JP2010525413A - ウエハーレベル光学部品を用いた自動焦点／ズームモジュール - Google Patents

ウエハーレベル光学部品を用いた自動焦点／ズームモジュール Download PDF

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Publication number
JP2010525413A
JP2010525413A JP2010506259A JP2010506259A JP2010525413A JP 2010525413 A JP2010525413 A JP 2010525413A JP 2010506259 A JP2010506259 A JP 2010506259A JP 2010506259 A JP2010506259 A JP 2010506259A JP 2010525413 A JP2010525413 A JP 2010525413A
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Japan
Prior art keywords
lens unit
lens
substrate
camera module
image capture
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Pending
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JP2010506259A
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English (en)
Japanese (ja)
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JP2010525413A5 (enExample
Inventor
ハープニート シング，
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フレックストロニクス エーピー エルエルシー
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Application filed by フレックストロニクス エーピー エルエルシー filed Critical フレックストロニクス エーピー エルエルシー
Publication of JP2010525413A publication Critical patent/JP2010525413A/ja
Publication of JP2010525413A5 publication Critical patent/JP2010525413A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
JP2010506259A 2007-04-24 2008-04-24 ウエハーレベル光学部品を用いた自動焦点／ズームモジュール Pending JP2010525413A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92594707P 2007-04-24 2007-04-24
PCT/US2008/005298 WO2008133946A1 (en) 2007-04-24 2008-04-24 Auto focus/ zoom modules using wafer level optics

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012226416A Division JP2013020267A (ja) 2007-04-24 2012-10-11 ウエハーレベル光学部品を用いた自動焦点／ズームモジュール

Publications (2)

Publication Number Publication Date
JP2010525413A true JP2010525413A (ja) 2010-07-22
JP2010525413A5 JP2010525413A5 (enExample) 2011-06-16

Family

ID=39925982

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2010506259A Pending JP2010525413A (ja) 2007-04-24 2008-04-24 ウエハーレベル光学部品を用いた自動焦点／ズームモジュール
JP2012226416A Pending JP2013020267A (ja) 2007-04-24 2012-10-11 ウエハーレベル光学部品を用いた自動焦点／ズームモジュール
JP2014138040A Pending JP2014194585A (ja) 2007-04-24 2014-07-03 ウエハーレベル光学部品を用いた自動焦点／ズームモジュール

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2012226416A Pending JP2013020267A (ja) 2007-04-24 2012-10-11 ウエハーレベル光学部品を用いた自動焦点／ズームモジュール
JP2014138040A Pending JP2014194585A (ja) 2007-04-24 2014-07-03 ウエハーレベル光学部品を用いた自動焦点／ズームモジュール

Country Status (5)

Country Link
US (1) US20090015706A1 (enExample)
JP (3) JP2010525413A (enExample)
CN (1) CN101681085B (enExample)
CA (1) CA2685083A1 (enExample)
WO (1) WO2008133946A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010139622A (ja) * 2008-12-10 2010-06-24 Konica Minolta Holdings Inc 駆動装置および撮像装置
JP2014174551A (ja) * 2013-03-11 2014-09-22 Samsung Electronics Co Ltd カメラモジュールを含む電子装置
WO2016117250A1 (ja) * 2015-01-23 2016-07-28 シャープ株式会社 カメラモジュールの製造方法、像面側群レンズ、像面側群レンズの製造方法、および撮像素子

