1380482 101年09月24日梭正替换頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種發光二極體模组，特別係指一種具有熱 • 電分離式構造之發光二極體模组。 [先前技術] [0002] 隨著發光效率之提升，發光二極體已被越來越多地應用 在各個領域當中，如住宅照明、工業照明及交通指示等 等。惟，在發光二極體發光效率增加之同時會導致其發 φ 熱量增大，如若該等熱量得不到及時地散發，將會使發 光二極體之發光效率下降》因此，如何有效地散發發光 二極體之熱量變得至關重要。 [0003] 美國專利第US 6, 561，680 B1號揭示了一種發光二極體 模組’其包括一金屬板及一固設於金屬板上之發光二極 體。發先二極體包括一正極引腳、一與正極引腳隔開之 負極引聊、一粘接於負極引腳上之發光二極體晶片及一 包封晶片之膠體。發光二極體之正極引腳及負極引腳直 • 接貼設於金屬板表面。當發光二極體工作時，晶片產生 之熱量藉由正極引腳及負極引腳傳導至金屬板上，從而 實現對發光二極體之散熱。 [0004] 惟’該種結構之發光二極體模組之電流亦係藉由金屬板 表面、正極引腳及負極引腳傳輸至晶片，換言之，該發 光二極體模組之導電路徑與導熱路徑相互交迭。由於處 於同一傳輸路徑，電流在傳輸過程中易受到熱量之影響 而無法穩定輸入至晶片。特別當金屬板之溫度上升到一 定程度之後，熱量對於電流之影響將變得十分顯著：電 _122〇f 單编號 A〇101 第3頁/共23頁 1013364183-0 1380482 101年09月24日核正替换頁 流無法保持相對穩定之數值而一直處於波動狀態。該種 波動之電流輸入至晶片後將會導致晶片之發光強度不停 發生變化，使發光二極體無法維持正常照明。此外，這 種波動之電流還容易損壞晶片，影響發光二極體之使用 壽命。 【發明内容】 [0005] 有鑒於此，實有必要提供一種具有熱電分離式構造之發 光二極體模組。 [0006] 一種發光二極體模組，其包括一導熱板及複數安裝於導 熱板上之發光二極體，每一發光二極體包括一基座、一 結合至基座上之發光二極體晶片及二分別固定於基座上 並與晶片電性連接之第一引腳及第二引腳，所述基座與 導熱板熱導性連接，所述第一引腳及第二引腳與導熱板 相互隔開，每一發光二極體還包括複數自基座外側面延 伸而出之扣腳，該等發光二極體通過扣腳相互扣接成一 整體，每一發光二極體還包括一插設於基座内之導熱柱 ，晶片固設於該導熱柱上，該導熱柱與扣腳相互連接並 與導熱板接觸。 [0007] 與習知技術相比，本發明之發光二極體模組之基座與導 熱板熱導性連接，晶片產生之熱量可藉由基座傳輸至導 熱板内。此外，由於第一引腳及第二引腳與導熱板相互 隔開，藉由第一引腳及第二引腳輸入至晶片内之電流不 會流經導熱板。發光二極體模組之導熱路徑與導電路徑 至少部分相互錯開，熱量對電流不會造成太大影響。故 此，電流之數值可維持在一個相對穩定之狀態，發光二 1013364183-0 09711220^單编號A0101 第4頁/共23頁 1380482 101年.09月24日梭正雜頁 極體可發出相對恒定之光強，發光二極體之壽命亦相應 地得到延長。 【實施方式】 [0008] 請參閱圖1及圖8，本發明之優選實施例之發光二極體模 組包括一導熱板10及一固設於導熱板10上之發光一極體 組合2 0 0。 [0009] 導熱板10由熱導性良好之金屬材料製成’如銅、鋁或二 者之合金。導熱板10之頂部形成一平坦之表面，供發光 二極體組合200貼合。 [0010] 請一併參閱圖4，發光二極體組合200由複數發光二極體 20彼此焊接而成。每一發光二極體20包括一正六邊形之 基座22、一粘接於基座22上之發光二極體晶片23、二分 別插設於基座22相對兩側之第一引腳24及第二引腳26及 一固定至基座22上且包封住晶片之封膠29 (如圖1)。 [0011] 請一併參閱圖5至圖7，在本實施例中，基座22由陶瓷製 成，可以理解地’基座22還可採用習知技術中其他導熱 且絕緣之材料製成，以在傳輸晶片23熱量之同時對第一 引腳24及第二引腳26罈緣。該基座22之頂面之中部區域 向下凹陷出一正六邊形之凹槽220，用於容置晶片23。該 凹槽220之内徑小於基座22之外徑，由此，基座22環繞凹 槽2 2 0之外側部分形成一環形之臺階2 2 2 ,以供第一引腳 24及第二引腳26插設。三扣腳28自基座22之外側面一體 向外輻射而出，每一扣腳28包括一矩形之橫樑280及一形 成於橫樑280末端之梯形之扣合部282 (如圖6)，其中扣 合部282用於嵌入相鄰之發光二極體2〇之基座22内，橫樑 09711220^單編號 A0101 第5頁/共23頁 1013364183-0 1380482 101 年.09月 24 日 280則用於將相鄰之發光二極體20隔開。該三扣腳28之底 面均與基座22之底面共面，並與導熱板10之頂面接觸（ 如圖8)，以將基座22所吸收之熱量散佈至導熱板10上； 該等扣腳28之頂面設置為低於第一引腳24及第二引腳26 之底面，以與第一引腳24及第二引腳26隔開距離（如圖7 )。請一併參閱圖3及圖6,三缺口 224相對於三扣腳28交 替地環設於基座22之底面周緣，其中每一缺口 224均呈梯 形，且向外貫穿基座22之外側面，以收容相鄰發光二極 體20之相應扣腳28之扣合部282，從而將該等發光二極體 • · 20扣接成一整體。 [0012] 請再一併參閱圖2,第一引腳24及第二引腳26均為完全平 行於導熱板10之金屬片，其相對設置於靠近基座22之頂 面，以與導熱板10隔開距離。每一第一引腳24及第二引 腳26均包括一穿設於臺階222内之固定部240、260及一 自固定部240、260水平向外延伸之矩形之連接部242、 262 (如圖5)，其中連接部242、262之尺寸遠小於固定 部240、260之尺寸。每一固定部240 ' 260之内側部分呈 _ 弧形，其暴露於凹槽220之底部，且藉由金線（圖未示） 連接至晶片23之正負電極（圖未示），以實現每一發光 二極體20内部之電氣連接；每一固定部240、260之外側 部分呈矩形，其略微凸伸出基座22之外側面，以增加第 引腳24及第二引腳26之機械穩定性。該等連接部242、 262藉由相應之固定部240、260懸設於導熱板10之上方 (如圖8)，以避免與導熱板1〇直接接觸。第一引腳24之 連接部242之末端開設一大致呈圓形之凹部244 ,第二引 Α〇1〇ι 〇97ll22〇产單坞號 第6頁/共23頁 1013364183-0 1380482 101年.09月24日修正替換頁 腳26之連接部262之末端則水平向外凸伸出一大致呈圓形 之凸片264。如圖2所示，該凹部244用於收容一相鄰發光 二極體20之第二引腳26之凸片264，而該凸片264則甩於 嵌入另一相鄰發光二極體20之第一引腳24之凹部244内， 從而實現該等發光二極體20間之外部電氣連接。該凹部 244之深度大於凸片264之厚度，當凸片264容置於凹部 244内時，凹部244之内周面與凸片264之頂面將形成一 較淺之凹坑248 (如圖1 )。 [0013] 如圖1所示，所述封膠29呈半球形，其由透明之絕熱性材 料製成，如環氧樹脂或矽膠。該封膠29用於將晶片23所 發出之光線會聚至一預設之光束内，從而實現對外部之 照明。 [0014] 請一併參閱圖卜4，組裝該發光二極體模組時，首先將每 一發光二極體20之三扣腳28之扣合部282卡入相鄰三發光 二極體20之基座22之三缺口 224内，並使該每一發光二極 體20之三缺口 224收容另外三相鄰發光二極體20之三扣合 # 部282，由此完成發光二極體組合200之機械連接；與此 同時，將該每一發光二極體20之第二引腳26之凸片264嵌 入一相鄰之發光二極體20之第一引腳24之凹部244内，並 使該每一發光二極體20之第一引腳24之凹部244容置另一 相鄰之發光二極體20之第二引腳26之凸片264，由此完成 發光二極體組合200之電氣連接。