JP6157022B2 - ヒートシンク構造を有する照明装置 - Google Patents
ヒートシンク構造を有する照明装置 Download PDFInfo
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- JP6157022B2 JP6157022B2 JP2015525997A JP2015525997A JP6157022B2 JP 6157022 B2 JP6157022 B2 JP 6157022B2 JP 2015525997 A JP2015525997 A JP 2015525997A JP 2015525997 A JP2015525997 A JP 2015525997A JP 6157022 B2 JP6157022 B2 JP 6157022B2
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- lid
- heat sink
- sink structure
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- Expired - Fee Related
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- 238000000034 method Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 10
- 238000005286 illumination Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 239000012777 electrically insulating material Substances 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 17
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
- F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Description
電子部品キャリア20第1部分21は、以下で、光源部21と称されることができ、電子部品キャリア20の前記第2部分22は、ドライバ部22と称されることができる。
Claims (14)
- 光源と、
前記光源を担持するための第1部分及び前記光源に電気的接続を提供するための第2部分を有する電子部品キャリアと、
前記電子部品キャリアからの熱の放散のために配され、キャビティを規定するヒートシンク構造であって、前記ヒートシンク構造は、前記ヒートシンク構造の開口に配される第1の蓋部及び第2の蓋部を有し、前記第1の蓋部及び前記第2の蓋部は、前記キャビティの蓋を形成し、折り畳まれた位置において前記開口を実質的に閉じる、ヒートシンク構造と、
を有する照明装置であって、
前記折り畳まれた位置において前記第1の蓋部及び前記第2の蓋部は孔を規定し、前記電子部品キャリアは前記孔を通って延在し、
前記電子部品キャリアの前記第1部分は、前記キャビティの外側において前記第1の蓋部により支持され、前記電子部品キャリアの前記第2部分は、前記キャビティ内において前記ヒートシンク構造によって少なくとも部分的に囲まれていて、
前記第2の蓋部は、前記第1の蓋部に部分的に重なり、前記折り畳まれた位置において前記電子部品キャリアの前記第1部分を前記第1の蓋部にクランプする、照明装置。 - 前記ヒートシンク構造並びに前記第1の蓋部及び前記第2の蓋部は、単一材料により形成される、請求項1に記載の照明装置。
- 前記ヒートシンク構造並びに前記第1の蓋部及び前記第2の蓋部は、シートメタルを有する、請求項1又は2に記載の照明装置。
- 前記第1の蓋部及び前記第2の蓋部の少なくとも1つは、係止手段によって折り畳まれた位置において固定されている、請求項2に記載の照明装置。
- 前記ヒートシンク構造を少なくとも部分的に囲んでいるハウジングを更に有する、請求項1乃至4の何れか一項に記載の照明装置。
- 前記ヒートシンク構造の外側の形状は、前記ハウジングの内側形状に少なくとも部分的に一致している、請求項5に記載の照明装置。
- 前記ハウジングは、電気的絶縁材料を有する、請求項5又は6に記載の照明装置。
- 前記ハウジングに取り付けられているエンベロープであって、前記光源を囲むエンベロープを更に有する、請求項5乃至7の何れか一項に記載の照明装置。
- 前記電子部品キャリアの前記第1部分は、前記電子部品キャリアの前記第2部分と、40°から140°を成す、請求項1乃至8の何れか一項に記載の照明装置。
- 前記第1の蓋部及び前記第2の蓋部の少なくとも1つは、前記光源からの光を反射する反射面を有する、請求項1乃至9の何れか一項に記載の照明装置。
- 前記ヒートシンク構造は、前記第1の蓋部及び前記第2の蓋部が配される前記開口と対向する他の開口を備えたカップ形状である、請求項1乃至10の何れか一項に記載の照明装置。
- 照明装置を製造する方法であって、
キャビティを規定するヒートシンク構造の開口に配される第1の蓋部及び第2の蓋部を有する前記ヒートシンク構造を設けるステップと、
前記第1の蓋部を、前記第1の蓋部が部分的に前記開口を閉じるように折り畳むステップと、
光源を担持するための第1部分及び前記光源への電気的接続を提供するための第2部分を有する電子部品キャリアを配するステップであって、この結果、前記電子部品キャリアは前記第1の蓋部及び前記第2の蓋部により規定される孔を通って延在し、前記電子部品キャリアの前記第1部分が前記キャビティの外側において前記第1の蓋部により支持され、前記電子部品キャリアの前記第2部分は前記キャビティ内において前記ヒートシンク構造によって少なくとも部分的に囲まれる、ステップと、
前記第2の蓋部を、前記第2の蓋部が前記第1の蓋部と一緒に前記キャビティの蓋を形成し、前記ヒートシンク構造の前記開口を実質的に閉じるように折り畳むステップと、
を有し、
前記第2の蓋部は、前記第1の蓋部に部分的に重なり、前記電子部品キャリアの前記第1部分を前記第1の蓋部にクランプする、方法。 - 前記ヒートシンク構造は、一枚のシートメタルをカップ様の形状に深絞りすることにより形成される、請求項12に記載の方法。
- 前記シートメタルは、前記ヒートシンク構造の前記開口のエッジに配される前記第1の蓋部及び前記第2の蓋部を有する、請求項13に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261680324P | 2012-08-07 | 2012-08-07 | |
US61/680,324 | 2012-08-07 | ||
PCT/IB2013/056461 WO2014024147A1 (en) | 2012-08-07 | 2013-08-07 | Lighting device comprising a heat sink structure |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015529948A JP2015529948A (ja) | 2015-10-08 |
JP2015529948A5 JP2015529948A5 (ja) | 2016-10-06 |
JP6157022B2 true JP6157022B2 (ja) | 2017-07-05 |
Family
ID=49513977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015525997A Expired - Fee Related JP6157022B2 (ja) | 2012-08-07 | 2013-08-07 | ヒートシンク構造を有する照明装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9593838B2 (ja) |