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7813634B2 (en) 2005-02-28 2010-10-12 Tessera MEMS Technologies, Inc. Autofocus camera
US7769284B2 (en) * 2005-02-28 2010-08-03 Silmpel Corporation Lens barrel assembly for a camera
US8456560B2 (en) * 2007-01-26 2013-06-04 Digitaloptics Corporation Wafer level camera module and method of manufacture
KR100843300B1 (ko) * 2007-04-12 2008-07-03 삼성전기주식회사 카메라 모듈 및 그 제조방법
WO2008133943A1 (en) * 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip chip assembly
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
US9118825B2 (en) 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
KR101634353B1 (ko) 2008-12-04 2016-06-28 삼성전자주식회사 마이크로 렌즈, 상기 마이크로 렌즈 제조방법, 상기 마이크로 렌즈 제조 장치, 및 상기 마이크로 렌즈를 구비한카메라 모듈
TW201115205A (en) * 2009-03-18 2011-05-01 Artificial Muscle Inc Wafer level optical system
KR20100130423A (ko) * 2009-06-03 2010-12-13 삼성전자주식회사 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 모듈
KR101648540B1 (ko) 2009-08-13 2016-08-16 삼성전자주식회사 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 장치
US9419032B2 (en) * 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
US8305699B2 (en) 2009-09-23 2012-11-06 Samsung Electronics Co., Ltd. Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module
CN102055886A (zh) * 2009-11-10 2011-05-11 台湾东电化股份有限公司 整合影像传感器、对焦驱动装置及驱动电路的整合模块
CN102262331B (zh) * 2010-05-25 2014-10-15 鸿富锦精密工业（深圳）有限公司 取像模块及其取像方法
US8692932B2 (en) 2010-11-02 2014-04-08 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Compact imaging device having a laminated component
JP5719598B2 (ja) * 2011-01-06 2015-05-20 日本電産サンキョー株式会社 レンズ駆動装置の製造方法
US10009528B2 (en) 2011-02-24 2018-06-26 Nan Chang O-Film Optoelectronics Technology Ltd Autofocus camera module packaging with circuitry-integrated actuator system
US8545114B2 (en) 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane
US9094592B2 (en) 2011-11-15 2015-07-28 Lg Innotek Co., Ltd. Camera module with foreign objects inhibiting structure
CN103297665A (zh) * 2012-02-22 2013-09-11 庄佑华 图像采集系统
US9294667B2 (en) 2012-03-10 2016-03-22 Digitaloptics Corporation MEMS auto focus miniature camera module with fixed and movable lens groups
WO2013136053A1 (en) * 2012-03-10 2013-09-19 Digitaloptics Corporation Miniature camera module with mems-actuated autofocus
JP5539430B2 (ja) * 2012-03-22 2014-07-02 富士フイルム株式会社 電子機器の製造方法
KR102047375B1 (ko) * 2012-05-07 2019-11-21 엘지이노텍 주식회사 카메라 모듈
US9451137B2 (en) * 2014-08-21 2016-09-20 Omnivision Technologies, Inc. PCB-mountable lens adapter for a PCB-mountable camera module
WO2016163953A1 (en) * 2015-04-06 2016-10-13 Heptagon Micro Optics Pte. Ltd. Small footprint auto focus camera module
JP6583611B2 (ja) * 2015-04-27 2019-10-02 ミツミ電機株式会社 カメラ装置の組立て方法およびレンズユニットの組立て方法
US11147874B2 (en) * 2015-06-15 2021-10-19 Boston Scientific Scimed, Inc. Devices and methods for therapeutic heat treatment
US10732376B2 (en) 2015-12-02 2020-08-04 Ningbo Sunny Opotech Co., Ltd. Camera lens module and manufacturing method thereof
CN109445235B (zh) 2015-12-02 2022-02-22 宁波舜宇光电信息有限公司 采用分体式镜头的摄像模组及其组装方法
US10488632B2 (en) * 2016-01-20 2019-11-26 Mems Optical Zoom Corporation MEMS lens actuator
US10353167B2 (en) * 2016-02-29 2019-07-16 Ningbo Sunny Opotech Co., Ltd. Camera lens module with one or more optical lens modules and manufacturing method thereof
DE102017203304A1 (de) 2016-03-17 2017-09-21 Sony Corporation Linsenstack auf waferebene, optisches system, elektronische einrichtung und verfahren
US20170290170A1 (en) * 2016-03-30 2017-10-05 Delphi Technologies, Inc. Method Of Making A Camera For Use On A Vehicle
JP6731280B2 (ja) * 2016-05-06 2020-07-29 日本電産コパル株式会社 撮像装置
US10412281B2 (en) 2016-06-06 2019-09-10 Microsoft Technology Licensing, Llc Device with split imaging system
US10021281B2 (en) 2016-06-06 2018-07-10 Microsoft Technology Licensing, Llc Device with split imaging system
KR20170139982A (ko) * 2016-06-10 2017-12-20 엘지전자 주식회사 이동 단말기
US11579341B2 (en) 2017-01-26 2023-02-14 Ningbo Sunny Opotech Co., Ltd. Lens, camera module and manufacturing method thereof
JP6878018B2 (ja) 2017-01-26 2021-05-26 ソニーセミコンダクタソリューションズ株式会社 Ａｆモジュール、カメラモジュール、および、電子機器
CN114815135B (zh) * 2021-01-22 2024-04-02 北京小米移动软件有限公司 摄像镜头、摄像装置及电子设备
US20220381955A1 (en) * 2021-05-28 2022-12-01 Zebra Technologies Corporation Moving front lens group mechanically located to fixed rear lens group
EP4456525A1 (en) * 2023-04-27 2024-10-30 Valeo Comfort and Driving Assistance Image capture device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07181389A (ja) * 1993-12-22 1995-07-21 Minolta Co Ltd コンパクトなマクロレンズ
JP2005148109A (ja) * 2003-11-11 2005-06-09 Konica Minolta Opto Inc 撮像装置及び該撮像装置を備えた携帯端末
JP2005266129A (ja) * 2004-03-17 2005-09-29 Olympus Corp ズームレンズ及びそれを有する電子撮像装置
JP2006276897A (ja) * 1999-01-12 2006-10-12 Konica Minolta Opto Inc ズームレンズ