最後，將已組裝好之發 光二極體組合200固定至導熱板10上，以構成完整之發光 二極體模組。 [0015] 使用該發光二極體模組時，第一引腳24及第二引腳26構 1013364183-0 。9711220>^單編號A0101 第7頁/共23頁 1380482 101年09月24日修正 成之電流傳輪路徑將電流輸入至晶片23内，以驅動晶片 23發出光線，而基座22及導熱板1〇所構成之熱量傳輸路 徑則將晶片23工作所產生之熱量散發出去，確保發光二 極體20之正常運作。由於第一引腳24及第二引腳26與導 熱板10隔開，電流不需流經導熱板1 〇即可輸入至晶片2 3 内，從而使電流之傳輸路徑與熱量之傳輸路徑在第一引 腳24及第二引腳26懸置於導熱板10之位置處部分錯開。 因此，相比於習知技術，本發明之發光二極體模組中之 晶片2 3所產生之熱量對電流之影響較小，電流可保持在 -個相對穩定之數值範圍内，從而破保晶片23發出相對 ® 恒定之光強，進而使發光二極體2〇之壽命得到延長。 [0016] 在上一實施例中，基座22及扣腳28完全與導熱板10熱導 性接觸，以充分地傳輸熱量。但在該種情況下，發光二 極體模組之電流傳輸路徑只能部分與熱量傳輸路徑區隔 。可以理解地，如果基座22只有部分與導熱板1〇熱導性 接觸，即改進為如圖9-10中所示之構造，可使電流傳輸 路徑與熱量傳輸路徑完全錯開。在本發明之另一實施例 鲁 中，基座22f由絕熱及絕緣之材料製成，如塑膠。基座 22f之中部開設一圓形之通孔（圖未標），基座22f之底 面向上凹陷出三均勻向外輻射之溝槽（圖未標）。該等 溝槽均與通孔連通’且向外貫穿基座22f之外側面。一由 熱導性良好之材料（如金屬）一體形成之導熱結構（圖 未標）填充於通孔及溝槽内。該導熱結構包括一圓形之 導熱柱27f及自該導熱柱27f底部向外均勻輕射出之三扣 腳28f。導熱柱27f填充於基座22f之通孔内，其頂面藉 09711220# 單编號 A0101 第8頁/共23頁 1013364183-0 1380482 101年.09月24日核正^頁 由導熱膠（圖未示）固定一發光二極體晶片23f，其底面 與導熱板10接觸，以將晶片23f產.生之熱量傳導至導熱板 10上。此外，該導熱枉27f藉由基座22f與第一引腳24f 及第二引腳26f隔開，以避免將晶片23f產生之熱量傳輸 至第一引腳24f及第二引腳26f上。每一扣腳28f之内部 嵌入相應之溝槽内，外部延伸超出基座22f以與相鄰之發 光二極體20f相扣接。該等扣腳28f之底面亦與導熱板1〇 之頂面接觸，以將導熱柱27f吸收之熱量均勻地散佈在導 熱板10上。 [00Π] 由於本實施例中之導熱柱27f與第一引腳24f及第二引腳 26f藉由絕熱之基座22f隔開，導熱柱27f、扣腳28f及導 熱板10所構成之熱量傳輸路徑與第一引腳24f及第二引腳 26f所構成之電流傳輸路徑可完全錯開，熱量基本不會對 電流造成任何影響。因此，電流可保持較為穩定之數值 ，使晶片23f所發出之光強較為恒定，發光二極體2〇f之 壽命亦相應地大幅度得到延長。 ® [0018] 還可以理解地’前述二實施例中之第一引腳24、24f及第 二引腳26、26f與導熱板10間還可夹設一絕熱及絕緣層（ 圖未示）。該絕熱及絕緣層可對第一引腳24、24f及第二 引腳26、26f起一支樓作用，防止第一引腳24、24f及第 二引腳26、26f在安裝及使用過程中發生脊折。 [0019] 综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施例 自不能以此限制本案之申請專利範圍，舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化， 1013364183-0 〇9711220产單编號船〇1 第9頁./共23頁 1380482 _ 101年.09月24日梭正替換頁 皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0020] 圖1係本發明優選實施例之發光二極體模組中之發光二極 體組合之組裝圖。 [0021] 圖2係圖1之俯視圖。 [0022] 圖3係圖1之仰視圖。 .[0023] 圖4係圖1中單個發光二極體之放大圖，其中該發光二極 體之封膠被移去以方便觀察其内部結構。 φ [0024] 圖5係圖4之俯視圖。 [0025] 圖6係圖4之仰視圖。 [0026] 圖7係圖4之側視圖。 [0027] 圖8係圖1之側視圖，此時發光二極體模組之導熱板安置 于發光二極體組合下方。 [0028] 圖9係本發明另一實施例之發光二極體之俯視圖。 [0029] 圖10係圖9之仰視圖。 【主要元件符號說明】 [0030] 導熱板：10 ’ [0031] 發光二極體：20、20f [0032] 發光二極體組合：200 [0033] 基座：22、22f [0034] 凹槽：220 09711220#單編號 A〇101 第10頁/共23頁 1013364183-0 1380482 101年.09月24日修正替換頁 [0035] 臺階：222 [0036] 缺口 ： 224 [0037] 晶片：23、23f [0038] 第一引腳：24、24f [0039] 固定部：240、260 [0040] 連接部：242、262 [0041] 凹部：244 -1380482 September 24, 2011 Shuttle replacement page VI, invention description: [Technical field of invention] [0001] The present invention relates to a light-emitting diode module, in particular to a light with a thermal and electrical separation structure Diode module. [Prior Art] [0002] As luminous efficiency has increased, light-emitting diodes have been increasingly used in various fields such as residential lighting, industrial lighting, and traffic indication. However, when the luminous efficiency of the light-emitting diode is increased, the heat of the φ heat is increased. If the heat is not released in time, the luminous efficiency of the light-emitting diode will decrease. Therefore, how to effectively distribute the light The heat of the light-emitting diode becomes critical. [0003] U.S. Patent No. 6,561,680 B1 discloses a light-emitting diode module which includes a metal plate and a light-emitting diode fixed to the metal plate. The first diode includes a positive electrode pin, a negative electrode interposed with the positive electrode lead, a light emitting diode chip bonded to the negative electrode pin, and a colloid of the