CN101211901A - 包含电子元件的基板 - Google Patents

包含电子元件的基板 Download PDF

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Publication number
CN101211901A
CN101211901A CNA2007101606339A CN200710160633A CN101211901A CN 101211901 A CN101211901 A CN 101211901A CN A2007101606339 A CNA2007101606339 A CN A2007101606339A CN 200710160633 A CN200710160633 A CN 200710160633A CN 101211901 A CN101211901 A CN 101211901A
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Prior art keywords
circuit board
electronic component
substrate
semiconductor element
connection pads
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CNA2007101606339A
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井上明宣
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Shinko Electric Industries Co Ltd
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication of CN101211901A publication Critical patent/CN101211901A/zh
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Abstract

本发明涉及一种包含电子元件的基板，其中包含电子元件的基板中，电子元件以多级堆叠方式安装在一对布线基板之间，一个布线基板和另一个布线基板通过焊球电气互连，第一电子元件安装在一个布线基板上，第二电子元件安装在第一电子元件上，其中用于包含第二电子元件的开口部分提供在另一个布线基板上，第二电子元件被容纳和安装在开口部分中并且通过丝焊电气连接到另一个布线基板上，一对布线基板之间的间隙由密封树脂密封。

Description

包含电子元件的基板
本申请要求2006年12月26日提交给日本专利局的申请号为2006-348755的日本专利申请的优先权，申请号为2006-348755的日本专利申请的整个内容已经通过引用合并入本申请中。
技术领域
本发明涉及一种包含电子元件的基板，尤其涉及其中有多个电子元件堆叠和安装在一对布线基板之间的一种包含电子元件的基板。
背景技术
作为包含置于两块布线基板之间的电子元件的包含电子元件的基板，已经提出如图11所示模式的产品(参见专利文献1(未审查公开号为2005-310984的日本专利)的0073段)。这个产品通过堆叠两个半导体装置300A、300B而形成。半导体装置300A、300B通过以焊球250连接焊条212A、213B来进行电气连接。
在半导体装置300A中，三个半导体元件230A、231A、232A以两级堆叠的方式安装在布线基板200A的上表面上。具体地，两个半导体元件230A、231A通过倒装芯片焊接分别安装在布线基板200A的焊条218A上，并且安装半导体元件232A来覆盖半导体元件230A、231A的背面。半导体元件232A通过丝焊电气连接到布线基板200A的连接焊盘216A上。半导体元件230A、231A、232A由树脂251密封。
同样，在半导体装置300B中，三个半导体元件230B、231B、232B以两级堆叠的方式安装在布线基板200B的上表面上。具体地，两个半导体元件230B、231B通过倒装芯片焊接分别安装在布线基板200B的焊条218B上，并且安装半导体元件232B来覆盖半导体元件230B、231B的背面。半导体元件232B通过倒装芯片焊接连接到布线基板200A的下表面上。
