JP2011082141A - 発光装置および照明装置 - Google Patents
発光装置および照明装置 Download PDFInfo
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- JP2011082141A JP2011082141A JP2010172717A JP2010172717A JP2011082141A JP 2011082141 A JP2011082141 A JP 2011082141A JP 2010172717 A JP2010172717 A JP 2010172717A JP 2010172717 A JP2010172717 A JP 2010172717A JP 2011082141 A JP2011082141 A JP 2011082141A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
【解決手段】発光装置は、セラミックス製の基板(25)、複数の発光素子(28)および押圧部材(33, 34)を備えている。基板(25)は、放熱部材(2)に接する第1の面(25a)と、第1の面(25a)の反対側に位置された第2の面(25b)と、第1の面(25a)の外周縁と第2の面(25b)の外周縁との間に跨る外周面(25c)と、を有する。発光素子(28)は、基板(25)の第2の面(25b)に実装されている。押圧部材(33, 34)は、基板(25)を放熱部材(2)に向けて弾性的に押圧するとともに、押圧部材(33, 34)と基板(25)の外周面(25c)との間に隙間(g)が設けられている。
【選択図】図3
Description
Claims (7)
- 放熱部材に接する第1の面と、第1の面の反対側に位置された第2の面と、第1の面の外周縁と第2の面の外周縁との間に跨る外周面と、を有するセラミックス製の基板と;
前記基板の第2の面に実装された複数の発光素子と;
前記基板を前記放熱部材に向けて弾性的に押圧するとともに、前記基板の前記外周面との間に隙間が設けられた押圧部材と;
を具備したことを特徴とする発光装置。 - 請求項1に記載の発光装置において、前記押圧部材は、前記基板に前記放熱部材に向かう荷重を付与するとともに、前記基板に付与される荷重が200g〜300gに設定されていることを特徴とする発光装置。
- 請求項1に記載の発光装置において、前記基板の前記第2の面に配置された給電端子をさらに備えており、前記押圧部材は、前記給電端子に弾性的に接することで前記基板に前記放熱部材に向かう荷重を付与するとともに、前記基板に付与される荷重が70g〜300gに設定されていることを特徴とする発光装置。
- 放熱部材を含む本体と;
前記本体に支持された請求項1ないし請求項3のいずれかに記載された発光装置と;
前記本体に設けられ、前記発光装置を点灯させる点灯装置と;
を具備したことを特徴とする照明装置。 - 請求項4に記載の照明装置において、前記発光装置の前記押圧部材は、金属製の板ばねであり、前記板ばねは、前記本体に固定された固定部と、前記基板の第2の面に弾性的に接する押圧部と、前記固定部と前記押圧部との間に跨る起立部と、を有し、前記隙間は、前記起立部と前記基板の外周面との間に設けられていることを特徴とする照明装置。
- 請求項5に記載の照明装置において、前記発光装置は、前記基板の前記第2の面に配置された給電端子をさらに備えており、前記板ばねの前記押圧部は、前記給電端子に弾性的に接していることを特徴とする照明装置。
- 請求項4に記載の照明装置において、前記発光装置は、前記基板の第2の面に配置された給電端子をさらに備えており、前記発光装置の前記押圧部材は、前記本体に支持されたホルダと、前記ホルダに設けられた弾性変形が可能な接触子と、を含み、
前記隙間は、前記ホルダと前記基板の前記外周面との間に設けられているとともに、前記接触子は、前記給電端子に弾性的に接することで前記基板に荷重を付与することを特徴とする照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010172717A JP5601512B2 (ja) | 2009-09-14 | 2010-07-30 | 発光装置および照明装置 |
CN2010102793033A CN102022640B (zh) | 2009-09-14 | 2010-09-09 | 发光装置及照明装置 |
EP10009465A EP2295844A3 (en) | 2009-09-14 | 2010-09-10 | Light-emitting device and illumination device |
US12/880,490 US8360606B2 (en) | 2009-09-14 | 2010-09-13 | Light-emitting device and illumination device |
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JP2009212502 | 2009-09-14 | ||
JP2009212502 | 2009-09-14 | ||
JP2010172717A JP5601512B2 (ja) | 2009-09-14 | 2010-07-30 | 発光装置および照明装置 |
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Publication Number | Publication Date |
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JP2011082141A true JP2011082141A (ja) | 2011-04-21 |
JP5601512B2 JP5601512B2 (ja) | 2014-10-08 |
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JP2010172717A Active JP5601512B2 (ja) | 2009-09-14 | 2010-07-30 | 発光装置および照明装置 |
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US (1) | US8360606B2 (ja) |
EP (1) | EP2295844A3 (ja) |
JP (1) | JP5601512B2 (ja) |
