JP5059110B2 - 柔軟性機械的サポートを構成するワイヤ要素用ハウジングを形成する凹部を具備するベアマイクロエレクトロニクスチップ、製造プロセスおよび微細構造 - Google Patents

柔軟性機械的サポートを構成するワイヤ要素用ハウジングを形成する凹部を具備するベアマイクロエレクトロニクスチップ、製造プロセスおよび微細構造 Download PDF

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JP5059110B2
JP5059110B2 JP2009526145A JP2009526145A JP5059110B2 JP 5059110 B2 JP5059110 B2 JP 5059110B2 JP 2009526145 A JP2009526145 A JP 2009526145A JP 2009526145 A JP2009526145 A JP 2009526145A JP 5059110 B2 JP5059110 B2 JP 5059110B2
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chip
groove
wire element
recess
microelectronic
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JP2010502030A5 (enExample
JP2010502030A (ja
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ドミニク、ビカル
ブルーノ、ムーレイ
ジャン、ブラン
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article
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US12223814B2 (en) 2019-09-16 2025-02-11 Sensormatic Electronics, LLC Security tag for textiles using conductive thread
US11861440B2 (en) 2019-09-18 2024-01-02 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11928538B2 (en) 2019-09-18 2024-03-12 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US11769026B2 (en) 2019-11-27 2023-09-26 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article

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WO2008025889A1 (fr) 2008-03-06
EP2057687B1 (fr) 2015-04-22
ES2539640T3 (es) 2015-07-02
US20090200066A1 (en) 2009-08-13
FR2905518B1 (fr) 2008-12-26
FR2905518A1 (fr) 2008-03-07
EP2057687A1 (fr) 2009-05-13
CN101523605B (zh) 2012-07-11
US8093617B2 (en) 2012-01-10
CN101523605A (zh) 2009-09-02

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