JP4520355B2 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
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- JP4520355B2 JP4520355B2 JP2005121484A JP2005121484A JP4520355B2 JP 4520355 B2 JP4520355 B2 JP 4520355B2 JP 2005121484 A JP2005121484 A JP 2005121484A JP 2005121484 A JP2005121484 A JP 2005121484A JP 4520355 B2 JP4520355 B2 JP 4520355B2
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- resin
- resin substrate
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- semiconductor chip
- semiconductor module
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Description
携帯電話やデジタルカメラ等の各種電子装置の小型化、高機能化の要請に伴い、電子部品、特に半導体チップを複数個積層し、それらを一体化してなる多段構成の半導体モジュールが提案されている。
−半導体モジュールの構成−
図1は、本発明の第1の実施形態に係る多段構成半導体モジュールの全体構成を示す概略斜視図であり、図2は、図1に示すII-II線に沿って本実施形態の多段構成半導体モジュールを切断したときの断面図である。また、図3(a)は、本実施形態の多段構成半導体モジュールに用いられる樹脂基板を上面側から見た場合の概略平面図であり、(b)は、(a)に示すIIIb-IIIb線に沿って本実施形態の樹脂基板を切断したときの断面図であり、(c)は、本実施形態の樹脂基板を下面側から見た場合の概略平面図である。そして、図4(a)、(b)は、本実施形態の多段構成半導体モジュールに用いられるシート部材のうち接着部材を示す平面図、およびIVb-IVb線で切断した場合の接着部材を示す断面図である。また、図4(c)、(d)は、本実施形態の接着部材の一例を示す平面図、およびIVd-IVd線で切断した場合の第1の接着部材を示す断面図である。図5(a)、(b)は、それぞれ本実施形態のシート部材のうち第2の樹脂基材を示す平面図、および(a)に示すVb-Vb線で切断した該第2の樹脂基材を示す断面図である。なお、これらの図においては、それぞれの厚みや長さ等は図面の作成上から実際の形状とは異なる。また、埋め込み導体や外部接続用の外部接続端子の個数や形状も実際の形状とは異なり、図示しやすい形状としている。なお、本明細書中で、各部材の「上面」および「下面」は、図1、2の上下方向を基準として呼ぶものとする。
上述した本実施形態の多段構成の半導体モジュール1の構造によれば、最下層に配置された第2の樹脂基板4を第1の樹脂基板3よりも厚く形成しているので、モジュールを多段構成としたときでも反りを非常に小さくできる。その上、本実施形態の半導体モジュール1では、第1の接着部材151および第2の接着部材152が半導体チップ2の側面および上面を覆っているため、開口部10内に配線材料の腐食を引き起こす水分、湿気、腐食性ガスなどが入りにくくなり、配線の断線による故障の発生を防ぐことができる。すなわち、本実施形態の半導体モジュール1は、従来の半導体モジュールに比べて耐湿性を高くすることができる。この結果、半田ボール17を使用したマザーボードへの実装において不良が発生しにくくなり、端子数が増加した場合でも、低コストで信頼性の高い半導体モジュールを実現することができる。
以下、本実施形態の半導体モジュールの製造方法について、図を用いて説明する。
以下、本発明の第2の実施形態に係る多段構成の半導体モジュール100について、図11から図14を用いて説明する。
図11は、本実施形態の多段構成の半導体モジュール100の全体構成を示す概略斜視図であり、図12は、図11に示すXII-XII線に沿って本実施形態の多段構成半導体モジュールを切断したときの断面図である。なお、これらの図においては、それぞれの厚みや長さ等は図面の作成上から実際の形状とは異なる。また、埋め込み導体や外部接続用の外部接続端子の個数や形状も実際の形状とは異なり、図示しやすい形状としている。これは、以後の図面でも同様である。なお、図11および図12において、第1の実施形態と同じ部材については図1および図2と同一の符号を付している。
以下、それぞれ半導体チップ2が実装された第1の樹脂基板3および第2の樹脂基板4と樹脂基板の間に配置されたシート部材5とを積層一体化する工程について、図13と図14を用いて説明する。
以下、本発明の第3の実施形態に係る多段構成の半導体モジュール110について、図15から図18を用いて説明する。
図15および図16に示すように、本実施形態の半導体モジュール110は、半導体チップ2が実装された第2の樹脂基板4と、半導体チップ2を収容する開口部10が形成されたシート部材5と半導体チップ2が実装された第1の樹脂基板3とが交互に複数回積層されてなり、第2の樹脂基板4上に配置された積層体とを備えている。樹脂基板の中で最下段に配置された第2の樹脂基板4は、第1の樹脂基板3よりも厚くなっている。また、第2の樹脂基板4の下面には、マザーボード(図示せず)に接続するための外部接続端子となる半田ボール17が設けられている。そして、第2の樹脂基板4および第1の樹脂基板3はシート部材5の一部である接着層15によって接着され、一体化されている。
以下、それぞれ半導体チップ2が実装された第1の樹脂基板3および第2の樹脂基板4と樹脂基板の間に配置されたシート部材5とを積層一体化する工程について、図17と図18を用いて説明する。
以下、本発明の第4の実施形態に係る多段構成の半導体モジュールについて、図19を用いて説明する。図19は、第4の実施形態に係る半導体モジュールの全体構成を示す断面図である。