CN (1) | CN102022640B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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US10203096B2 (en) | 2017-06-28 | 2019-02-12 | Conservation Technology of Illinois LLC | Powering and fastening a light emitting diode or chip-on-board component to a heatsink |
US11168879B2 (en) * | 2020-02-28 | 2021-11-09 | Omachron Intellectual Property Inc. | Light source |
CN113013114A (zh) * | 2021-02-24 | 2021-06-22 | 同辉电子科技股份有限公司 | 一种新型led芯片 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0192705U (ja) * | 1987-12-14 | 1989-06-19 | ||
JP2008153080A (ja) * | 2006-12-18 | 2008-07-03 | Ichikoh Ind Ltd | 発光ダイオードの固定構造 |
JP2008198398A (ja) * | 2007-02-08 | 2008-08-28 | Sony Corp | バックライト装置及び表示装置 |
JP2009004130A (ja) * | 2007-06-19 | 2009-01-08 | Sharp Corp | 照明装置 |
JP2010278127A (ja) * | 2009-05-27 | 2010-12-09 | Panasonic Corp | 発光モジュールおよび照明装置 |
Family Cites Families (98)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US356107A (en) * | 1887-01-18 | Ella b | ||
US534038A (en) * | 1895-02-12 | Dynamo-electric machine | ||
US534665A (en) * | 1895-02-26 | Method of casting projectiles | ||
GB1601461A (en) | 1977-05-21 | 1981-10-28 | Amp Inc | Electrical junction box |
JPS57152706A (en) | 1981-03-17 | 1982-09-21 | T C Denshi Kk | Antenna |
US4503360A (en) | 1982-07-26 | 1985-03-05 | North American Philips Lighting Corporation | Compact fluorescent lamp unit having segregated air-cooling means |
JPH0617298B2 (ja) | 1984-07-26 | 1994-03-09 | サンスタ−株式会社 | 義歯洗浄剤 |
JPS62190366A (ja) | 1986-02-13 | 1987-08-20 | 日本水産株式会社 | 合成含気氷ならびにその製造方法 |
JPS635581A (ja) | 1986-06-25 | 1988-01-11 | Semiconductor Res Found | 抵抗器内装型led表示灯の放熱方法 |
JPS63102265A (ja) | 1986-10-20 | 1988-05-07 | Agency Of Ind Science & Technol | 半導体装置の製造方法 |
JPS647204A (en) | 1987-06-30 | 1989-01-11 | Fanuc Ltd | Preparation of nc data for rough working |
JPH01206505A (ja) | 1988-02-12 | 1989-08-18 | Toshiba Corp | けい光ランプ装置 |
JPH0291105A (ja) | 1988-09-28 | 1990-03-30 | Japan Synthetic Rubber Co Ltd | ポリブタジエン |
USD356107S (en) | 1992-05-15 | 1995-03-07 | Fujitsu Limited | Developing cartridge for copier |
JP3121916B2 (ja) | 1992-06-25 | 2001-01-09 | 矢橋工業株式会社 | 石灰焼結体の製造方法 |
US5537301A (en) | 1994-09-01 | 1996-07-16 | Pacific Scientific Company | Fluorescent lamp heat-dissipating apparatus |
EP0835408B1 (en) | 1995-06-29 | 2001-08-22 | Siemens Microelectronics, Inc. | Localized illumination using tir technology |
US6095668A (en) | 1996-06-19 | 2000-08-01 | Radiant Imaging, Inc. | Incandescent visual display system having a shaped reflector |
US5785418A (en) | 1996-06-27 | 1998-07-28 | Hochstein; Peter A. | Thermally protected LED array |
US5857767A (en) | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
JP2000083343A (ja) | 1998-09-03 | 2000-03-21 | Mitsubishi Electric Corp | モーターフレーム及びモーターフレームの製造方法 |
JP4290887B2 (ja) | 1998-09-17 | 2009-07-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Led電球 |
JP3753291B2 (ja) | 1998-09-30 | 2006-03-08 | 東芝ライテック株式会社 | 電球形蛍光ランプ |
