JP2011057917A - 光反射性異方性導電接着剤及び発光装置 - Google Patents
光反射性異方性導電接着剤及び発光装置 Download PDFInfo
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- JP2011057917A JP2011057917A JP2009211429A JP2009211429A JP2011057917A JP 2011057917 A JP2011057917 A JP 2011057917A JP 2009211429 A JP2009211429 A JP 2009211429A JP 2009211429 A JP2009211429 A JP 2009211429A JP 2011057917 A JP2011057917 A JP 2011057917A
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- light
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- anisotropic conductive
- conductive adhesive
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Images
Classifications
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- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- C08G18/8158—Polyisocyanates or polyisothiocyanates masked with unsaturated compounds having active hydrogen with unsaturated compounds having only one group containing active hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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Abstract
【解決手段】発光素子を配線板に異方性導電接続するために使用する光反射性異方性導電接着剤は、熱硬化性樹脂組成物、導電粒子及び光反射性絶縁粒子を含有する。光反射性絶縁粒子は、酸化チタン、窒化ホウ素、酸化亜鉛及び酸化アルミニウムからなる群より選択される少なくとも一種の無機粒子である。
【選択図】図2
Description
また、金属粒子としては、予めシランカップリング剤でγ−グリシドキシ基やビニル基等を金属表面に導入しておくことが好ましい。
屈折率が約1.50の無色透明な熱硬化型エポキシ系バインダー組成物(YX−8000、JER(株):MeHHPAを50質量%で含有)に、光反射性絶縁粒子として平均粒径0.5μmの二酸化チタン酸粉末(KR−380、チタン工業(株))を12体積%、導電粒子として平均粒径5μmのAu被覆樹脂導電粒子(平均粒径4.6μmの球状アクリル樹脂粒子に0.2μm厚の無電解金メッキを施した粒子(ブライト20GNB4.6EH、日本化学工業(株))を10質量%となる割合で均一に混合することにより、外観色が白色の光反射性異方性導電接着剤を得た。
得られた光反射性異方性導電接着剤を、セラミック製の白色板に乾燥厚で100μmとなるように塗布し、200℃で1分間加熱し、硬化させた。この硬化物について、分光光度計(U3300、日立製作所(株))を用いて、波長450nmの光に対する反射率(JIS K7150)を測定した。得られた結果を表1及び図3に示す。反射率は、実用上30%以上であることが望まれる。
100μmピッチの銅配線にNi/Au(5.0μm厚/0.3μm厚)メッキ処理した配線を有するガラスエポキシ基板に、バンプボンダー(FB700、カイジョー(株))を用いて15μm高の金バンプを形成した。この金バンプ付きエポキシ基板に、光反射性異方性導電接着剤を用いて、青色LED(Vf=3.2(If=20mA))を200℃、60秒、1Kg/チップという条件でフィリップチップ実装し、テスト用LEDモジュールを得た。
二酸化チタン粉末の配合量を7体積%とすること以外、実施例1と同様にして外観色が白色の光反射性異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。光反射率結果については図3にも示す。
二酸化チタン粉末の配合量を21体積%とすること以外、実施例1と同様にして外観色が白色の光反射性異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。光反射率結果については図3にも示す。
二酸化チタン粉末に代えて平均粒径0.5μmの窒化ホウ素粉末(SP7、電気化学工業(株))を12体積%使用すること以外、実施例1と同様にして外観色が白色の光反射性異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。
二酸化チタン粉末に代えて平均粒径0.5μmの酸化亜鉛粉末(JIS規格酸化亜鉛1種、ハクスイテック(株))を12体積%使用すること以外、実施例1と同様にして外観色が白色の光反射性異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。光反射率結果については図3にも示す。
二酸化チタン粉末に代えて平均粒径0.5μmの酸化アルミニウム粉末(AE2500−SI、アドマテックス(株))を12体積%使用すること以外、実施例1と同様にして外観色が白色の光反射性異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。
平均粒径0.5μmの二酸化チタン粉末に代えて平均粒径0.2μmの二酸化チタン粉末(CR602、石原産業(株))を12体積%使用すること以外、実施例1と同様にして外観色が白色の光反射性異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。
Au被覆樹脂導電粒子に代えて、平均粒径5μmのNi被覆樹脂導電粒子(平均粒径4.6μmの球状アクリル樹脂粒子に0.2μm厚の無電解ニッケルメッキを施した粒子)を使用すること以外、実施例1と同様にして外観色が白色の光反射性異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。
平均粒径0.5μmの二酸化チタン粉末に代えて、以下に説明するように調製した平均粒径5μmの光反射性絶縁粒子を使用すること以外、実施例1と同様にして外観色が白色の光反射性異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。
