CN101523605B - 设置有形成构成柔性机械支撑的布线元件的壳体的凹形的裸微电子芯片、制造工艺和微结构 - Google Patents

设置有形成构成柔性机械支撑的布线元件的壳体的凹形的裸微电子芯片、制造工艺和微结构 Download PDF

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CN101523605B
CN101523605B CN2007800383632A CN200780038363A CN101523605B CN 101523605 B CN101523605 B CN 101523605B CN 2007800383632 A CN2007800383632 A CN 2007800383632A CN 200780038363 A CN200780038363 A CN 200780038363A CN 101523605 B CN101523605 B CN 101523605B
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chip
microelectronic
grooves
wire element
groove
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CN101523605A (zh
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多米尼克·维卡德
布鲁诺·穆雷
让·布龙
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US Atomic Energy Commission (AEC)
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CN2007800383632A 2006-08-29 2007-06-21 设置有形成构成柔性机械支撑的布线元件的壳体的凹形的裸微电子芯片、制造工艺和微结构 Active CN101523605B (zh)

Applications Claiming Priority (3)

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FR0607588A FR2905518B1 (fr) 2006-08-29 2006-08-29 Puce microelectronique a faces laterales munies de rainures et procede de fabrication
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US20090200066A1 (en) 2009-08-13
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