JP2010500750A5 - - Google Patents

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Publication number
JP2010500750A5
JP2010500750A5 JP2009523772A JP2009523772A JP2010500750A5 JP 2010500750 A5 JP2010500750 A5 JP 2010500750A5 JP 2009523772 A JP2009523772 A JP 2009523772A JP 2009523772 A JP2009523772 A JP 2009523772A JP 2010500750 A5 JP2010500750 A5 JP 2010500750A5
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JP
Japan
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circuit
polybutadiene
layer
circuit material
poly
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JP2009523772A
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Japanese (ja)
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JP5433416B2 (ja
JP2010500750A (ja
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Priority claimed from PCT/US2007/016987 external-priority patent/WO2008020984A2/en
Publication of JP2010500750A publication Critical patent/JP2010500750A/ja
Publication of JP2010500750A5 publication Critical patent/JP2010500750A5/ja
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Publication of JP5433416B2 publication Critical patent/JP5433416B2/ja
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JP2009523772A 2006-08-08 2007-07-27 回路材料、回路および多層回路積層板 Active JP5433416B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US82171006P 2006-08-08 2006-08-08
US60/821,710 2006-08-08
PCT/US2007/016987 WO2008020984A2 (en) 2006-08-08 2007-07-27 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom

Publications (3)

Publication Number Publication Date
JP2010500750A JP2010500750A (ja) 2010-01-07
JP2010500750A5 true JP2010500750A5 (enExample) 2010-09-16
JP5433416B2 JP5433416B2 (ja) 2014-03-05

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JP2009523772A Active JP5433416B2 (ja) 2006-08-08 2007-07-27 回路材料、回路および多層回路積層板

Country Status (6)

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US (2) US8431222B2 (enExample)
JP (1) JP5433416B2 (enExample)
CN (1) CN101522318B (enExample)
DE (1) DE112007001861B4 (enExample)
GB (1) GB2455917B (enExample)
WO (1) WO2008020984A2 (enExample)

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CN107541003B (zh) * 2016-06-24 2019-12-27 鹏鼎控股(深圳)股份有限公司 树脂组合物及应用该树脂组合物的胶片及电路板
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CN108164834A (zh) * 2016-12-02 2018-06-15 臻鼎科技股份有限公司 树脂组合物及应用该树脂组合物的胶片及电路板
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TWI731537B (zh) * 2019-12-31 2021-06-21 財團法人工業技術研究院 底漆組合物及積層板
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CN111253702B (zh) * 2020-03-30 2023-06-06 广东生益科技股份有限公司 一种树脂组合物及使用其的预浸料和电路材料
CN111726935A (zh) * 2020-07-17 2020-09-29 刘群 一种计算机用印刷电路板及其制造方法
CN113079645B (zh) * 2021-03-30 2023-01-24 上海大学 一种夹心铝基印制线路板压合方法
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JP7777591B2 (ja) * 2022-02-22 2025-11-28 エージーシー マルチ マテリアル アメリカ，インコーポレイテッド 硬化性組成物
CN118047913A (zh) 2022-11-16 2024-05-17 Agc多材料美国有限公司 可固化组合物
KR20250053459A (ko) * 2023-10-13 2025-04-22 주식회사 두산 열경화성 수지 조성물, 이를 포함하는 프리프레그, 금속박 적층체, 적층 시트 및 인쇄회로기판
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