JP2010040955A5 - - Google Patents
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- Publication number
- JP2010040955A5 JP2010040955A5 JP2008205038A JP2008205038A JP2010040955A5 JP 2010040955 A5 JP2010040955 A5 JP 2010040955A5 JP 2008205038 A JP2008205038 A JP 2008205038A JP 2008205038 A JP2008205038 A JP 2008205038A JP 2010040955 A5 JP2010040955 A5 JP 2010040955A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- substrate
- formed along
- pads
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008205038A JP5205173B2 (ja) | 2008-08-08 | 2008-08-08 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008205038A JP5205173B2 (ja) | 2008-08-08 | 2008-08-08 | 半導体装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010040955A JP2010040955A (ja) | 2010-02-18 |
| JP2010040955A5 true JP2010040955A5 (enExample) | 2011-08-18 |
| JP5205173B2 JP5205173B2 (ja) | 2013-06-05 |
Family
ID=42013148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008205038A Expired - Fee Related JP5205173B2 (ja) | 2008-08-08 | 2008-08-08 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5205173B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0525602A (ja) * | 1991-07-17 | 1993-02-02 | Nippon Steel Corp | メツキ密着性に優れたアルミニウムメツキオーステナイト系ステンレス鋼板の製造法 |
| JP2013125765A (ja) * | 2011-12-13 | 2013-06-24 | Elpida Memory Inc | 半導体装置 |
| CN109003947A (zh) * | 2018-07-23 | 2018-12-14 | 苏州锝耀电子有限公司 | 大功率层叠式芯片结构 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3662461B2 (ja) * | 1999-02-17 | 2005-06-22 | シャープ株式会社 | 半導体装置、およびその製造方法 |
| JP4881620B2 (ja) * | 2006-01-06 | 2012-02-22 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| JP2008078367A (ja) * | 2006-09-21 | 2008-04-03 | Renesas Technology Corp | 半導体装置 |
| JP2008159786A (ja) * | 2006-12-22 | 2008-07-10 | Toshiba Corp | 半導体装置及び接着配線部材の製造方法 |
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2008
- 2008-08-08 JP JP2008205038A patent/JP5205173B2/ja not_active Expired - Fee Related