当观察图11中的半导体装置300A的构造时，下面的半导体元件230A、231A通过倒装芯片焊接连接到布线基板200A上并且因此底部填充树脂280渗出到的区域分别出现在半导体元件230A、231A的外周缘部分上。因此，当上面的半导体元件232A电气连接到连接焊盘216A上时，分别连接了焊线260的连接焊盘216A必须至少安装在底部填充树脂280渗出到的区域以外的区域中。结果，存在焊线260的长度变得更长的问题。
当上面的半导体元件232A的平面尺寸比下面的半导体元件230A、231A的更小或者上面的半导体元件232A的安装面积比半导体元件230A、231A的安装面积更小时，焊线的长度变得更长并且因此半导体元件232A不能直接通过丝焊来焊接到布线基板200A的连接焊盘216A上。因此，必须使用这样的构造，即，转接焊盘提供给下面的半导体元件230A、231A的背面，并且这些焊盘连接到布线基板200A上。在这样的模式中，焊线长度被拉长并且也需要额外的处理来进行丝焊连接。结果，还存在包含电子元件的基板的生产成本增加的问题。
在这种方式中，当电子元件如半导体元件等以多级堆叠方式安装时，出现包含电子元件的基板400的平面尺寸(平面面积)增加并且生产成本增加的问题。
发明内容
本发明的示范实施例提供一种包含电子元件的基板，其包含处于堆叠状态的多个电子元件，能够显著地减小平面尺寸(平面面积)并且能够在低成本下制造。
本发明提供一种包含电子元件的基板，其包含：
一对布线基板；
多个电子元件，其以堆叠方式安装在一对布线基板之间，电子元件包含安装在一个布线基板上的第一电子元件和安装在第一电子元件上的第二电子元件；
焊球，其电气连接一对布线基板；以及
密封树脂，其密封一对布线基板之间的间隙，
其中，另一个布线基板具有一个用于容纳第二电子元件的开口部分，以及
其中，第二电子元件的安装可以使得第二电子元件被容纳在另一个布线基板的开口部分中并且通过丝焊电气连接到另一个布线基板上。
第二电子元件的安装可以使得进行丝焊的表面位于另一个布线基板的厚度之内。因此，第二电子元件的丝焊表面的高度位置相对于另一个布线基板的连接焊盘能够降低。因此，在对第二电子元件和另一个布线基板进行丝焊时，由焊线形成的导线回路的顶端高度能够降低。结果，包含电子元件的基板的厚度尺寸能够减小。
可以用密封树脂覆盖第一电子元件，并且第二电子元件可以安装在密封树脂的表面上。因此包含电子元件的基板的制造能够变得更容易，因此，能够提供低廉的包含电子元件的基板。
第二电子元件可以直接粘附到第一电子元件上。因此一个布线基板和另一个布线基板之间的间隙、第一和第二电子元件以及焊线能够用树脂一起密封。结果，能够降低树脂密封步骤的耗时量。
通过在金属制成的形成球形的型芯材料的外表面上涂敷焊料而形成的包含型芯的焊球可以用作焊球。优选的是型芯材料可以用铜形成。因此，即使当薄的布线基板用作一个布线基板和另一个布线基板时，也能够提供具有足够机械强度的包含电子元件的基板。
根据本发明的包含电子元件的基板，通过丝焊连接到另一个布线基板的第二电子元件的焊条位置能够更接近另一个布线基板的连接焊盘。因此，能够相当多地减小焊线的长度并且也能够提供低成本的具有高的电子可靠性的包含电子元件的基板。
从下面详细的说明、附图和权利要求中，其它特点和优势会变得明显。
附图说明
图1是示出在本发明的第一实施例中的包含电子元件的基板的横截面图。
图2是示出图1中的包含电子元件的基板中的开口部分和其邻近区域的平面图。
图3是示出第一实施例中使用的焊球的结构的剖面图。
图4是示出在制造包含电子元件的基板的步骤中的状态的示例视图。
图5是示出在制造包含电子元件的基板的步骤中的状态的示例视图。
图6是示出在制造包含电子元件的基板的步骤中的状态的示例视图。
图7是示出在制造包含电子元件的基板的步骤中的状态的示例视图。
图8是示出包含电子元件的基板的横截面图，其中树脂填充在基板之间的间隙中以及安装在基板之间的两个半导体元件分别电气连接到分离的基板上。
图9是示出从图8所示的状态用树脂密封在上层侧上的包含第二半导体元件的布线基板的整个表面的状态的横截面图。
图10是示出本发明的第二实施例中的包含电子元件的基板的结构的横截面图。