Family Cites Families (105)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2279372A (en) * 1940-10-03 1942-04-14 Eastman Kodak Co Photographic objective
US3087384A (en) * 1959-01-24 1963-04-30 Agfa Ag Triplet wide-angle objective lens
US4257086A (en) * 1979-10-22 1981-03-17 Koehler Manufacturing Company Method and apparatus for controlling radiant energy
US4690512A (en) * 1985-01-28 1987-09-01 Polaroid Corporation Composite lens assembly
US4727389A (en) * 1986-02-07 1988-02-23 W. Haking Enterprises Limited Automatic focus and exposure controlled camera
US4987435A (en) * 1989-03-29 1991-01-22 Copal Company Limited Compact camera with apparatus size adjustment by zooming
US5095204A (en) * 1990-08-30 1992-03-10 Ball Corporation Machine vision inspection system and method for transparent containers
US5149181A (en) * 1990-11-02 1992-09-22 Pilkington Visioncare, Inc. Lens wafer, laminate lens and method of fabrication thereof
JP2775521B2 (ja) * 1990-11-09 1998-07-16 コニカ株式会社 ズームレンズ鏡胴
US5196963A (en) * 1991-03-18 1993-03-23 Fuji Photo Film Co., Ltd. Zoom lens device
US5510937A (en) * 1992-12-14 1996-04-23 Asahi Kogaku Kogyo Kabushiki Kaisha Apparatus for adjusting intermeshing angle in feed screw mechanism
JP2679681B2 (ja) * 1995-04-28 1997-11-19 日本電気株式会社 半導体装置、半導体装置用パッケージ及びその製造方法
US6351288B1 (en) * 1997-06-27 2002-02-26 Eastman Kodak Company Sensor tilt control for a digital camera
US6249311B1 (en) * 1998-02-24 2001-06-19 Inframetrics Inc. Lens assembly with incorporated memory module
US6011661A (en) * 1998-04-07 2000-01-04 Weng; Leo Optical holder for an optical apparatus
US7345021B1 (en) * 1999-03-26 2008-03-18 Beth Israel Deaconess Medical Center Method for PR-39 peptide regulated stimulation of angiogenesis
EP1156705B1 (en) * 1999-10-01 2006-03-01 Seiko Epson Corporation Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment
US6374004B1 (en) * 1999-10-14 2002-04-16 Digital Optics Corporation Optical subassembly
JP3980237B2 (ja) * 2000-01-25 2007-09-26 富士フイルム株式会社 デジタルカメラ
JP4405062B2 (ja) * 2000-06-16 2010-01-27 株式会社ルネサステクノロジ 固体撮像装置
US6426839B2 (en) * 2000-06-27 2002-07-30 Milestone Co., Ltd. Image pickup lens unit
JP4416290B2 (ja) * 2000-07-31 2010-02-17 富士フイルム株式会社 デジタルカメラ
US6359740B1 (en) * 2000-09-20 2002-03-19 San Hua Tien Precision Circuit Co., Ltd. Image capturing device
US6683298B1 (en) * 2000-11-20 2004-01-27 Agilent Technologies Inc. Image sensor packaging with package cavity sealed by the imaging optics
US6821033B2 (en) * 2000-11-21 2004-11-23 Nidec Copal Corporation Electromagnetic actuator and shutter device for camera
US6686588B1 (en) * 2001-01-16 2004-02-03 Amkor Technology, Inc. Optical module with lens integral holder
JP2002244178A (ja) * 2001-02-20 2002-08-28 Seiko Precision Inc フォーカルプレーンシャッタ
JP4312596B2 (ja) * 2001-07-20 2009-08-12 ミシェル・サヤグ 画像キャプチャデバイスに光学的に結合されたレンズシステム