encapsulated wafer. The positive and negative pins of the LED are attached directly to the surface of the metal plate. When the light-emitting diode is in operation, the heat generated by the wafer is conducted to the metal plate through the positive pin and the negative electrode pin, thereby achieving heat dissipation to the light-emitting diode. [0004] However, the current of the LED module of the structure is also transmitted to the wafer through the surface of the metal plate, the positive electrode pin and the negative electrode pin, in other words, the conductive path and the heat conduction of the light emitting diode module The paths overlap each other. Due to the same transmission path, the current is susceptible to heat during transmission and cannot be stably input to the wafer. Especially when the temperature of the metal plate rises to a certain extent, the effect of heat on the current will become very significant: electricity_122〇f single number A〇101 page 3/total 23 page 1013364183-0 1380482 101 September 24 The Japanese core is replacing the page stream and cannot maintain a relatively stable value and is always in a state of fluctuation. The input of such fluctuating current to the wafer will cause the illuminating intensity of the wafer to constantly change, so that the illuminating diode cannot maintain normal illumination. In addition, this fluctuating current can easily damage the wafer and affect the life of the LED. SUMMARY OF THE INVENTION [0005] In view of the above, it is necessary to provide a light-emitting diode module having a thermoelectric separation structure. [0006] A light-emitting diode module includes a heat-conducting plate and a plurality of light-emitting diodes mounted on the heat-conducting plate, each of the light-emitting diodes includes a base and a light-emitting diode coupled to the base The body chip and the first pin and the second pin respectively fixed on the base and electrically connected to the chip, the base is thermally conductively connected to the heat conducting plate, the first pin and the second pin Separating from the heat conducting plate, each of the light emitting diodes further includes a plurality of buckles extending from the outer side surface of the base, and the light emitting diodes are integrally connected to each other through the buckles, and each of the light emitting diodes is further The utility model comprises a heat conducting column which is inserted into the base, and the wafer is fixed on the heat conducting column, and the heat conducting column and the fastening leg are connected to each other and contact with the heat conducting plate. Compared with the prior art, the pedestal of the LED module of the present invention is thermally conductively connected to the heat conducting plate, and the heat generated by the wafer can be transferred into the heat conducting plate through the susceptor. In addition, since the first pin and the second pin are spaced apart from the heat conducting plate, current input into the wafer through the first pin and the second pin does not flow through the heat conducting plate. The heat conduction path and the conductive path of the LED module are at least partially offset from each other, and heat does not have much influence on the current. Therefore, the value of the current can be maintained in a relatively stable state, the light is two 1013364183-0 09711220^ single number A0101 page 4 / total 23 pages 1380482 101 years. September 24th shuttle positive page polar body can be issued relatively constant The light intensity and the lifetime of the light-emitting diode are correspondingly extended. [0008] Referring to FIG. 1 and FIG. 8 , a light emitting diode module according to a preferred embodiment of the present invention includes a heat conducting plate 10 and a light emitting body assembly 20 fixed on the heat conducting plate 10 . 