JP2001243809A (ja) | 2000-02-28 | 2001-09-07 | Mitsubishi Electric Lighting Corp | Led電球 |
US6814470B2 (en) | 2000-05-08 | 2004-11-09 | Farlight Llc | Highly efficient LED lamp |
US6582100B1 (en) * | 2000-08-09 | 2003-06-24 | Relume Corporation | LED mounting system |
US6517217B1 (en) | 2000-09-18 | 2003-02-11 | Hwa Hsia Glass Co., Ltd. | Ornamental solar lamp assembly |
JP2002280617A (ja) | 2001-03-19 | 2002-09-27 | Matsushita Electric Ind Co Ltd | 照明装置 |
JP4674418B2 (ja) | 2001-06-29 | 2011-04-20 | パナソニック株式会社 | 照明装置 |
JP4076329B2 (ja) | 2001-08-13 | 2008-04-16 | エイテックス株式会社 | Led電球 |
JP2003059330A (ja) | 2001-08-16 | 2003-02-28 | Matsushita Electric Works Ltd | Led照明器具 |
JP2003092022A (ja) | 2001-09-19 | 2003-03-28 | Yamada Shomei Kk | 照明器具の放熱構造及び照明器具 |
US6942365B2 (en) | 2002-12-10 | 2005-09-13 | Robert Galli | LED lighting assembly |
KR100991830B1 (ko) | 2001-12-29 | 2010-11-04 | 항조우 후양 신잉 띠앤즈 리미티드 | Led 및 led램프 |
US6936855B1 (en) | 2002-01-16 | 2005-08-30 | Shane Harrah | Bendable high flux LED array |
JP2004006096A (ja) | 2002-05-31 | 2004-01-08 | Nippon Seiki Co Ltd | 照明装置 |
US7188980B2 (en) | 2002-12-02 | 2007-03-13 | Honda Motor Co., Ltd. | Head light system |
US7153004B2 (en) | 2002-12-10 | 2006-12-26 | Galli Robert D | Flashlight housing |
JP2004193053A (ja) | 2002-12-13 | 2004-07-08 | Toshiba Lighting & Technology Corp | 電球形蛍光ランプおよび照明器具 |
US6964501B2 (en) | 2002-12-24 | 2005-11-15 | Altman Stage Lighting Co., Ltd. | Peltier-cooled LED lighting assembly |
JP4038136B2 (ja) | 2003-01-13 | 2008-01-23 | シーシーエス株式会社 | パワーledを利用したスポット照明装置 |
JP3885032B2 (ja) | 2003-02-28 | 2007-02-21 | 松下電器産業株式会社 | 蛍光ランプ |
JP4236544B2 (ja) | 2003-09-12 | 2009-03-11 | 三洋電機株式会社 | 照明装置 |
US6982518B2 (en) | 2003-10-01 | 2006-01-03 | Enertron, Inc. | Methods and apparatus for an LED light |
US6942360B2 (en) * | 2003-10-01 | 2005-09-13 | Enertron, Inc. | Methods and apparatus for an LED light engine |
US7144135B2 (en) | 2003-11-26 | 2006-12-05 | Philips Lumileds Lighting Company, Llc | LED lamp heat sink |
JP2005166578A (ja) | 2003-12-05 | 2005-06-23 | Hamai Denkyu Kogyo Kk | 電球形ledランプ |
US7198387B1 (en) | 2003-12-18 | 2007-04-03 | B/E Aerospace, Inc. | Light fixture for an LED-based aircraft lighting system |
JP4343720B2 (ja) * | 2004-01-23 | 2009-10-14 | 株式会社小糸製作所 | 灯具 |
US6948829B2 (en) | 2004-01-28 | 2005-09-27 | Dialight Corporation | Light emitting diode (LED) light bulbs |
JP2005217354A (ja) * | 2004-02-02 | 2005-08-11 | Sumitomo Wiring Syst Ltd | 発光素子ユニット |
DE102004042186B4 (de) | 2004-08-31 | 2010-07-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
US20050218385A1 (en) * | 2004-10-30 | 2005-10-06 | Larry Lemelson | Appliance for safe lifting and method for its use |
US7165866B2 (en) | 2004-11-01 | 2007-01-23 | Chia Mao Li | Light enhanced and heat dissipating bulb |
JP2005123200A (ja) | 2004-11-04 | 2005-05-12 | Toshiba Lighting & Technology Corp | 電球形蛍光ランプ |