JP3961797B2 (ja) * 2001-08-28 2007-08-22 ペンタックス株式会社 レンズ光軸調整装置
JP4266106B2 (ja) * 2001-09-27 2009-05-20 株式会社東芝 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法
JP2003262648A (ja) * 2002-03-11 2003-09-19 Mitsubishi Electric Corp 加速度センサの出力補正装置および出力補正方法
JP2003318585A (ja) * 2002-04-24 2003-11-07 Toshiba Corp 電子機器
US6873024B1 (en) * 2002-05-15 2005-03-29 Eastman Kodak Company Apparatus and method for wafer level packaging of optical imaging semiconductor devices
US6768867B2 (en) * 2002-05-17 2004-07-27 Olympus Corporation Auto focusing system
US6811331B2 (en) * 2002-06-12 2004-11-02 Olympus Corporation Lens shutter system
JP2004029554A (ja) * 2002-06-27 2004-01-29 Olympus Corp 撮像レンズユニットおよび撮像装置
JP2004088713A (ja) * 2002-06-27 2004-03-18 Olympus Corp 撮像レンズユニットおよび撮像装置
JP3952897B2 (ja) * 2002-07-31 2007-08-01 日本電気株式会社 カメラモジュール及びそれを用いた携帯通信端末
US7652715B2 (en) * 2002-08-08 2010-01-26 Ricoh Company, Ltd. Photographing apparatus with improved system initialization and movement of optical system
US7010224B2 (en) * 2002-08-27 2006-03-07 Pentax Corporation Lens barrel incorporating the rotation transfer mechanism
JP4104400B2 (ja) * 2002-08-30 2008-06-18 日本電産コパル株式会社 カメラ用遮光羽根駆動装置
JP4017946B2 (ja) * 2002-09-02 2007-12-05 株式会社エルモ社 監視カメラ装置
US7564496B2 (en) * 2002-09-17 2009-07-21 Anteryon B.V. Camera device, method of manufacturing a camera device, wafer scale package
WO2004028138A2 (en) * 2002-09-23 2004-04-01 Concord Camera Corp. Image capture device
US6869233B2 (en) * 2002-09-23 2005-03-22 Concord Camera Corp. Image capture device
JP2004226872A (ja) * 2003-01-27 2004-08-12 Sanyo Electric Co Ltd カメラモジュール及びその製造方法
JP2004226873A (ja) * 2003-01-27 2004-08-12 Sanyo Electric Co Ltd カメラモジュール及びその製造方法
US6841883B1 (en) * 2003-03-31 2005-01-11 Micron Technology, Inc. Multi-dice chip scale semiconductor components and wafer level methods of fabrication
FR2854496B1 (fr) * 2003-04-29 2005-09-16 St Microelectronics Sa Boitier semi-conducteur
JP4303610B2 (ja) * 2003-05-19 2009-07-29 富士フイルム株式会社 多層配線基板、部品実装方法、及び、撮像装置
KR100703495B1 (ko) * 2003-07-16 2007-04-03 삼성전자주식회사 양 방향 슬라이딩 타입 휴대용 단말기
JP4441211B2 (ja) * 2003-08-13 2010-03-31 シチズン電子株式会社 小型撮像モジュール
EP1662308A4 (en) * 2003-08-21 2011-03-02 Olympus Corp ELECTROSTATIC ACTUATOR, BLADDER DEVICE, PICTURE MODULE AND CAMERA
US7309943B2 (en) * 2003-09-08 2007-12-18 New Scale Technologies, Inc. Mechanism comprised of ultrasonic lead screw motor
JP4317411B2 (ja) * 2003-09-17 2009-08-19 日本電産コパル株式会社 カメラ用羽根駆動装置
US6995462B2 (en) * 2003-09-17 2006-02-07 Micron Technology, Inc. Image sensor packages
TWI274928B (en) * 2003-09-22 2007-03-01 Alps Electric Co Ltd Focal point adjustment device
US7178998B2 (en) * 2003-09-24 2007-02-20 Nidec Copal Corporation Focal plane shutter for digital still cameras
JP2005128116A (ja) * 2003-10-22 2005-05-19 Seiko Precision Inc 光学モジュール
JP2005284153A (ja) * 2004-03-30 2005-10-13 Nidec Copal Corp 撮像レンズ
