JP2016155996A - アミノ酸及びエポキシ類の反応生成物 - Google Patents
アミノ酸及びエポキシ類の反応生成物 Download PDFInfo
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C07D303/02—Compounds containing oxirane rings
- C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
- C07D303/18—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by etherified hydroxyl radicals
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/10—Polycondensates containing more than one epoxy group per molecule of polyamines with epihalohydrins or precursors thereof
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/52—Amino carboxylic acids
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
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- Chemical Kinetics & Catalysis (AREA)
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- Polymers & Plastics (AREA)
- Electroplating And Plating Baths Therefor (AREA)
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- Epoxy Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
X’−COOH (I)
を有する芳香族化合物を含み、式中、X’は、置換された6員芳香環またはヘテロ原子が窒素である置換された芳香族の6員複素環式環である。置換基は、1つ以上の−NH2及び−OHを含む。かかる化合物を以下の表4に示す:
2つの銅電気めっき浴を、硫酸銅五水和物としての75g/Lの銅、240g/Lの硫酸、60ppmの塩化物イオン、1ppmの促進剤、及び1.5g/Lの抑制剤を組み合わせることで調製した。促進剤はビス(ナトリウムスルホプロピル)ジスルフィドであった。抑制剤は、<5,000の重量平均分子量及び末端ヒドロキシル基を有するEO/POコポリマーであった。2つの浴のうちの1つを、5cm×9.5cm、1.6mm厚さの両面FR4 PCB内の0.25mm直径の貫通孔を44分間、3.24A/dm2(30A/ft2)の電流密度で等角的にめっきするのに用いて、2つ目の浴を3.2mmの厚さの両面FR4 PCB内の0.3mm直径の貫通孔を80分間、2.16A/dm2(20A/ft2)の電流密度でめっきするのに用いた。銅電気めっきはハリング槽内で行った。各浴の温度は25℃であった。銅めっきされた試料を分析して、めっき浴の均一電着性(「TP」)、及び亀裂率を求めた。各基板から少なくとも10個の試料を分析した。結果は以下の表10に示す。
コンデンサ、温度計、及び攪拌子を装備する100mLの丸底三ツ口フラスコに、4.195g(33mmol)のトランス−3−(3−ピリジル)アクリル酸及び3.055g(33mmol)のエピクロロヒドリンを添加した。混合物を70mlのDI水で希釈し、還流下で2時間加熱した。その後、熱を取り生成物を追加の30mlのDI水で希釈し、追加で8時間攪拌させた。アクリル酸部分とエポキシド部分とのモル比は、モノマーモル比に基づいて1:1であった。
複数の銅電気めっき浴を、硫酸銅五水和物としての75g/Lの銅、240g/Lの硫酸、60ppmの塩化物イオン、1ppmの促進剤、及び1.5g/Lの抑制剤を混合して調製した。促進剤はビス(ナトリウムスルホプロピル)ジスルフィドであった。抑制剤は、<5,000の重量平均分子量及び末端ヒドロキシル基を有するEO/POコポリマーであった。各電気めっき浴はまた、表12に示すように実施例7からの反応生成物を1〜50ppmの量で含有した。反応生成物は精製することなく用いられた。
2.16A/dm2の電流密度を複数の0.3mm直径の貫通孔を有する3.2mm厚さの両面FR4 PCBに80分間適用したこと以外は、実施例8の方法を繰り返した。レベラー濃度は20ppmまたは50ppmであった。結果は以下の表13に示す。
トランス−3−(3−ピリジル)アクリル酸(73mmol)を室温で丸底反応フラスコに添加した。次に、20mLのDI水を混合物に添加した。溶液を85℃に加熱した。形成された懸濁液は、少量の硫酸を添加した後に消滅した。次に、1,4−ブタンジオールジグリシジルエーテル(73mmol)を、滴下漏斗を用いて滴下添加した。反応混合物を95℃に設定した油浴を用いて追加で6時間加熱して、さらに8時間、室温で攪拌させた。得られた琥珀色の反応生成物を保管容器に移し、すすぎ、酸性化水で希釈した。反応生成物溶液はさらに精製することなく用いられた。アクリル酸部分とエポキシド部分とのモル比は、モノマーモル比に基づいて1:1であった。
複数の銅電気めっき浴を、硫酸銅五水和物としての75g/Lの銅、240g/Lの硫酸、60ppmの塩化物イオン、1ppmの促進剤、及び1.5g/Lの抑制剤を組み合わせることで調製した。促進剤はビス(ナトリウムスルホプロピル)ジスルフィドであった。抑制剤は<5,000の重量平均分子量及び末端ヒドロキシル基を有するEO/POコポリマーであった。各電気めっき浴はまた、実施例10からの反応生成物を、表15に示すように1〜50ppmの量で含有した。反応生成物は精製することなく用いられた。
2.16A/dm2の電流密度を複数の0.3mm直径の貫通孔を有する3.2mm厚さの両面FR4 PCBに80分間適用したこと以外は、実施例11の方法を繰り返した。レベラー濃度は20ppmまたは50ppmであった。結果を以下の表16に示す。
Claims (10)
- 1種以上のアミノ酸及び1種以上のエポキシ類の反応生成物を含む、化合物。
- 前記反応生成物は1種以上の非アミノ酸のアミンをさらに含む、請求項1に記載の前記化合物。
- 前記1種以上のアミノ酸は、α−アミノ酸、β−アミノ酸、及びγ−アミノ酸から選択される、請求項1に記載の前記化合物。
- 前記1種以上のα−アミノ酸は、アルギニン、アラニン、グリシン、トリプトファン、アスパラギン、リジン、ヒスチジン、チロシン、グルタミン、プロリン、及びその塩から選択される、請求項3に記載の前記化合物。
- 前記アミノ酸からの部分と前記エポキシドからの部分とのモル比は、0.5:2〜2:0.5の範囲である、請求項1に記載の前記化合物。
- 前記1種以上のエポキシド化合物は以下の式を有し、
- 1つ以上の銅イオン源と、電解質と、1種以上のアミノ酸及び1種以上のエポキシ類の反応生成物を含む1つ以上の化合物と、を含む、組成物。
- a)基板を提供することと、