0. The heat conducting plate 10 is made of a metal material having good thermal conductivity such as copper, aluminum or an alloy of both. The top of the heat conducting plate 10 forms a flat surface for the light emitting diode assembly 200 to be bonded. [0010] Referring to FIG. 4 together, the LED assembly 200 is formed by soldering the plurality of LEDs 20 to each other. Each of the LEDs 20 includes a regular hexagonal base 22, a light-emitting diode chip 23 bonded to the base 22, and two first pins 24 respectively inserted on opposite sides of the base 22. And a second pin 26 and a seal 29 (see FIG. 1) fixed to the susceptor 22 and enclosing the wafer. [0011] Please refer to FIG. 5 to FIG. 7 together. In the embodiment, the base 22 is made of ceramic. It can be understood that the base 22 can also be made of other thermally conductive and insulating materials in the prior art. The first pin 24 and the second pin 26 are edged while transferring heat of the wafer 23. A portion of the top surface of the pedestal 22 is recessed downwardly into a regular hexagonal recess 220 for receiving the wafer 23. The inner diameter of the groove 220 is smaller than the outer diameter of the base 22, whereby the base 22 forms an annular step 2 2 2 around the outer side of the groove 2 2 0 for the first pin 24 and the second lead The foot 26 is inserted. The three fastening legs 28 radiate from the outer side of the base 22, and each of the fastening legs 28 includes a rectangular beam 280 and a trapezoidal engaging portion 282 formed at the end of the beam 280 (Fig. 6). The fastening portion 282 is used for embedding in the base 22 of the adjacent light-emitting diode 2, the beam 09711220^ single number A0101 page 5 / total 23 page 1013364183-0 1380482 101 year. September 24 280 is used for The adjacent light-emitting diodes 20 are separated. The bottom surface of the three fastening legs 28 are coplanar with the bottom surface of the base 22 and are in contact with the top surface of the heat conducting plate 10 (as shown in FIG. 8) to spread the heat absorbed by the base 22 to the heat conducting plate 10; The top surface of the pin 28 is disposed lower than the bottom surfaces of the first pin 24 and the second pin 26 to be spaced apart from the first pin 24 and the second pin 26 (as shown in FIG. 7). Referring to FIG. 3 and FIG. 6 , the three notches 224 are alternately ringed on the bottom periphery of the base 22 with respect to the three fastening legs 28 , wherein each of the notches 224 is trapezoidal and extends outwardly from the outer side of the base 22 . The accommodating portion 282 of the corresponding pin 28 of the adjacent LEDs 20 is received to fasten the LEDs 20 into a whole. 2, the first pin 24 and the second pin 26 are all metal plates completely parallel to the heat conducting plate 10, and are disposed opposite to the top surface of the base 22 to be opposite to the heat conducting plate. 