本発明の第5の実施形態に係る多段構成の半導体モジュール130について、図20を用いて説明する。図20は、第5の実施形態に係る半導体モジュール130の構成を示す断面図である。
本発明の第6の実施形態に係る多段構成の半導体モジュール170について、図22を参照して説明する。図22は、第6の実施形態に係る半導体モジュールの構成を示す断面図である。
本発明の第7の実施形態に係る多段構成半導体モジュールについて、図23から図25を参照して説明する。
本発明の第8の実施形態に係る多段構成の半導体モジュールについて、図26を参照して説明する。図26は、本実施形態の半導体モジュールに用いられる第1の樹脂基板400の平面図である。
以下、本発明の第9の実施形態に係る多段構成の半導体モジュール160について、図27から図29を用いて説明する。
2、2a、2b、2c、2d、200、210 半導体チップ
3、3a、3b、3c、300、400 第1の樹脂基板
4 第2の樹脂基板
5、5a、5b、5c、5d シート部材
7、7a、7b、132 第1の埋め込み導体
8、80 第1の樹脂基材
9、9a、9b 第2の埋め込み導体
10 開口部
11、116 半導体素子接続端子
12、120 配線
13、131 接続用ランド
15 接着層
16 第2の樹脂基材
17 半田ボール
18 両面銅張基板
19 銅箔
20 感光性膜
21 マスキングフィルム
22 剛性板
23 樹脂基材
24 封止樹脂
28、280 電極バンプ
30 半導体ウェハー
31 1段目第1の樹脂基板
32 2段目第1の樹脂基板
33 3段目第1の樹脂基板
41 1段目低応力樹脂
42 2段目低応力樹脂
43 3段目低応力樹脂
51 1段目第2の樹脂基材
52 2段目第2の樹脂基材
53 3段目第2の樹脂基材
60 金属細線
62 固着剤
64 樹脂成形金型
66 封止樹脂
68 液状封止樹脂
70、90、250 貫通孔
131 接続用ランド
140 ダミー電極
151 第1の接着部材
152 第2の接着部材
205 耐熱性保護膜
240 液状樹脂
251 1段目第1の接着部材
252 2段目第1の接着部材
253 3段目第1の接着部材
310 突起部
320 低応力樹脂
330 補助突起
351 1段目第2の接着部材
352 2段目第2の接着部材
353 3段目第2の接着部材
Claims (5)
- 第1の樹脂基材と、前記第1の樹脂基材を貫通する第1の埋め込み導体とを有し、上面上に半導体チップが実装された樹脂基板と、前記半導体チップを収納する開口部が形成された第2の樹脂基材と、前記第2の樹脂基材を貫通し、前記第1の埋め込み導体と電気的に接続された第2の埋め込み導体とを有するシート部材とが交互に積層してなる半導体モジュールであって、
前記半導体チップの上面及び側面を覆う接着部材をさらに備えており、
前記樹脂基板および前記シート部材は複数あり、
前記第1の樹脂基材のうち最下段に配置された第1の樹脂基材は、他の前記第1の樹脂基材よりも厚いことを特徴とする半導体モジュール。 - 前記接着部材は前記シート部材の一部であり、且つ前記第2の樹脂基材の上面および下面のうち少なくとも一方に設けられており、平面的に見て前記第2の樹脂基材の前記開口部とオーバーラップする領域で前記半導体チップの上面および側面を覆っていることを特徴とする請求項1に記載の半導体モジュール。
- 前記接着部材は、前記第2の樹脂基材の上面および下面のうちいずれか一方の面にのみ設けられており、
前記シート部材は、前記第2の樹脂基材の他方の面のうち、平面的に見て前記開口部を囲む領域に設けられ、前記第1の樹脂基材と前記第2の樹脂基材とを接着する第1の接着層をさらに備えていることを特徴とする請求項1に記載の半導体モジュール。 - 前記接着部材は、平面的に見て前記開口部とオーバーラップする部分の厚みが他の部分の厚みより厚くなっていることを特徴とする請求項2に記載の半導体モジュール。
- 前記第1の樹脂基材は、熱硬化樹脂と、ガラス繊維よりなる織布および不織布、有機繊維であるアラミド繊維よりなる織布および不織布のうちいずれかを含む補強材とからなることを特徴とする請求項1〜4のうちいずれか1つに記載の半導体モジュール。
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JP2005121484A JP4520355B2 (ja) | 2005-04-19 | 2005-04-19 | 半導体モジュール |
KR20060031821A KR100791203B1 (ko) | 2005-04-19 | 2006-04-07 | 다단구성 반도체모듈 및 그 제조방법 |
CNB2006100736006A CN100499117C (zh) | 2005-04-19 | 2006-04-13 | 多层结构半导体模块及其制造方法 |
US11/405,478 US7586183B2 (en) | 2005-04-19 | 2006-04-18 | Multilevel semiconductor module and method for fabricating the same |
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CN100499117C (zh) | 2009-06-10 |
JP2006303114A (ja) | 2006-11-02 |
TW200638520A (en) | 2006-11-01 |
TWI271831B (en) | 2007-01-21 |
KR20060110761A (ko) | 2006-10-25 |
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US20060231939A1 (en) | 2006-10-19 |
KR100791203B1 (ko) | 2008-01-02 |
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