DE69703739 T DE 69703739T DE 69703739 T2 DE69703739 T2 DE 69703739T2
Authority
DE
Germany
Prior art keywords
epoxy resin
substituted
resin hardener
chain
latexing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69703739T
Other languages
English (en)
Other versions
DE69703739D1 (de
Inventor
John Leslie Cawse
Mark Whiter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hexcel Corp
Original Assignee
Hexcel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hexcel Corp filed Critical Hexcel Corp
Publication of DE69703739D1 publication Critical patent/DE69703739D1/de
Application granted granted Critical
Publication of DE69703739T2 publication Critical patent/DE69703739T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D233/00Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D231/00Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/12Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D233/00Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D233/00Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/64Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms, e.g. histidine
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D249/00Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms
    • C07D249/02Heterocyclic compounds containing five-membered rings having three nitrogen atoms as the only ring hetero atoms not condensed with other rings
    • C07D249/081,2,4-Triazoles; Hydrogenated 1,2,4-triazoles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
DE69703739T 1997-10-02 1997-10-02 Epoxidharzhärter Expired - Lifetime DE69703739T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP97307793A EP0906927B1 (de) 1997-10-02 1997-10-02 Epoxidharzhärter

Publications (2)

Publication Number Publication Date
DE69703739D1 DE69703739D1 (de) 2001-01-25
DE69703739T2 true DE69703739T2 (de) 2001-06-13

Family

ID=8229533

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69703739T Expired - Lifetime DE69703739T2 (de) 1997-10-02 1997-10-02 Epoxidharzhärter

Country Status (6)

Country Link
US (1) US6107437A (de)
EP (1) EP0906927B1 (de)
JP (1) JP3469101B2 (de)
AT (1) ATE198212T1 (de)
DE (1) DE69703739T2 (de)
ES (1) ES2154013T3 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE291052T1 (de) * 1999-07-28 2005-04-15 Hexcel Corp Reaktionsharzblattmaterialien
GB2409837B (en) 2004-01-10 2006-09-06 Hexcel Composites Ltd Fibre reinforced resin assembly
GB0412196D0 (en) * 2004-06-02 2004-07-07 Hexcel Composites Ltd Cure accelerators
CA2606537C (en) 2007-05-23 2010-12-21 M-I Llc Use of invert epoxy emulsions for wellbore stabilization
KR20150063590A (ko) 2007-08-02 2015-06-09 다우 글로벌 테크놀로지스 엘엘씨 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제
WO2009018194A1 (en) 2007-08-02 2009-02-05 Dow Global Technologies Inc. Thermoset dampener material
KR101571184B1 (ko) 2008-01-08 2015-11-23 다우 글로벌 테크놀로지스 엘엘씨 복합재 제품을 위한 높은 Tg의 에폭시 시스템
JP2011516714A (ja) 2008-04-14 2011-05-26 ダウ グローバル テクノロジーズ リミティド ライアビリティ カンパニー 粉末コーティング用途に有用なエポキシ−イミダゾール触媒
WO2010075006A1 (en) 2008-12-16 2010-07-01 Dow Global Technologies Inc. Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates
US20110220512A1 (en) * 2010-03-15 2011-09-15 Rohm And Haas Electronic Materials Llc Plating bath and method
US8262895B2 (en) 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
US8268157B2 (en) 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US20140150970A1 (en) * 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
EP2562223A1 (de) * 2011-08-26 2013-02-27 Sika Technology AG Zweikomponentige Zusammensetzung auf Basis von silanfunktionellen Polymeren
US9677372B2 (en) 2013-06-06 2017-06-13 Halliburton Energy Services, Inc. Well system cementing plug
US10738583B2 (en) 2016-08-21 2020-08-11 Battelle Memorial Institute Multi-component solid epoxy proppant binder resins

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6504681A (de) * 1965-04-13 1965-06-25
US4066625A (en) * 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
FR1566468A (de) * 1968-03-04 1969-05-09
US3920678A (en) * 1968-03-15 1975-11-18 Rhein Chemie Rheinau Gmbh Process for producing 4,5,6,7-tetrahydro benzimidazoles
US3923571A (en) * 1970-12-27 1975-12-02 Nissan Motor Method of using an epoxy-resin-imidazole solder mixture
DE3211301A1 (de) * 1982-03-26 1983-09-29 Bayer Ag, 5090 Leverkusen Cyclische amidine, verfahren zu ihrer herstellung und die verwendung cyclischer amidine als katalysatoren fuer die haertung von epoxidharzen
JP2533781B2 (ja) * 1987-10-30 1996-09-11 油化シエルエポキシ株式会社 常温液状の非結晶性イミダゾ―ル誘導体組成物
US5169473A (en) * 1990-05-21 1992-12-08 The Dow Chemical Company Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions
KR930010077A (ko) * 1991-11-22 1993-06-22 알베르투스 빌헬무스 요 아네스 째스트 라텐 에폭시 이미다졸 첨가물 및 에폭시 수지 조성물
JPH08176521A (ja) * 1994-12-26 1996-07-09 Showa Denko Kk 導電性接着剤

Also Published As

Publication number Publication date
JPH11171978A (ja) 1999-06-29
EP0906927A1 (de) 1999-04-07
DE69703739D1 (de) 2001-01-25
ES2154013T3 (es) 2001-03-16
EP0906927B1 (de) 2000-12-20
US6107437A (en) 2000-08-22
JP3469101B2 (ja) 2003-11-25
ATE198212T1 (de) 2001-01-15

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: HEXCEL CORPORATION, DUBLIN, CALIF., US

8364 No opposition during term of opposition