US7144140B2 (en) | 2005-02-25 | 2006-12-05 | Tsung-Ting Sun | Heat dissipating apparatus for lighting utility |
JP2006244725A (ja) | 2005-02-28 | 2006-09-14 | Atex Co Ltd | Led照明装置 |
US7255460B2 (en) | 2005-03-23 | 2007-08-14 | Nuriplan Co., Ltd. | LED illumination lamp |
JP4379731B2 (ja) * | 2005-04-01 | 2009-12-09 | 住友電装株式会社 | 発光装置 |
US7758223B2 (en) | 2005-04-08 | 2010-07-20 | Toshiba Lighting & Technology Corporation | Lamp having outer shell to radiate heat of light source |
US7226189B2 (en) | 2005-04-15 | 2007-06-05 | Taiwan Oasis Technology Co., Ltd. | Light emitting diode illumination apparatus |
USD534665S1 (en) | 2005-04-15 | 2007-01-02 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
USD535038S1 (en) | 2005-04-15 | 2007-01-09 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
US7744256B2 (en) * | 2006-05-22 | 2010-06-29 | Edison Price Lighting, Inc. | LED array wafer lighting fixture |
US7862201B2 (en) | 2005-07-20 | 2011-01-04 | Tbt Asset Management International Limited | Fluorescent lamp for lighting applications |
WO2007030542A2 (en) | 2005-09-06 | 2007-03-15 | Lsi Industries, Inc. | Linear lighting system |
JP4715422B2 (ja) | 2005-09-27 | 2011-07-06 | 日亜化学工業株式会社 | 発光装置 |
JP4535453B2 (ja) * | 2006-03-06 | 2010-09-01 | 株式会社小糸製作所 | 光源モジュール及び車輌用灯具 |
WO2007128070A1 (en) * | 2006-05-10 | 2007-11-15 | Spa Electrics Pty Ltd | Assembly including a fastening device |
TWM309051U (en) | 2006-06-12 | 2007-04-01 | Grand Halo Technology Co Ltd | Light-emitting device |
JP2008016362A (ja) * | 2006-07-07 | 2008-01-24 | Koito Mfg Co Ltd | 発光モジュール及び車輌用灯具 |
US7396146B2 (en) | 2006-08-09 | 2008-07-08 | Augux Co., Ltd. | Heat dissipating LED signal lamp source structure |
DE202006017583U1 (de) * | 2006-11-17 | 2008-03-27 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Beleuchtungsvorrichtung |
US7510400B2 (en) * | 2007-03-14 | 2009-03-31 | Visteon Global Technologies, Inc. | LED interconnect spring clip assembly |
WO2008146694A1 (ja) | 2007-05-23 | 2008-12-04 | Sharp Kabushiki Kaisha | 照明装置 |
FR2922295B1 (fr) * | 2007-10-12 | 2009-12-04 | In Novea | Module d'eclairage comportant plusieurs diodes electroluminescentes et ensemble d'eclairage comprenant un tel module |
JP4569683B2 (ja) | 2007-10-16 | 2010-10-27 | 東芝ライテック株式会社 | 発光素子ランプ及び照明器具 |
DE102007055133A1 (de) * | 2007-11-19 | 2009-05-20 | Osram Gesellschaft mit beschränkter Haftung | Beleuchtungsvorrichtung mit einem Kühlkörper |
US7625104B2 (en) * | 2007-12-13 | 2009-12-01 | Philips Lumileds Lighting Company, Llc | Light emitting diode for mounting to a heat sink |
US7762829B2 (en) * | 2007-12-27 | 2010-07-27 | Tyco Electronics Corporation | Connector assembly for termination of miniature electronics |
JP5353216B2 (ja) | 2008-01-07 | 2013-11-27 | 東芝ライテック株式会社 | Led電球及び照明器具 |
EP2256402A4 (en) | 2008-06-27 | 2012-08-15 | Toshiba Lighting & Technology | LAMP WITH LIGHT-EMITTING ELEMENT AND LIGHTING BODY |
CN102175000B (zh) | 2008-07-30 | 2013-11-06 | 东芝照明技术株式会社 | 灯装置及照明器具 |
