CA2685083A1 - Auto focus/zoom modules using wafer level optics - Google Patents
Auto focus/zoom modules using wafer level optics Download PDFInfo
- Publication number
- CA2685083A1 CA2685083A1 CA002685083A CA2685083A CA2685083A1 CA 2685083 A1 CA2685083 A1 CA 2685083A1 CA 002685083 A CA002685083 A CA 002685083A CA 2685083 A CA2685083 A CA 2685083A CA 2685083 A1 CA2685083 A1 CA 2685083A1
- Authority
- CA
- Canada
- Prior art keywords
- lens unit
- image capture
- lens
- capture device
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US92594707P | 2007-04-24 | 2007-04-24 | |
| US60/925,947 | 2007-04-24 | ||
| PCT/US2008/005298 WO2008133946A1 (en) | 2007-04-24 | 2008-04-24 | Auto focus/ zoom modules using wafer level optics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2685083A1 true CA2685083A1 (en) | 2008-11-06 |
Family
ID=39925982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002685083A Abandoned CA2685083A1 (en) | 2007-04-24 | 2008-04-24 | Auto focus/zoom modules using wafer level optics |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090015706A1 (enExample) |
| JP (3) | JP2010525413A (enExample) |
| CN (1) | CN101681085B (enExample) |
| CA (1) | CA2685083A1 (enExample) |
| WO (1) | WO2008133946A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102590977A (zh) * | 2011-01-06 | 2012-07-18 | 日本电产三协株式会社 | 透镜驱动装置的制造方法 |
Families Citing this family (46)
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| US8456560B2 (en) * | 2007-01-26 | 2013-06-04 | Digitaloptics Corporation | Wafer level camera module and method of manufacture |
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| CA2685080A1 (en) * | 2007-04-24 | 2008-11-06 | Flextronics Ap Llc | Small form factor modules using wafer level optics with bottom cavity and flip-chip assembly |
| US7825985B2 (en) * | 2007-07-19 | 2010-11-02 | Flextronics Ap, Llc | Camera module back-focal length adjustment method and ultra compact components packaging |
| US9118825B2 (en) | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
| KR101634353B1 (ko) | 2008-12-04 | 2016-06-28 | 삼성전자주식회사 | 마이크로 렌즈, 상기 마이크로 렌즈 제조방법, 상기 마이크로 렌즈 제조 장치, 및 상기 마이크로 렌즈를 구비한카메라 모듈 |
| JP5422986B2 (ja) * | 2008-12-10 | 2014-02-19 | コニカミノルタ株式会社 | 駆動装置および撮像装置 |
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| KR101648540B1 (ko) | 2009-08-13 | 2016-08-16 | 삼성전자주식회사 | 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 장치 |
| US9419032B2 (en) * | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
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| JP5539430B2 (ja) * | 2012-03-22 | 2014-07-02 | 富士フイルム株式会社 | 電子機器の製造方法 |
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| KR102064596B1 (ko) * | 2013-03-11 | 2020-02-11 | 삼성전자 주식회사 | 카메라 모듈을 포함하는 전자장치 |
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| JP6479857B2 (ja) * | 2015-01-23 | 2019-03-06 | シャープ株式会社 | カメラモジュールの製造方法 |
| US10890733B2 (en) * | 2015-04-06 | 2021-01-12 | Ams Sensors Singapore Pte. Ltd. | Image sensor module with auto focus control |
| JP6583611B2 (ja) * | 2015-04-27 | 2019-10-02 | ミツミ電機株式会社 | カメラ装置の組立て方法およびレンズユニットの組立て方法 |
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| CN114815135B (zh) * | 2021-01-22 | 2024-04-02 | 北京小米移动软件有限公司 | 摄像镜头、摄像装置及电子设备 |
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| EP4456525A1 (en) * | 2023-04-27 | 2024-10-30 | Valeo Comfort and Driving Assistance | Image capture device |
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2008
- 2008-04-24 JP JP2010506259A patent/JP2010525413A/ja active Pending
- 2008-04-24 US US12/150,119 patent/US20090015706A1/en not_active Abandoned
- 2008-04-24 CN CN200880021357.0A patent/CN101681085B/zh not_active Expired - Fee Related
- 2008-04-24 WO PCT/US2008/005298 patent/WO2008133946A1/en not_active Ceased
- 2008-04-24 CA CA002685083A patent/CA2685083A1/en not_active Abandoned
-
2012
- 2012-10-11 JP JP2012226416A patent/JP2013020267A/ja active Pending
-
2014
- 2014-07-03 JP JP2014138040A patent/JP2014194585A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102590977A (zh) * | 2011-01-06 | 2012-07-18 | 日本电产三协株式会社 | 透镜驱动装置的制造方法 |
| CN102590977B (zh) * | 2011-01-06 | 2015-11-25 | 日本电产三协株式会社 | 透镜驱动装置的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101681085B (zh) | 2014-11-19 |
| CN101681085A (zh) | 2010-03-24 |
| JP2010525413A (ja) | 2010-07-22 |
| US20090015706A1 (en) | 2009-01-15 |
| WO2008133946A1 (en) | 2008-11-06 |
| JP2014194585A (ja) | 2014-10-09 |
| JP2013020267A (ja) | 2013-01-31 |
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| Date | Code | Title | Description |
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| EEER | Examination request | ||
| FZDE | Discontinued |
Effective date: 20150424 |