JP2005295050A (ja) * 2004-03-31 2005-10-20 Miyota Kk カメラモジュール
KR100652375B1 (ko) * 2004-06-29 2006-12-01 삼성전자주식회사 와이어 본딩 패키지를 포함하는 이미지 센서 모듈 구조물및 그 제조방법
KR100592368B1 (ko) * 2004-07-06 2006-06-22 삼성전자주식회사 반도체 소자의 초박형 모듈 제조 방법
JP4143575B2 (ja) * 2004-07-07 2008-09-03 シャープ株式会社 撮像モジュール
TWI236573B (en) * 2004-07-09 2005-07-21 Asia Optical Co Inc Camera lens with adjustment mechanism
JP4365743B2 (ja) * 2004-07-27 2009-11-18 富士通マイクロエレクトロニクス株式会社 撮像装置
KR100674911B1 (ko) * 2004-08-06 2007-01-26 삼성전자주식회사 이미지 센서 카메라 모듈 및 그 제조방법
US20060054782A1 (en) * 2004-08-25 2006-03-16 Olsen Richard I Apparatus for multiple camera devices and method of operating same
US7719965B2 (en) * 2004-08-25 2010-05-18 Agilent Technologies, Inc. Methods and systems for coordinated monitoring of network transmission events
US20060043513A1 (en) * 2004-09-02 2006-03-02 Deok-Hoon Kim Method of making camera module in wafer level
WO2006032002A1 (en) * 2004-09-13 2006-03-23 Fusion Optix, Inc. High contrast optical path corrected screen
JP4157086B2 (ja) * 2004-09-24 2008-09-24 株式会社東芝 ズームレンズユニットおよび撮像装置
US7864245B2 (en) * 2004-11-12 2011-01-04 Samsung Techwin Co., Ltd. Camera module and method of manufacturing the same
US7128295B2 (en) * 2005-01-07 2006-10-31 The Boeing Company Pivot mechanism for quick installation of stowage bins or rotating items
WO2006093377A1 (en) * 2005-03-04 2006-09-08 Hyun-Joo Jung Camera module without focusing adjustment and method of assembling thereof
JP2007012995A (ja) * 2005-07-01 2007-01-18 Toshiba Corp 超小型カメラモジュール及びその製造方法
TWI289352B (en) * 2005-07-06 2007-11-01 Asia Optical Co Inc Micro lens and its manufacturing method
CN1892402A (zh) * 2005-07-09 2007-01-10 鸿富锦精密工业（深圳）有限公司 数码相机模块
JP4762627B2 (ja) * 2005-07-25 2011-08-31 オリンパス株式会社 撮像装置および撮像装置の製造方法
US7508606B2 (en) * 2005-07-29 2009-03-24 Flextronics Ap Llc Method of aligning the upper and lower centering bells of a lens doublet assembly machine
CN100543575C (zh) * 2005-07-29 2009-09-23 鸿富锦精密工业（深圳）有限公司 自动对焦镜头
KR100721167B1 (ko) * 2005-08-24 2007-05-23 삼성전기주식회사 이미지 센서 모듈과 그 제조 방법 및 이를 이용한 카메라모듈
JP4254766B2 (ja) * 2005-09-06 2009-04-15 ミツミ電機株式会社 カメラモジュール
US20070052050A1 (en) * 2005-09-07 2007-03-08 Bart Dierickx Backside thinned image sensor with integrated lens stack
US7531773B2 (en) * 2005-09-08 2009-05-12 Flextronics Ap, Llc Auto-focus and zoom module having a lead screw with its rotation results in translation of an optics group
US7573011B2 (en) * 2005-09-08 2009-08-11 Flextronics Ap, Llc Zoom module using actuator and lead screw with translating operation
US7590505B2 (en) * 2005-09-08 2009-09-15 Flextronics Ap, Llc Manufacturable micropositioning system employing sensor target
US7684689B2 (en) * 2005-09-15 2010-03-23 Flextronics International Usa, Inc. External adjustment mechanism for a camera lens and electronic imager