图11是示出相关技术中的包含电子元件的基板的示范视图。
具体实施方式
(第一实施例)
下面将参照附图说明根据本发明的包含电子元件的基板的第一实施例。图1是示出在本发明的第一实施例中的包含电子元件的基板的横截面图。图2是示出图1所示的包含电子元件的基板中的开口部分和其邻近区域的平面图。图3是示出第一实施例中使用的焊球的结构的剖面图。
在本实施例中，包含电子元件的基板100的构造如下，其中作为第一电子元件的第一半导体元件30安装在一对布线基板(下层侧上的布线基板10和上层侧上的布线基板20)之间并且作为第二电子元件的第二半导体元件60安装在第一半导体元件30上。第一半导体元件30电气连接到作为一个布线基板的布线基板10上。第二半导体元件60电气连接到作为另一个布线基板的布线基板20上。布线基板10和布线基板20由焊球40电气连接，并且密封树脂50填充在布线基板10和布线基板20之间的间隙中。
布线图12由导体如铜等以公知方法分别形成在布线基板10的上表面和下表面上。布线基板10的表面由抗蚀剂13覆盖，并且布线图12上连接端子连接到其上的部分露出作为连接焊盘12A、12B。外部连接端子14连接到布线基板10的下表面上的连接焊盘12A上。连接到布线基板10的下表面上的外部连接端子14和形成在上表面上的布线图12通过通孔H电气连接。
第一半导体元件30安装在布线基板10的上表面上。第一半导体元件30通过倒装芯片焊接采用连接到焊条表面32上的凸块36如焊锡凸块、金凸块等连接到布线基板10的连接焊盘12B上。底部填充树脂80注入到第一半导体元件30的下表面(焊条表面)和布线基板10的上表面之间的间隙中，这样就密封了焊条表面32、凸块36和连接焊盘12B。
像布线基板10一样，在布线基板20的上表面和下表面上也分别按照公知方法形成由导体如铜等制成的布线图22。布线基板20的表面由抗蚀剂23覆盖，并且布线图22上连接端子连接到其上的部分和进行丝焊的部分分别露出作为连接焊盘22A和丝焊连接焊盘22B。形成在布线基板20的两个表面上的布线图22通过通孔H电气互连。
图2是示出布线基板20中的开口部分和其邻近区域的平面图。如图2所示，提供开口部分24给布线基板20来在厚度方向上穿过布线基板20。提供开口部分24以对作为第二电子元件的第二半导体元件60的安装区域开口。开口部分24比第二半导体元件60的平面尺寸更大。
布线基板10和布线基板20通过焊球40电气连接。在布线基板10的上表面上形成的连接焊盘12A和在布线基板20的下表面上形成的连接焊盘22A提供在相同的平面位置上。各个连接焊盘12A、22A通过焊球40电气互连。
在本实施例中，如图3所示，通过在铜芯42的外表面涂敷焊料44而形成的包含铜制型芯的焊球40被用作互连布线基板10和布线基板20的焊球40。这个铜芯42由金属材料铜形成并且制成实心球形。
由于使用其中包含铜芯42的焊球40，因此在布线基板10的连接焊盘12A和布线基板20的连接焊盘22A之间的间隙能够至少保持在等于铜芯42的直径尺寸的间隙的情况下，布线基板10和布线基板20电气连接。
密封树脂50填充在布线基板10和布线基板20之间的间隙中。这样布线基板10和布线基板20之间的间隙以及第一半导体元件30的背面由密封树脂50密封。密封树脂50的上表面的高度位置被设置成与布线基板20的下表面相同的高度位置处。
第二半导体元件60用粘合剂连接到密封树脂50上并由其支承。第二半导体元件60的上表面(进行丝焊的表面)的高度位置被设置得比布线基板20的上表面位置更低。换言之，第二半导体元件60的安装使得其上表面的高度位置位于布线基板20的厚度之内并且其丝焊表面位于开口部分24的区域之内。
第二半导体元件60的电气连接是通过用焊线70对提供在作为另一个布线基板的布线基板20的上表面上的丝焊连接焊盘22B和形成在第二半导体元件60上的焊条62进行连接来实现。
由于开口部分24比第二半导体元件60的平面尺寸更大，因此这样的开口部分24开口来围绕第二半导体元件60的外周缘。因为布线基板20的丝焊连接焊盘22B提供得离开口部分24的周缘部分更近，所以在第二半导体元件60的焊条62和布线基板20的丝焊连接焊盘22B之间的间隙能够减小。因此，焊条62和丝焊连接焊盘22B能够用焊线70容易地连接。在这种方式中，因为丝焊连接焊盘22B提供得离第二半导体元件60更近，所以能够减小包含电子元件的基板100的平面尺寸(平面面积)并且能够提高第二半导体元件60和布线基板20之间的电气连接的可靠性。