b)1つ以上の銅イオン源と、電解質と、1種以上のアミノ酸及び1種以上のエポキシ類の反応生成物を含む1つ以上の化合物と、を含む組成物を提供することと、
c)基板に前記組成物を接触させることと、
d)前記基板及び前記組成物に電流を印加することと、
e)前記基板に銅または銅合金を析出させることと、を含む、方法。 - 前記1つ以上の源または金属イオンは、銅塩及びスズ塩から選択される、請求項8に記載の前記方法。
- 前記基板は、貫通孔、トレンチ、及びビアのうちの1種以上を複数で含む、請求項8に記載の前記方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US14/585,228 US9783905B2 (en) | 2014-12-30 | 2014-12-30 | Reaction products of amino acids and epoxies |
US14/585,228 | 2014-12-30 |
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JP2016155996A true JP2016155996A (ja) | 2016-09-01 |
JP6349297B2 JP6349297B2 (ja) | 2018-06-27 |
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JP2015245002A Active JP6349297B2 (ja) | 2014-12-30 | 2015-12-16 | アミノ酸及びエポキシ類の反応生成物 |
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US (2) | US9783905B2 (ja) |
EP (1) | EP3040451B1 (ja) |
JP (1) | JP6349297B2 (ja) |
KR (1) | KR101779414B1 (ja) |
CN (1) | CN105732955B (ja) |
TW (1) | TWI607120B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017222925A (ja) * | 2016-03-29 | 2017-12-21 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | メガサイズのフォトレジスト画定フィーチャを電気めっきすることが可能な電気銅めっき浴及び電気めっき方法 |
CN108588770A (zh) * | 2018-05-04 | 2018-09-28 | 瑞声科技(新加坡)有限公司 | 压延铜遮光圈片制备方法及压延铜遮光圈片 |
JP2019019405A (ja) * | 2017-07-14 | 2019-02-07 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | アルギニンとビスエポキシドとのコポリマーを含むニッケル電気めっき組成物及びニッケルを電気めっきする方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107778455A (zh) * | 2017-11-13 | 2018-03-09 | 常州大学 | 一种氨基酸改性自乳化环氧树脂的制备方法 |
CN109989076A (zh) * | 2017-12-29 | 2019-07-09 | 广东东硕科技有限公司 | 一种整平剂 |
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KR102319041B1 (ko) * | 2018-08-28 | 2021-10-29 | 가부시끼가이샤 제이씨유 | 전기 동도금욕 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56109218A (en) * | 1980-01-25 | 1981-08-29 | Shell Int Research | Thermosetting binder* its manufacture and its use in lacquer |
JPH10102277A (ja) * | 1996-10-01 | 1998-04-21 | Daiwa Kasei Kenkyusho:Kk | 光沢錫−銀合金電気めっき浴 |
US20020060157A1 (en) * | 2000-10-20 | 2002-05-23 | Shipley Company, L.L.C. | Electroplating bath control |
JP2004035980A (ja) * | 2002-07-05 | 2004-02-05 | Nippon New Chrome Kk | 銅―錫合金めっき用ピロリン酸浴 |
JP2005528938A (ja) * | 2002-04-10 | 2005-09-29 | ケラプラスト テクノロジーズ, リミテッド | タンパク質様網目構造を有する組織欠損被覆材 |
JP2011207878A (ja) * | 2010-03-15 | 2011-10-20 | Rohm & Haas Electronic Materials Llc | めっき浴および方法 |
JP2012255217A (ja) * | 2012-08-23 | 2012-12-27 | Rohm & Haas Electronic Materials Llc | 銅めっき方法 |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL274938A (ja) | 1961-02-22 | |||
US3975346A (en) | 1968-10-31 | 1976-08-17 | Ppg Industries, Inc. | Boron-containing, quaternary ammonium salt-containing resin compositions |
US3655534A (en) | 1970-02-24 | 1972-04-11 | Enthone | Alkaline bright zinc electroplating |
US3689544A (en) * | 1971-06-14 | 1972-09-05 | Grace W R & Co | Process for preparing chelating agents |
US4062739A (en) | 1973-04-04 | 1977-12-13 | W. Canning Limited | Electroplating zinc or cadmium and additive composition therefor |
US4038161A (en) | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
US4356277A (en) * | 1977-03-08 | 1982-10-26 | Ppg Industries, Inc. | Reaction products of a polyglycidyl ether of a polyphenol and an amino acid and aqueous solubilized products therefrom |
