JP2010502030A5 - - Google Patents
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- Publication number
- JP2010502030A5 JP2010502030A5 JP2009526145A JP2009526145A JP2010502030A5 JP 2010502030 A5 JP2010502030 A5 JP 2010502030A5 JP 2009526145 A JP2009526145 A JP 2009526145A JP 2009526145 A JP2009526145 A JP 2009526145A JP 2010502030 A5 JP2010502030 A5 JP 2010502030A5
- Authority
- JP
- Japan
- Prior art keywords
- groove
- chip
- chip according
- recess
- wire element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0607588A FR2905518B1 (fr) | 2006-08-29 | 2006-08-29 | Puce microelectronique a faces laterales munies de rainures et procede de fabrication |
| FR0607588 | 2006-08-29 | ||
| PCT/FR2007/001034 WO2008025889A1 (fr) | 2006-08-29 | 2007-06-21 | Puce microelectronique nue munie d'un evidement formant un logement pour un element filaire constituant un support mecanique souple, procede de fabrication et microstructure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010502030A JP2010502030A (ja) | 2010-01-21 |
| JP2010502030A5 true JP2010502030A5 (enExample) | 2010-08-12 |
| JP5059110B2 JP5059110B2 (ja) | 2012-10-24 |
Family
ID=37882559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009526145A Active JP5059110B2 (ja) | 2006-08-29 | 2007-06-21 | 柔軟性機械的サポートを構成するワイヤ要素用ハウジングを形成する凹部を具備するベアマイクロエレクトロニクスチップ、製造プロセスおよび微細構造 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8093617B2 (enExample) |
| EP (1) | EP2057687B1 (enExample) |
| JP (1) | JP5059110B2 (enExample) |
| CN (1) | CN101523605B (enExample) |
| ES (1) | ES2539640T3 (enExample) |
| FR (1) | FR2905518B1 (enExample) |
| WO (1) | WO2008025889A1 (enExample) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2928491A1 (fr) | 2008-03-06 | 2009-09-11 | Commissariat Energie Atomique | Procede et dispositif de fabrication d'un assemblage d'au moins deux puces microelectroniques |
| FR2937464B1 (fr) * | 2008-10-21 | 2011-02-25 | Commissariat Energie Atomique | Assemblage d'une puce microelectronique a rainure avec un element filaire sous forme de toron et procede d'assemblage |
| FR2945151B1 (fr) | 2009-04-30 | 2011-04-29 | Commissariat Energie Atomique | Procede de fixation d'un composant electronique sur un produit |
| FR2954588B1 (fr) * | 2009-12-23 | 2014-07-25 | Commissariat Energie Atomique | Procede d'assemblage d'au moins une puce avec un element filaire, puce electronique a element de liaison deformable, procede de fabrication d'une pluralite de puces, et assemblage d'au moins une puce avec un element filaire |
| FR2955972B1 (fr) * | 2010-02-03 | 2012-03-09 | Commissariat Energie Atomique | Procede d'assemblage d'au moins une puce avec un tissu incluant un dispositif a puce |
| JP5640892B2 (ja) * | 2011-05-23 | 2014-12-17 | 三菱電機株式会社 | 半導体装置 |
| FR2978607A1 (fr) | 2011-07-28 | 2013-02-01 | Commissariat Energie Atomique | Procede d'assemblage d'un dispositif a puce micro-electronique dans un tissu, dispositif a puce, et tissu incorporant un dispositif a puce serti |
| FR2986372B1 (fr) * | 2012-01-31 | 2014-02-28 | Commissariat Energie Atomique | Procede d'assemblage d'un element a puce micro-electronique sur un element filaire, installation permettant de realiser l'assemblage |
| KR102056413B1 (ko) | 2014-09-30 | 2019-12-16 | 애플 인크. | 임베디드 전기 컴포넌트를 갖는 패브릭 |
| US10499502B2 (en) * | 2015-01-27 | 2019-12-03 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | Flexible device module for fabric layer assembly and method for production |
| CN104881694A (zh) * | 2015-05-30 | 2015-09-02 | 宁波慧豪信息产业有限公司 | 一种基于rfid双协议的数据读写方法、终端及系统 |
| US9936595B2 (en) | 2015-11-23 | 2018-04-03 | Thomson Licensing | Wire retention cover for printed circuit boards in an electronic device |
| US10485103B1 (en) | 2016-02-22 | 2019-11-19 | Apple Inc. | Electrical components attached to fabric |
| FR3062237B1 (fr) | 2017-01-23 | 2020-05-01 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de realisation d’une puce a circuit integre et puce a circuit integre. |
| FR3062515B1 (fr) | 2017-01-30 | 2019-11-01 | Primo1D | Procede d'insertion d'un fil dans une rainure d'une puce de semi-conducteur, et equipement pour la mise en œuvre d’un tel procede. |
| FR3065578B1 (fr) * | 2017-04-19 | 2019-05-03 | Primo1D | Procede d'assemblage d'une puce microelectronique sur un element filaire |
| FR3065579B1 (fr) | 2017-04-19 | 2019-05-03 | Primo1D | Dispositif d'emission reception radiofrequence |
| DE102017108580A1 (de) * | 2017-04-21 | 2018-10-25 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauteil und Gewebe |