10 separated by distance. Each of the first pin 24 and the second pin 26 includes a fixing portion 240, 260 extending through the step 222 and a rectangular connecting portion 242, 262 extending horizontally outward from the fixing portion 240, 260 (eg Figure 5), wherein the dimensions of the connecting portions 242, 262 are much smaller than the dimensions of the fixed portions 240, 260. The inner portion of each of the fixing portions 240' 260 has an _-arc shape, which is exposed to the bottom of the groove 220, and is connected to the positive and negative electrodes (not shown) of the wafer 23 by a gold wire (not shown) to realize each An electrical connection inside the light-emitting diode 20; the outer portion of each of the fixing portions 240, 260 has a rectangular shape, which slightly protrudes from the outer side of the base 22 to increase the mechanical mechanism of the first pin 24 and the second pin 26 stability. The connecting portions 242, 262 are suspended above the heat conducting plate 10 (see FIG. 8) by the corresponding fixing portions 240, 260 to avoid direct contact with the heat conducting plate 1A. The end of the connecting portion 242 of the first pin 24 defines a substantially circular recess 244, and the second lead Α〇1〇ι 〇97ll22 〇 单 坞 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第. At the end of the attachment portion 262 of the replacement footer 26 on September 24, a substantially circular tab 264 projects horizontally outwardly. As shown in FIG. 2, the recess 244 is for receiving a tab 264 of the second pin 26 of the adjacent LED body 20, and the tab 264 is embedded in another adjacent LED body 20. The recess 244 of the first pin 24 is formed to achieve an external electrical connection between the LEDs 20. The depth of the recess 244 is greater than the thickness of the tab 264. When the tab 264 is received in the recess 244, the inner peripheral surface of the recess 244 and the top surface of the tab 264 will form a shallow recess 248 (see FIG. 1). ). [0013] As shown in FIG. 1, the sealant 29 is hemispherical and is made of a transparent heat insulating material such as epoxy or silicone. The encapsulant 29 is used to concentrate the light emitted by the wafer 23 into a predetermined beam to achieve external illumination. [0014] Please refer to FIG. 4 together. When assembling the LED module, firstly, the fastening portions 282 of the three fastening legs 28 of each of the LEDs 20 are inserted into the adjacent three LEDs 20 . The three notches 224 of the base 22 and the three notches 224 of each of the LEDs 20 receive the three snaps 282 of the other three adjacent LEDs 20, thereby completing the LED assembly. a mechanical connection of 200; at the same time, the tab 264 of the second pin 26 of each of the light-emitting diodes 20 is embedded in the recess 244 of the first pin 24 of an adjacent light-emitting diode 20, and The recess 244 of the first pin 24 of each of the LEDs 20 is received by the tab 264 of the second pin 26 of the other adjacent LED 20, thereby completing the LED assembly 200. Electrical connection. Finally, the assembled light-emitting diode assembly 200 is fixed to the heat conducting plate 10 to form a complete light-emitting diode module. [0015] When the LED module is used, the first pin 24 and the second pin 26 are configured as 1013364183-0. 