JP5095158B2 (ja) * 2005-09-30 2012-12-12 Ｈｏｙａ株式会社 光学機器
US7469100B2 (en) * 2005-10-03 2008-12-23 Flextronics Ap Llc Micro camera module with discrete manual focal positions
JP2007188909A (ja) * 2005-12-14 2007-07-26 Fujifilm Corp 固体撮像装置及びその製造方法
TWI314665B (en) * 2006-01-12 2009-09-11 Lite On Technology Corp Digital camera module
KR101294419B1 (ko) * 2006-03-10 2013-08-08 엘지이노텍 주식회사 카메라 모듈 및 그 제조 방법
KR100770684B1 (ko) * 2006-05-18 2007-10-29 삼성전기주식회사 카메라 모듈 패키지
KR100790996B1 (ko) * 2006-08-30 2008-01-03 삼성전자주식회사 이미지 센서 패키지, 그 제조 방법 및 이를 포함하는이미지 센서 모듈
US8112128B2 (en) * 2006-08-31 2012-02-07 Flextronics Ap, Llc Discreetly positionable camera housing
DE102006041440B4 (de) * 2006-09-04 2011-11-24 Texas Instruments Deutschland Gmbh CMOS-Ausgangstreiber
US7580209B2 (en) * 2006-09-15 2009-08-25 Flextronics Ap, Llc Auto-focus and zoom module with vibrational actuator and position sensing method
EP1903364A1 (en) * 2006-09-25 2008-03-26 Dialog Imaging Systems GmbH Compact camera module with stationary actutor for zoom modules with movable shutter and aperture mechanism
US7477461B2 (en) * 2006-12-22 2009-01-13 Flextronics Ap, Llc Three-element photographic objective with reduced tolerance sensitivities
WO2008133943A1 (en) * 2007-04-24 2008-11-06 Flextronics Ap Llc Small form factor modules using wafer level optics with bottom cavity and flip chip assembly
US8083421B2 (en) * 2007-05-07 2011-12-27 Flextronics Ap, Llc AF/zoom shutter with two blades function
US8270177B2 (en) * 2007-07-27 2012-09-18 Renesas Electronics Corporation Electronic device and method for manufacturing electronic device
US9419032B2 (en) * 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
US8545114B2 (en) * 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07181389A (ja) * 1993-12-22 1995-07-21 Minolta Co Ltd コンパクトなマクロレンズ
JP2006276897A (ja) * 1999-01-12 2006-10-12 Konica Minolta Opto Inc ズームレンズ
JP2005148109A (ja) * 2003-11-11 2005-06-09 Konica Minolta Opto Inc 撮像装置及び該撮像装置を備えた携帯端末
JP2005266129A (ja) * 2004-03-17 2005-09-29 Olympus Corp ズームレンズ及びそれを有する電子撮像装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010139622A (ja) * 2008-12-10 2010-06-24 Konica Minolta Holdings Inc 駆動装置および撮像装置
JP2014174551A (ja) * 2013-03-11 2014-09-22 Samsung Electronics Co Ltd カメラモジュールを含む電子装置
WO2016117250A1 (ja) * 2015-01-23 2016-07-28 シャープ株式会社 カメラモジュールの製造方法、像面側群レンズ、像面側群レンズの製造方法、および撮像素子
JPWO2016117250A1 (ja) * 2015-01-23 2017-09-07 シャープ株式会社 カメラモジュールの製造方法、およびカメラモジュール
US10306121B2 (en) 2015-01-23 2019-05-28 Sharp Kabushiki Kaisha Method of manufacturing camera module and camera module

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WO2008133946A1 (en) 2008-11-06
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CN101681085A (zh) 2010-03-24
US20090015706A1 (en) 2009-01-15
CA2685083A1 (en) 2008-11-06

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