此外，在第二半导体元件60的平面尺寸比第一半导体元件30的小很多的情况下，第二半导体元件60和布线基板20能够简单地通过在第一半导体元件30的平面区域中提供开口部分24来进行连接。因此，无需提供用于转接焊线70的焊盘。在使用金丝作为焊线70的情况下，能够减少使用金子的量。因此能够低成本地提供包含电子元件的基板100。
接下来，下文将说明第一实施例中的包含电子元件的基板100的制造方法。附图4到图8是分别示出制造包含电子元件的基板的步骤中每一步的状态的示范视图。在这种情况下，能够分别使用公知的方法，比如在布线基板10和布线基板20上形成布线图的方法、涂敷抗蚀剂13、23的形成方法、露出连接焊盘12A、12B、22A和丝焊连接焊盘22B的方法等。因此，这里将省略它们的详细说明。
首先，如图4所示，作为第一电子元件的第一半导体元件30安装在作为一个布线基板的布线基板10上。凸块36如焊锡凸块、金凸块等置于第一半导体元件30的焊条32上。当凸块36与在布线基板10的上表面上形成的连接焊盘12B对准的同时，第一半导体元件30通过倒装芯片焊接安装在布线基板10上。在第一半导体元件30通过倒装芯片焊接安装在布线基板10上后，底部填充树脂80注入到第一半导体元件30和布线基板10的上表面之间的间隙中。
在底部填充树脂80注入后，如图5所示，其连接焊盘22A上连接了焊球40的布线基板20与布线基板10对准并堆叠到布线基板10上。在布线基板20以这种方式堆叠到布线基板10上后，布线基板20就通过回流焊步骤对焊球40进行回流焊来连接到布线基板10上。因此，给出图6所示的状态。
如图6所示，当焊球40经历回流焊步骤时，覆盖铜芯42外表面的焊料44熔化。这样，布线基板10的连接焊盘12A和布线基板20的连接焊盘22A能够通过焊料44和铜芯42电气互连，并且布线基板10、20之间的间隙能够由作为限动件的铜芯42保持。
在焊球40的回流焊完成后，得到的结构用焊剂漂洗，然后密封树脂50填充在布线基板10和布线基板20之间的间隙中(图7)。
如图7所示，作为在布线基板10、20之间的间隙中填充密封树脂50的方法，例如其中一种方法是用挡块90在一端覆盖布线基板10和布线基板20的侧面，然后在另一端从布线基板10和布线基板20的侧面把液态密封树脂50注入到布线基板10和布线基板20之间的间隙中。液态密封树脂50以毛细现象注入到布线基板10和布线基板20之间的间隙中。注入的密封树脂50受热凝固。
然后在密封树脂50受热凝固后，移开挡块。然后，作为第二电子元件的第二半导体元件60通过粘合剂等粘附到开口部分24中的密封树脂的表面上。然后提供在第二半导体元件60的上表面上的焊条62和提供在作为另一个布线基板的布线基板20的上表面上的丝焊连接焊盘22B分别通过焊线70如金丝等焊接。
最后，外部连接端子14如焊球等连接到布线基板10的下表面上的连接焊盘12A上。
通过上述内容可形成根据本发明的包含电子元件的基板。图8是示出包含电子元件的基板的横截面图，其中树脂填充在本制造方法中说明的布线基板之间的间隙中，并且安装在基板之间的两个半导体元件分别电气连接到各自对应的基板上。
在本制造方法的说明中，示出和说明了一个包含电子元件的基板100。但是在实际的制造方法中，多个包含电子元件的基板100、100、……、100通过使用大尺寸的布线基板10和大尺寸的布线基板20来同时由树脂密封，然后按照单个基板的外形对其进行切割来将其分成单独的块。
如上所述，在根据本实施例的包含电子元件的基板100中，两个半导体元件30、60放置在布线基板10和布线基板20之间，其中安装在上表面上的第二半导体元件60被容纳在布线基板20的开口部分24中。因此，不管第一半导体元件30的尺寸如何，第二半导体元件60的焊条62都能够安装在靠近布线基板20的连接焊盘22B的位置处。
按照这种构造，能够缩短用于对第二半导体元件60的焊条62和布线基板20的丝焊连接焊盘22B进行连接的焊线70的长度。结果，能够使包含电子元件的基板100小型化并且能够改善电气连接的可靠性。此外，能够以低成本地制造包含电子元件的基板100。
图9是示出从如图8所示的状态变成用树脂密封包含第二半导体元件60的布线基板20的整个表面的状态的横截面图。
