JP5205173B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP5205173B2
JP5205173B2 JP2008205038A JP2008205038A JP5205173B2 JP 5205173 B2 JP5205173 B2 JP 5205173B2 JP 2008205038 A JP2008205038 A JP 2008205038A JP 2008205038 A JP2008205038 A JP 2008205038A JP 5205173 B2 JP5205173 B2 JP 5205173B2
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Japan
Prior art keywords
semiconductor chip
bonding
substrate
wire
semiconductor
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Expired - Fee Related
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JP2008205038A
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English (en)
Japanese (ja)
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JP2010040955A (ja
JP2010040955A5 (enExample
Inventor
宏 黒田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
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Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2008205038A priority Critical patent/JP5205173B2/ja
Publication of JP2010040955A publication Critical patent/JP2010040955A/ja
Publication of JP2010040955A5 publication Critical patent/JP2010040955A5/ja
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Publication of JP5205173B2 publication Critical patent/JP5205173B2/ja
Expired - Fee Related legal-status Critical Current
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    • H10W72/0198—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5366—
    • H10W72/5434—
    • H10W72/5449—
    • H10W72/884—
    • H10W72/932—
    • H10W74/00—
    • H10W90/754—

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  • Wire Bonding (AREA)
JP2008205038A 2008-08-08 2008-08-08 半導体装置及びその製造方法 Expired - Fee Related JP5205173B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008205038A JP5205173B2 (ja) 2008-08-08 2008-08-08 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008205038A JP5205173B2 (ja) 2008-08-08 2008-08-08 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2010040955A JP2010040955A (ja) 2010-02-18
JP2010040955A5 JP2010040955A5 (enExample) 2011-08-18
JP5205173B2 true JP5205173B2 (ja) 2013-06-05

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ID=42013148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008205038A Expired - Fee Related JP5205173B2 (ja) 2008-08-08 2008-08-08 半導体装置及びその製造方法

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JP (1) JP5205173B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0525602A (ja) * 1991-07-17 1993-02-02 Nippon Steel Corp メツキ密着性に優れたアルミニウムメツキオーステナイト系ステンレス鋼板の製造法
JP2013125765A (ja) 2011-12-13 2013-06-24 Elpida Memory Inc 半導体装置
CN109003947A (zh) * 2018-07-23 2018-12-14 苏州锝耀电子有限公司 大功率层叠式芯片结构

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3662461B2 (ja) * 1999-02-17 2005-06-22 シャープ株式会社 半導体装置、およびその製造方法
JP4881620B2 (ja) * 2006-01-06 2012-02-22 ルネサスエレクトロニクス株式会社 半導体装置及びその製造方法
JP2008078367A (ja) * 2006-09-21 2008-04-03 Renesas Technology Corp 半導体装置
JP2008159786A (ja) * 2006-12-22 2008-07-10 Toshiba Corp 半導体装置及び接着配線部材の製造方法

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Publication number Publication date
JP2010040955A (ja) 2010-02-18

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