US4081336A (en) | 1977-04-07 | 1978-03-28 | The Richardson Company | Alkaline bright zinc plating and additive therefor |
US4166778A (en) | 1978-05-17 | 1979-09-04 | Simeon Acimovic | Cyanide-free alkaline zinc baths |
FR2433061A1 (fr) | 1978-08-08 | 1980-03-07 | Popescu Francine | Bain alcalin pour l'electrodeposition du zinc brillant |
US4169772A (en) | 1978-11-06 | 1979-10-02 | R. O. Hull & Company, Inc. | Acid zinc plating baths, compositions useful therein, and methods for electrodepositing bright zinc deposits |
US4251331A (en) | 1980-01-17 | 1981-02-17 | Columbia Chemical Corporation | Baths and additives for the electroplating of bright zinc |
DE3114830A1 (de) | 1981-04-11 | 1982-11-04 | Bayer Ag, 5090 Leverkusen | Verfahren zur herstellung von amino-arylsulfonsaeuren |
JPS6165555A (ja) | 1984-09-05 | 1986-04-04 | Mitsubishi Electric Corp | ホームコントロールシステムおよびインターホンシステム |
EP0289689A1 (en) | 1987-05-08 | 1988-11-09 | APITAL PRODUZIONI INDUSTRIALI S.p.A. | Process for the preparation of amino aryl sulfonic acids |
GB8822145D0 (en) | 1988-09-21 | 1988-10-26 | Ciba Geigy Ag | Method |
US5232575A (en) | 1990-07-26 | 1993-08-03 | Mcgean-Rohco, Inc. | Polymeric leveling additive for acid electroplating baths |
US5684195A (en) | 1994-07-14 | 1997-11-04 | G. D. Searle & Co. | Method of preparing sulfmonamides from sulfones |
DE19758121C2 (de) | 1997-12-17 | 2000-04-06 | Atotech Deutschland Gmbh | Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten |
AU2107000A (en) | 1999-01-21 | 2000-08-07 | Ciba Specialty Chemicals Holding Inc. | Perfluoroalkyl-substituted amino acid oligomers or polymers and their use as foam stabilizers in aqueous fire-fighting-foam agents and as oil repellent paper and textile finishes |
JP2001073182A (ja) | 1999-07-15 | 2001-03-21 | Boc Group Inc:The | 改良された酸性銅電気メッキ用溶液 |
US6380429B1 (en) | 1999-09-28 | 2002-04-30 | E. I. Du Pont Nemours And Company | Preparation of sulfonyl imine compounds |
US6436269B1 (en) | 2000-10-19 | 2002-08-20 | Atotech Deutschland Gmbh | Plating bath and method for electroplating tin-zinc alloys |
US6610192B1 (en) | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
US6800188B2 (en) | 2001-05-09 | 2004-10-05 | Ebara-Udylite Co., Ltd. | Copper plating bath and plating method for substrate using the copper plating bath |
JP2004250777A (ja) | 2002-06-03 | 2004-09-09 | Shipley Co Llc | レベラー化合物 |
US20040062793A1 (en) | 2002-07-05 | 2004-04-01 | Dyke Mark Van | Tissue defect dressings comprising proteinaceous networks |
US7128822B2 (en) | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
TW200613586A (en) | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
EP1741804B1 (en) * | 2005-07-08 | 2016-04-27 | Rohm and Haas Electronic Materials, L.L.C. | Electrolytic copper plating method |
US7662981B2 (en) * | 2005-07-16 | 2010-02-16 | Rohm And Haas Electronic Materials Llc | Leveler compounds |
TWI328622B (en) | 2005-09-30 | 2010-08-11 | Rohm & Haas Elect Mat | Leveler compounds |
JP5558675B2 (ja) | 2007-04-03 | 2014-07-23 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 金属メッキ組成物 |
TWI391456B (zh) | 2007-04-03 | 2013-04-01 | 羅門哈斯電子材料有限公司 | 金屬電鍍組成物及其方法 |
US7887693B2 (en) | 2007-06-22 | 2011-02-15 | Maria Nikolova | Acid copper electroplating bath composition |