(第二实施例)
图10是示出本发明的第二实施例中包含电子元件的基板的结构的横截面图。具体地，通过直接把第二半导体元件60安装到第一半导体元件30的下表面上而构成包含电子元件的基板100。
在本实施例中，在密封树脂50填充到布线基板10和布线基板20之间的间隙之前所应用的步骤中(即，在布线基板20通过焊球连接到布线基板10的状态中)，如果布线基板20具有足够的机械强度而能够经受第二半导体元件60和布线基板20之间的丝焊操作，那么在第二半导体元件60和布线基板20的丝焊连接焊盘22B通过丝焊连接之后，布线基板10、布线基板20和第二半导体元件60能够用密封树脂50密封在一起。
相反，如果布线基板10和布线基板20不具有足够的机械强度，可以使用这样的模式，即密封树脂50填充到布线基板10和布线基板20之间的间隙中然后再受热凝固，之后再应用丝焊，之后第二半导体元件60和第二半导体元件60与布线基板20之间的丝焊部分分别用密封树脂50密封。
如图10所示，当布线基板20上安装第二半导体元件60的区域用密封树脂50密封时，电路元件(未示出)如贴片电容器、贴片电阻器等能够安装在布线基板20的其它区域上。
连同上述的内容，将根据实施例详细说明本发明的包含电子元件的基板(半导体装置)100。但是，本申请的本发明不只限于上述的实施例。显然，在没有改变本发明的思想的范围内做出的各种改变和修改应该属于本申请中本发明的技术范围。
在上述的实施例中，通过采用半导体元件分别作为第一电子元件30和第二电子元件60进行了说明。但是第一电子元件30和第二电子元件60不仅限于半导体元件，还可以使用其它电子元件。
在本实施例中，分别说明第一电子元件30和第二电子元件60被单独安装的模式。在这种情况下，第一电子元件30代表两级垂直堆叠的电子元件中安装在下面的电子元件，而第二电子元件60代表安装在第一电子元件30上的电子元件。可以构成这样的包含电子元件的基板100，其中安装多个第一电子元件30或多个第二电子元件60，或多个二者的结合。
焊球40使用铜芯42作为型芯材料。但是可以使用由铜之外的其它物质形成型芯42的焊球40，只要这样的物质是一种具有比焊料熔点足够高的软化温度的导体。
而且，第一半导体元件30还可以通过丝焊代替倒装芯片焊接来安装在布线基板10上。
在上述的实施例中，说明了这样的制造方法，即使用液态树脂作为密封树脂50填充到布线基板10和布线基板20之间的间隙中，然后把液态密封树脂50注入到布线基板10和布线基板20之间的间隙中。可以使用其它填充模式来把液态密封树脂50填充到布线基板10和布线基板20之间的间隙中。
例如，在使用上模具和下模具分别从布线基板10的下表面和布线基板20的上表面夹住布线基板10和布线基板20时可以采用传递模塑，然后密封树脂50可以从传递模塑的浇口填充到布线基板10和布线基板20之间的间隙中。在这种情况下，可以在与开口部分24对应的位置处把镶入式模具部分提供给上模具，这样密封树脂50不会进入到开口部分24中。

Claims (6)

1.一种包含电子元件的基板，其包含：
一对布线基板；
多个电子元件，其以堆叠方式安装在一对布线基板之间，所述多个电子元件包含安装在一个布线基板上的第一电子元件和安装在第一电子元件上的第二电子元件；
焊球，其电气连接一对布线基板；以及
密封树脂，其密封一对布线基板之间的间隙，
其中，另一个布线基板具有一个用于容纳第二电子元件的开口部分，以及
其中，第二电子元件的安装使得第二电子元件被容纳在所述另一个布线基板的开口部分中并且通过丝焊电气连接到另一个布线基板上。
2.如权利要求1所述的包含电子元件的基板，其中第二电子元件的安装使得进行丝焊的表面位于所述另一个布线基板的厚度之内。
3.如权利要求1或2所述的包含电子元件的基板，其中第一电子元件用密封树脂覆盖并且第二电子元件安装在密封树脂的表面上。
4.如权利要求1或2所述的包含电子元件的基板，其中第二电子元件直接粘附到第一电子元件上。
5.如权利要求1或2所述的包含电子元件的基板，其中焊球是通过在金属制成的球形的型芯材料的外表面上涂敷焊料而形成的包含型芯的焊球。
6.如权利要求5所述的包含电子元件的基板，其中所述型芯由铜形成。
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