| WO2018228031A1 (en) * | 2017-06-16 | 2018-12-20 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing, method for producing the same and mobile terminal |
| CN107148188B (zh) * | 2017-06-16 | 2020-08-07 | Oppo广东移动通信有限公司 | 壳体组件的制备方法、壳体组件和移动终端 |
| FR3076071B1 (fr) | 2017-12-21 | 2019-11-15 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d’une puce a circuit integre et puce a circuit integre |
| FR3078980B1 (fr) | 2018-03-14 | 2021-06-11 | Primo1D | Fil guipe compose d’une ame principale et d’au moins un fils de couverture et comprenant au moins un element filaire conducteur relie electriquement a au moins une puce electronique |
| CN112384956B (zh) | 2018-05-22 | 2024-03-15 | 先讯美资电子有限责任公司 | 细长柔性标签 |
| FR3083643B1 (fr) | 2018-07-04 | 2023-01-13 | Commissariat Energie Atomique | Procede de realisation d'un dispositif electronique |
| US11913143B2 (en) * | 2019-03-08 | 2024-02-27 | Apple Inc. | Fabric with electrical components |
| US12223814B2 (en) | 2019-09-16 | 2025-02-11 | Sensormatic Electronics, LLC | Security tag for textiles using conductive thread |
| US11443160B2 (en) | 2019-09-18 | 2022-09-13 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
| US10970613B1 (en) | 2019-09-18 | 2021-04-06 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
| FR3103630B1 (fr) | 2019-11-22 | 2022-06-03 | Primo1D | Puce fonctionnelle adaptee pour etre assemblee a des elements filaires, et procede de fabrication d’une telle puce |
| US11055588B2 (en) | 2019-11-27 | 2021-07-06 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
| CN113077026A (zh) * | 2020-01-03 | 2021-07-06 | 北京梦之墨科技有限公司 | 一种水洗电子标签 |
| US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
| US20230008099A1 (en) * | 2021-07-12 | 2023-01-12 | Apple Inc. | Fabric Seam with Electrical Components |
| US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
| FR3150613B1 (fr) | 2023-06-30 | 2025-12-12 | Primo1D | Dispositif d'émission-réception radiofréquence comprenant un fil conducteur formant antenne enroule en spires |
| EP4485522B1 (en) | 2023-06-30 | 2025-10-15 | Hitachi Energy Ltd | Power semiconductor module comprising embedded flexible electrical signal connector and method for producing a power semiconductor module |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3211604B2 (ja) * | 1995-02-03 | 2001-09-25 | 株式会社日立製作所 | 半導体装置 |
| JPH10214919A (ja) * | 1997-01-29 | 1998-08-11 | New Japan Radio Co Ltd | マルチチップモジュールの製造方法 |
| JP2002343933A (ja) * | 2001-05-18 | 2002-11-29 | Mitsubishi Electric Corp | 半導体記憶装置 |
| JP3660918B2 (ja) * | 2001-07-04 | 2005-06-15 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
| JP2003163313A (ja) * | 2001-09-13 | 2003-06-06 | Texas Instr Japan Ltd | 半導体装置及びその製造方法 |
| US6727115B2 (en) * | 2001-10-31 | 2004-04-27 | Hewlett-Packard Development Company, L.P. | Back-side through-hole interconnection of a die to a substrate |
| US7144830B2 (en) * | 2002-05-10 | 2006-12-05 | Sarnoff Corporation | Plural layer woven electronic textile, article and method |
| US7485489B2 (en) * | 2002-06-19 | 2009-02-03 | Bjoersell Sten | Electronics circuit manufacture |
| US6646336B1 (en) * | 2002-06-28 | 2003-11-11 | Koninkl Philips Electronics Nv | Wearable silicon chip |
| JP2004288680A (ja) * | 2003-03-19 | 2004-10-14 | Mitsubishi Electric Corp | 圧接型半導体装置 |
| US7716823B2 (en) * | 2004-04-08 | 2010-05-18 | Hewlett-Packard Development Company, L.P. | Bonding an interconnect to a circuit device and related devices |
| US7025596B2 (en) * | 2004-06-14 | 2006-04-11 | Motorola, Inc. | Method and apparatus for solder-less attachment of an electronic device to a textile circuit |
| US20060278997A1 (en) * | 2004-12-01 | 2006-12-14 | Tessera, Inc. | Soldered assemblies and methods of making the same |
| US7675153B2 (en) * | 2005-02-02 | 2010-03-09 | Kabushiki Kaisha Toshiba | Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof |
| US20080002460A1 (en) * | 2006-03-01 | 2008-01-03 | Tessera, Inc. | Structure and method of making lidded chips |
-
2006
- 2006-08-29 FR FR0607588A patent/FR2905518B1/fr not_active Expired - Fee Related
-
2007
- 2007-06-21 ES ES07803768.6T patent/ES2539640T3/es active Active
- 2007-06-21 JP JP2009526145A patent/JP5059110B2/ja active Active
- 2007-06-21 WO PCT/FR2007/001034 patent/WO2008025889A1/fr not_active Ceased
- 2007-06-21 CN CN2007800383632A patent/CN101523605B/zh active Active
- 2007-06-21 US US12/310,246 patent/US8093617B2/en active Active
- 2007-06-21 EP EP07803768.6A patent/EP2057687B1/fr active Active
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