9711220>^单号 A0101 Page 7 of 23 1380482 The current-passing path corrected on September 24, 101, inputs current into the wafer 23 to drive the wafer 23 to emit light, and the susceptor 22 and the heat-conducting plate 1 The heat transfer path formed by the cesium dissipates the heat generated by the operation of the wafer 23 to ensure the normal operation of the light-emitting diode 20. Since the first pin 24 and the second pin 26 are separated from the heat conducting plate 10, the current can be input into the chip 2 3 without flowing through the heat conducting plate 1 , so that the current transmission path and the heat transfer path are in the A pin 24 and a second pin 26 are partially staggered at a position suspended from the heat conducting plate 10. Therefore, compared with the prior art, the heat generated by the wafer 2 in the LED module of the present invention has less influence on the current, and the current can be maintained within a relatively stable value range, thereby breaking the insurance. The wafer 23 emits a relatively constant light intensity, which in turn extends the life of the light-emitting diode 2 . [0016] In the previous embodiment, the base 22 and the buckles 28 are in thermal contact with the heat conducting plate 10 to sufficiently transfer heat. However, in this case, the current transmission path of the light-emitting diode module can only be partially separated from the heat transfer path. It will be appreciated that if the susceptor 22 is only partially in thermal conductive contact with the thermally conductive plate 1, i.e., modified to the configuration shown in Figures 9-10, the current transfer path and the heat transfer path can be completely staggered. In another embodiment of the invention, the base 22f is made of a thermally insulating and insulating material such as plastic. A circular through hole (not shown) is formed in the middle of the base 22f, and the bottom of the base 22f is recessed upwardly to form three uniformly radiating grooves (not shown). The grooves are all in communication with the through holes and extend outwardly through the outer sides of the base 22f. A thermally conductive structure (not shown) integrally formed of a material having good thermal conductivity (such as metal) is filled in the through holes and the grooves. The heat conducting structure comprises a circular heat conducting column 27f and three buckle legs 28f which are uniformly lightly emitted from the bottom of the heat conducting column 27f. The heat conducting column 27f is filled in the through hole of the base 22f, and the top surface thereof is borrowed by 09711220# single number A0101, page 8 / total 23 pages 1013364183-0 1380482 101. September 24th, the positive page is made of thermal conductive glue (Fig. A light-emitting diode chip 23f is fixed, and its bottom surface is in contact with the heat conducting plate 10 to conduct heat generated by the wafer 23f to the heat conducting plate 10. Further, the heat transfer port 27f is separated from the first pin 24f and the second pin 26f by the susceptor 22f to prevent heat generated by the wafer 23f from being transferred to the first pin 24f and the second pin 26f. The inside of each of the buckles 28f is embedded in the corresponding groove, and the outside extends beyond the base 22f to be fastened to the adjacent light-emitting diode 20f. The bottom surface of the