US7919339B2 (en) | 2008-09-08 | 2011-04-05 | Iledm Photoelectronics, Inc. | Packaging method for light emitting diode module that includes fabricating frame around substrate |
DE202008016231U1 (de) | 2008-12-08 | 2009-03-05 | Huang, Tsung-Hsien, Yuan Shan | Wärmeableiter-Modul |
JP5333758B2 (ja) | 2009-02-27 | 2013-11-06 | 東芝ライテック株式会社 | 照明装置および照明器具 |
US20100289393A1 (en) | 2009-05-18 | 2010-11-18 | Hok Product Design, Llc | Integrated Recycling System |
JP5348410B2 (ja) | 2009-06-30 | 2013-11-20 | 東芝ライテック株式会社 | 口金付ランプおよび照明器具 |
JP5354191B2 (ja) | 2009-06-30 | 2013-11-27 | 東芝ライテック株式会社 | 電球形ランプおよび照明器具 |
JP2011049527A (ja) | 2009-07-29 | 2011-03-10 | Toshiba Lighting & Technology Corp | Led照明装置 |
JP5601512B2 (ja) | 2009-09-14 | 2014-10-08 | 東芝ライテック株式会社 | 発光装置および照明装置 |
JP2011071242A (ja) | 2009-09-24 | 2011-04-07 | Toshiba Lighting & Technology Corp | 発光装置及び照明装置 |
US8324789B2 (en) | 2009-09-25 | 2012-12-04 | Toshiba Lighting & Technology Corporation | Self-ballasted lamp and lighting equipment |
CN102032480B (zh) | 2009-09-25 | 2013-07-31 | 东芝照明技术株式会社 | 灯泡型灯以及照明器具 |
JP2011091033A (ja) | 2009-09-25 | 2011-05-06 | Toshiba Lighting & Technology Corp | 発光モジュール、電球形ランプおよび照明器具 |
CN102032481B (zh) | 2009-09-25 | 2014-01-08 | 东芝照明技术株式会社 | 附带灯口的照明灯及照明器具 |
US8602593B2 (en) * | 2009-10-15 | 2013-12-10 | Cree, Inc. | Lamp assemblies and methods of making the same |
JP5257622B2 (ja) | 2010-02-26 | 2013-08-07 | 東芝ライテック株式会社 | 電球形ランプおよび照明器具 |
-
2010
- 2010-07-30 JP JP2010172717A patent/JP5601512B2/ja active Active
- 2010-09-09 CN CN2010102793033A patent/CN102022640B/zh active Active
- 2010-09-10 EP EP10009465A patent/EP2295844A3/en not_active Withdrawn
- 2010-09-13 US US12/880,490 patent/US8360606B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0192705U (ja) * | 1987-12-14 | 1989-06-19 | ||
JP2008153080A (ja) * | 2006-12-18 | 2008-07-03 | Ichikoh Ind Ltd | 発光ダイオードの固定構造 |
JP2008198398A (ja) * | 2007-02-08 | 2008-08-28 | Sony Corp | バックライト装置及び表示装置 |
JP2009004130A (ja) * | 2007-06-19 | 2009-01-08 | Sharp Corp | 照明装置 |
JP2010278127A (ja) * | 2009-05-27 | 2010-12-09 | Panasonic Corp | 発光モジュールおよび照明装置 |
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JP2012230770A (ja) * | 2011-04-25 | 2012-11-22 | Jst Mfg Co Ltd | Led照明用電気的接続装置及びハーネス |
US10006620B2 (en) | 2011-08-09 | 2018-06-26 | Lg Innotek Co., Ltd. | Lighting device |
JP2014522090A (ja) * | 2011-08-09 | 2014-08-28 | エルジー イノテック カンパニー リミテッド | 照明装置 |
JP2014525687A (ja) * | 2011-09-02 | 2014-09-29 | クリー インコーポレイテッド | 発光装置、システム、及び方法 |
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Also Published As
Publication number | Publication date |
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EP2295844A3 (en) | 2013-02-27 |
CN102022640A (zh) | 2011-04-20 |
EP2295844A2 (en) | 2011-03-16 |
US8360606B2 (en) | 2013-01-29 |
CN102022640B (zh) | 2013-06-26 |
US20110063842A1 (en) | 2011-03-17 |
JP5601512B2 (ja) | 2014-10-08 |
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