JP2009530819A - 電子デバイス製造システムにおける圧力制御方法及び装置 - Google Patents

電子デバイス製造システムにおける圧力制御方法及び装置 Download PDF

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Publication number
JP2009530819A
JP2009530819A JP2009500452A JP2009500452A JP2009530819A JP 2009530819 A JP2009530819 A JP 2009530819A JP 2009500452 A JP2009500452 A JP 2009500452A JP 2009500452 A JP2009500452 A JP 2009500452A JP 2009530819 A JP2009530819 A JP 2009530819A
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Prior art keywords
electronic device
device manufacturing
pump
parameter
manufacturing system
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Japanese (ja)
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JP2009530819A5 (https=
Inventor
マーク ダブリュー カリー
セバスチャン ラオックス
ピーター ポーシュネブ
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2009530819A publication Critical patent/JP2009530819A/ja
Publication of JP2009530819A5 publication Critical patent/JP2009530819A5/ja
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • F04B49/06—Control using electricity
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • General Factory Administration (AREA)
  • Treating Waste Gases (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Measuring Fluid Pressure (AREA)
  • User Interface Of Digital Computer (AREA)
  • Control Of Fluid Pressure (AREA)
  • Incineration Of Waste (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Control Of Positive-Displacement Pumps (AREA)
JP2009500452A 2006-03-16 2007-03-14 電子デバイス製造システムにおける圧力制御方法及び装置 Pending JP2009530819A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US78337406P 2006-03-16 2006-03-16
US78337006P 2006-03-16 2006-03-16
US78333706P 2006-03-16 2006-03-16
US89060907P 2007-02-19 2007-02-19
PCT/US2007/006392 WO2007109038A2 (en) 2006-03-16 2007-03-14 Methods and apparatus for pressure control in electronic device manufacturing systems

Publications (2)

Publication Number Publication Date
JP2009530819A true JP2009530819A (ja) 2009-08-27
JP2009530819A5 JP2009530819A5 (https=) 2010-04-30

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Family Applications (4)

Application Number Title Priority Date Filing Date
JP2009500452A Pending JP2009530819A (ja) 2006-03-16 2007-03-14 電子デバイス製造システムにおける圧力制御方法及び装置
JP2009500470A Active JP6034546B2 (ja) 2006-03-16 2007-03-14 軽減システムの改善された操作方法及び装置
JP2009500471A Active JP6030278B2 (ja) 2006-03-16 2007-03-14 電子デバイス製造システムの操作を改善する方法及び装置
JP2014165252A Active JP6182116B2 (ja) 2006-03-16 2014-08-14 電子デバイス製造システムの操作を改善する方法及び装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2009500470A Active JP6034546B2 (ja) 2006-03-16 2007-03-14 軽減システムの改善された操作方法及び装置
JP2009500471A Active JP6030278B2 (ja) 2006-03-16 2007-03-14 電子デバイス製造システムの操作を改善する方法及び装置
JP2014165252A Active JP6182116B2 (ja) 2006-03-16 2014-08-14 電子デバイス製造システムの操作を改善する方法及び装置

Country Status (7)

Country Link
US (3) US7532952B2 (https=)
EP (3) EP1994457B1 (https=)
JP (4) JP2009530819A (https=)
KR (2) KR20080104372A (https=)
CN (1) CN101495925B (https=)
TW (3) TWI407997B (https=)
WO (3) WO2007109081A2 (https=)

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JP2020031135A (ja) * 2018-08-22 2020-02-27 株式会社ディスコ シリコンウェーハの加工方法及びプラズマエッチングシステム

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