buckles 28f is also in contact with the top surface of the heat conducting plate 1A to uniformly dissipate the heat absorbed by the heat conducting posts 27f on the heat conducting plate 10. [00Π] Since the heat conducting post 27f in the embodiment is separated from the first pin 24f and the second pin 26f by the thermally insulated base 22f, the heat transfer by the heat conducting post 27f, the buckle leg 28f and the heat conducting plate 10 The current transmission path formed by the path and the first pin 24f and the second pin 26f can be completely staggered, and the heat does not substantially affect the current. Therefore, the current can be maintained at a relatively stable value, so that the intensity of light emitted from the wafer 23f is relatively constant, and the lifetime of the light-emitting diode 2〇f is also greatly extended accordingly. It is also understood that a heat insulating and insulating layer (not shown) may be interposed between the first pins 24, 24f and the second pins 26, 26f and the heat conducting plate 10 in the foregoing two embodiments. The heat insulating and insulating layer can play a role on the first pins 24, 24f and the second pins 26, 26f to prevent the first pins 24, 24f and the second pins 26, 26f from being installed and used. A spine fold occurs. [0019] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above-mentioned preferred embodiments of the present invention are not intended to limit the scope of the present invention, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention, 1013364183-0 〇 9711220 Production Order Number Shipment 1 Page 9 of 23 pages 1380482 _ 101 years. September 24th The shuttle replacement page should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0020] FIG. 1 is an assembled view of a combination of light-emitting diodes in a light-emitting diode module according to a preferred embodiment of the present invention. 2 is a plan view of FIG. 1. 3 is a bottom view of FIG. 1. [0023] FIG. 4 is an enlarged view of a single light-emitting diode of FIG. 1, in which the seal of the light-emitting diode is removed to facilitate observation of its internal structure. [0024] FIG. 5 is a plan view of FIG. 4. 6 is a bottom view of FIG. 4. 7 is a side view of FIG. 4. 8 is a side view of FIG. 1, in which the heat conducting plate of the light emitting diode module is disposed under the light emitting diode assembly. 9 is a plan view of a light emitting diode according to another embodiment of the present invention. 10 is a bottom view of FIG. 9. [Main component symbol description] [0030] Thermal conduction plate: 10 ' [0031] Light-emitting diode: 20, 20f [0032] Light-emitting diode combination: 200 [0033] Base: 22, 22f [0034] Groove: 220 09711220#单号A〇101 Page 10/Total 23 Page 1013364183-0 1380482 101. September 24 Revision Replacement Page [0035] Step: 222 [0036] Notch: 224 [0037] Wafer: 23, 23f [ 0038] First pin: 24, 24f [0039] Fixing part: 240, 260 [0040] Connecting part: 242, 262 [0041] Recessed part: 244 -
[0042] 凹坑：248 [0043] 第二引腳：26、26f [0044] 凸片：264 [0045] 扣腳：28、28f [0046] 橫樑：28 0 [0047] 扣合部：282[0042] Pit: 248 [0043] Second pin: 26, 26f [0044] Tab: 264 [0045] Buckle: 28, 28f [0046] Beam: 28 0 [0047] Buckle: 282
[0048] 封膠：29 [0049] 導熱柱：27f 0971122G#單編號 A_ 第11頁/共23頁 1013364183-0[0048] Sealing: 29 [0049] Thermal Conductive Column: 27f 0971122G# Single Number A_ Page 11 of 23 1013364183-0