EP (1) | EP2882998B1 (ja) |
JP (1) | JP6157022B2 (ja) |
CN (1) | CN104520640B (ja) |
RU (1) | RU2628658C2 (ja) |
WO (1) | WO2014024147A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111713183A (zh) | 2018-02-12 | 2020-09-25 | 昕诺飞控股有限公司 | 包括用于发光元件的衬底的照明装置 |
WO2021083733A1 (en) * | 2019-11-01 | 2021-05-06 | Signify Holding B.V. | Bendable pcb with heatsink function |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
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TW567619B (en) * | 2001-08-09 | 2003-12-21 | Matsushita Electric Ind Co Ltd | LED lighting apparatus and card-type LED light source |
JP4041411B2 (ja) * | 2003-02-07 | 2008-01-30 | 松下電器産業株式会社 | カード型led光源用回動ソケット |
DE602004028099D1 (de) * | 2003-02-07 | 2010-08-26 | Panasonic Corp | Beleuchtungseinrichtung, einen sockel verwendend, um ein flaches led-modul auf einen kühlkörper zu montieren |
US6999318B2 (en) * | 2003-07-28 | 2006-02-14 | Honeywell International Inc. | Heatsinking electronic devices |
JP2006310057A (ja) * | 2005-04-27 | 2006-11-09 | Arumo Technos Kk | Led照明灯及びled点灯制御回路 |
KR101063446B1 (ko) * | 2006-05-30 | 2011-09-08 | 네오벌브 테크놀러지스 인크 | 높은 출력 및 높은 열발산 효율을 갖는 발광 다이오드 조명장비 |
US8113687B2 (en) * | 2006-06-29 | 2012-02-14 | Cree, Inc. | Modular LED lighting fixture |
CN101487583B (zh) * | 2008-01-16 | 2010-09-29 | 富士迈半导体精密工业(上海)有限公司 | 照明装置 |
WO2010136985A1 (en) | 2009-05-28 | 2010-12-02 | Koninklijke Philips Electronics N.V. | Ceramic illumination device |
US7932532B2 (en) * | 2009-08-04 | 2011-04-26 | Cree, Inc. | Solid state lighting device with improved heatsink |
JP5601512B2 (ja) * | 2009-09-14 | 2014-10-08 | 東芝ライテック株式会社 | 発光装置および照明装置 |
KR101742970B1 (ko) | 2009-10-09 | 2017-06-02 | 에이피에스 재팬 가부시키가이샤 | 조명장치 |
US8154179B2 (en) * | 2009-12-09 | 2012-04-10 | Tsan-Chi Chen | Light emitting diode lamp having replaceable light source module |
KR100970747B1 (ko) | 2009-12-24 | 2010-07-16 | 쎄딕(주) | 절곡형 방열부재 |
CN102308143A (zh) * | 2010-04-30 | 2012-01-04 | 松下电器产业株式会社 | 灯以及照明装置 |
DE112011102961T5 (de) * | 2010-10-08 | 2013-07-04 | Soraa, Inc. | Hochintensitätslichtquelle |
EP2848857B1 (en) * | 2010-11-08 | 2017-03-08 | LG Innotek Co., Ltd. | Lighting device |
JP5190105B2 (ja) * | 2010-12-17 | 2013-04-24 | 株式会社エル光源 | Ledランプ |
FR2970546A1 (fr) | 2011-01-13 | 2012-07-20 | Homelights | Ampoule a diode avec isolation |
EP2665968B1 (en) * | 2011-01-20 | 2018-11-14 | Philips Lighting Holding B.V. | Multi-functional heat sink for lighting products |
JP5859985B2 (ja) | 2011-01-21 | 2016-02-16 | シチズン電子株式会社 | 照明装置及びホルダの製造方法 |
-
2013
- 2013-08-07 US US14/419,321 patent/US9593838B2/en active Active
- 2013-08-07 EP EP13783986.6A patent/EP2882998B1/en not_active Not-in-force
- 2013-08-07 RU RU2015107795A patent/RU2628658C2/ru active
- 2013-08-07 JP JP2015525997A patent/JP6157022B2/ja not_active Expired - Fee Related
- 2013-08-07 WO PCT/IB2013/056461 patent/WO2014024147A1/en active Application Filing
- 2013-08-07 CN CN201380042055.2A patent/CN104520640B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2882998A1 (en) | 2015-06-17 |
CN104520640A (zh) | 2015-04-15 |
EP2882998B1 (en) | 2016-10-12 |
CN104520640B (zh) | 2018-03-23 |
JP2015529948A (ja) | 2015-10-08 |
RU2628658C2 (ru) | 2017-08-21 |
US20150192287A1 (en) | 2015-07-09 |
WO2014024147A1 (en) | 2014-02-13 |
US9593838B2 (en) | 2017-03-14 |
RU2015107795A (ru) | 2016-09-27 |
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