攪拌機つきフラスコに粒状銀粒子(平均粒径1.0μm)5gとトルエン50mlとを投入し、攪拌しながらフラスコにシランカップリング剤(3−メタクリロキシプロピルトリエトキシシラン)0.25gを投入し、25℃で60分間攪拌した。次に、この混合物に、メタクリル酸メチル2gとメタクリル酸−2−ヒドロキシエチル2gとベンゾイルパーオキサイド0.04gと2,4−トリレンジイソシアネート1gとを投入し、80℃で12時間攪拌することにより、光反射性絶縁粒子として絶縁被覆銀粒子を得た。絶縁被覆を含めた光反射性絶縁粒子の平均粒径は5.0μmであった。
Au被覆樹脂導電粒子に代えて、以下に説明するように調製した平均粒径5μmの光反射性導電粒子を使用すること以外、実施例1と同様にして外観色が白色の光反射性異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。
(光反射性導電粒子の作成)
実施例1で用いた屈折率が約1.50の無色透明な熱硬化型エポキシ系バインダー組成物(YX−8000、JER(株):MeHHPAを100質量%で含有)について、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。光反射率結果については図3にも示す。
光反射性絶縁粒子を使用しないこと以外、実施例1と同様にして外観色が茶色の異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。光反射率結果については図3にも示す。
光反射性絶縁粒子を使用せず、且つAu被覆樹脂導電粒子に代えて、平均粒径5μmのNi被覆樹脂導電粒子(平均粒径4.6μmの球状アクリル樹脂粒子に0.2μm厚の無電解ニッケルメッキを施した粒子)を使用すること以外、実施例1と同様にして外観色が黒色の異方性導電接着剤を得た。また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。
平均粒子径0.5μmの酸化チタン粉末に代えて、平均粒子径0.5μmの酸化ケイ素粉末(シーホスター KEP−30、日本触媒(株))を使用すること以外、実施例1と同様にして外観色が茶色の異方性導電接着剤を得た。また、実施例1と同様に、また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。
平均粒子径0.5μmの酸化チタン粉末に代えて、平均粒子径0.02μmの酸化チタン粉末(TTO−55D、石原産業(株))を使用すること以外、実施例1と同様にして外観色が茶色の異方性導電接着剤を得た。また、実施例1と同様に、また、実施例1と同様に、光反射率評価試験とLED実装サンプルにおける全光束量評価試験とを行った。得られた結果を表1に示す。
2 無機粒子
3 光反射層
4 熱可塑性樹脂
10 光反射性導電粒子
11 熱硬化性樹脂組成物の硬化物
21 基板
22 接続端子
23 LED素子
24 n電極
25 p電極
26 バンプ
100 光反射性異方性導電接着剤の硬化物
200 発光装置
Claims (10)
- 発光素子を配線板に異方性導電接続するために使用する光反射性異方性導電接着剤であって、熱硬化性樹脂組成物、導電粒子及び光反射性絶縁粒子を含有することを特徴とする光反射性異方性導電接着剤。
- 光反射性絶縁粒子が、酸化チタン、窒化ホウ素、酸化亜鉛及び酸化アルミニウムからなる群より選択される少なくとも一種の無機粒子である請求項1記載の光反射性異方性導電接着剤。
- 光反射性絶縁粒子の屈折率(JIS K7142)が、熱硬化性樹脂組成物の硬化物の屈折率(JIS K7142)よりも大きい請求項1又は2記載の光反射性異方性導電接着剤。
- 光反射性絶縁粒子が、鱗片状又は球状銀粒子の表面を絶縁性樹脂で被覆した樹脂被覆金属粒子である請求項1記載の光反射性異方性導電接着剤。
- 熱硬化性樹脂組成物中における光反射性絶縁粒子の配合量が、1〜50体積%である請求項1〜4のいずれかに記載の光反射性異方性導電接着剤。
- 熱硬化性樹脂組成物が、エポキシ樹脂と酸無水物系硬化剤とを含有する請求項1〜5のいずれかに記載の光反射性異方性導電接着剤。
- 導電粒子が、金属材料で被覆されているコア粒子と、その表面に酸化チタン粒子、酸化亜鉛粒子又は酸化アルミニウム粒子から選択された少なくとも一種の無機粒子から形成された光反射層とからなる光反射性導電粒子である請求項1〜6のいずれかに記載の光反射性異方性導電接着剤。
- 熱硬化性樹脂組成物100質量部に対する光反射性導電粒子の配合量が、1〜100質量部である請求項7記載の光反射性異方性導電接着剤。
- 請求項1〜8のいずれかに記載の光反射性異方性導電接着剤を介して、発光素子をフリップチップ方式で配線板に実装されている発光装置。
- 発光素子が、発光ダイオードである請求項9記載の発光装置。
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WO2012144033A1 (ja) * | 2011-04-20 | 2012-10-26 | ソニーケミカル&インフォメーションデバイス株式会社 | 光反射性導電粒子、異方性導電接着剤及び発光装置 |
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JP2015178555A (ja) * | 2014-03-19 | 2015-10-08 | デクセリアルズ株式会社 | 異方性導電接着剤 |
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KR20200108117A (ko) | 2016-05-31 | 2020-09-16 | 데쿠세리아루즈 가부시키가이샤 | 발광 장치 및 발광 장치의 제조 방법 |
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Also Published As
Publication number | Publication date |
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CN102482553B (zh) | 2014-08-20 |
EP2479233A4 (en) | 2014-07-09 |
US20120193666A1 (en) | 2012-08-02 |
KR20120068753A (ko) | 2012-06-27 |
TW201546829A (zh) | 2015-12-16 |
CN102482553A (zh) | 2012-05-30 |
EP2479233A1 (en) | 2012-07-25 |
JP5617210B2 (ja) | 2014-11-05 |
US9548141B2 (en) | 2017-01-17 |
TW201142875A (en) | 2011-12-01 |
HK1170255A1 (en) | 2013-02-22 |
TWI520155B (zh) | 2016-02-01 |
WO2011030621A1 (ja) | 2011-03-17 |
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