JP2009041097A (ja) | 2007-08-10 | 2009-02-26 | Rohm & Haas Electronic Materials Llc | 銅めっき方法 |
ATE506468T1 (de) | 2008-04-28 | 2011-05-15 | Atotech Deutschland Gmbh | Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer |
KR20100003799A (ko) | 2008-07-02 | 2010-01-12 | 웅진케미칼 주식회사 | 높은 안티파울링성을 가지는 선택적 분리막 및 그의제조방법 |
ES2788080T3 (es) | 2009-09-08 | 2020-10-20 | Atotech Deutschland Gmbh | Polímeros con grupos terminales amino y su uso como aditivos para baños galvanoplásticos de zinc y de aleaciones de zinc |
JP5637671B2 (ja) | 2009-09-16 | 2014-12-10 | 上村工業株式会社 | 電気銅めっき浴及びその電気銅めっき浴を用いた電気めっき方法 |
EP2504396B1 (en) * | 2009-11-27 | 2021-02-24 | Basf Se | Composition for copper electroplating comprising leveling agent |
US20110220512A1 (en) | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
US8262895B2 (en) | 2010-03-15 | 2012-09-11 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
JP2012127003A (ja) * | 2010-12-15 | 2012-07-05 | Rohm & Haas Electronic Materials Llc | 銅層を均一にする電気めっき方法 |
US8747643B2 (en) | 2011-08-22 | 2014-06-10 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
US8454815B2 (en) | 2011-10-24 | 2013-06-04 | Rohm And Haas Electronics Materials Llc | Plating bath and method |
-
2014
- 2014-12-30 US US14/585,228 patent/US9783905B2/en active Active
-
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- 2015-11-16 EP EP15194686.0A patent/EP3040451B1/en active Active
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- 2017-04-12 US US15/485,454 patent/US10041182B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56109218A (en) * | 1980-01-25 | 1981-08-29 | Shell Int Research | Thermosetting binder* its manufacture and its use in lacquer |
JPH10102277A (ja) * | 1996-10-01 | 1998-04-21 | Daiwa Kasei Kenkyusho:Kk | 光沢錫−銀合金電気めっき浴 |
US20020060157A1 (en) * | 2000-10-20 | 2002-05-23 | Shipley Company, L.L.C. | Electroplating bath control |
JP2005528938A (ja) * | 2002-04-10 | 2005-09-29 | ケラプラスト テクノロジーズ, リミテッド | タンパク質様網目構造を有する組織欠損被覆材 |
JP2004035980A (ja) * | 2002-07-05 | 2004-02-05 | Nippon New Chrome Kk | 銅―錫合金めっき用ピロリン酸浴 |
JP2011207878A (ja) * | 2010-03-15 | 2011-10-20 | Rohm & Haas Electronic Materials Llc | めっき浴および方法 |
JP2012255217A (ja) * | 2012-08-23 | 2012-12-27 | Rohm & Haas Electronic Materials Llc | 銅めっき方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017222925A (ja) * | 2016-03-29 | 2017-12-21 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | メガサイズのフォトレジスト画定フィーチャを電気めっきすることが可能な電気銅めっき浴及び電気めっき方法 |
JP2019019405A (ja) * | 2017-07-14 | 2019-02-07 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | アルギニンとビスエポキシドとのコポリマーを含むニッケル電気めっき組成物及びニッケルを電気めっきする方法 |
CN108588770A (zh) * | 2018-05-04 | 2018-09-28 | 瑞声科技(新加坡)有限公司 | 压延铜遮光圈片制备方法及压延铜遮光圈片 |
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TW201623698A (zh) | 2016-07-01 |
US9783905B2 (en) | 2017-10-10 |
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TWI607120B (zh) | 2017-12-01 |
US10041182B2 (en) | 2018-08-07 |
US20170218533A1 (en) | 2017-08-03 |
KR20160081816A (ko) | 2016-07-08 |
CN105732955B (zh) | 2018-12-25 |
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US20160186346A1 (en) | 2016-06-30 |
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