KR20080104372A - 전자 장치 제조 시스템의 압력 제어 방법 및 장치 - Google Patents
전자 장치 제조 시스템의 압력 제어 방법 및 장치 Download PDFInfo
- Publication number
- KR20080104372A KR20080104372A KR1020087025069A KR20087025069A KR20080104372A KR 20080104372 A KR20080104372 A KR 20080104372A KR 1020087025069 A KR1020087025069 A KR 1020087025069A KR 20087025069 A KR20087025069 A KR 20087025069A KR 20080104372 A KR20080104372 A KR 20080104372A
- Authority
- KR
- South Korea
- Prior art keywords
- electronic device
- device manufacturing
- pump
- parameter
- manufacturing system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims abstract description 202
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 114
- 230000008569 process Effects 0.000 claims description 111
- 238000012423 maintenance Methods 0.000 claims description 24
- 230000001105 regulatory effect Effects 0.000 claims description 9
- 230000003466 anti-cipated effect Effects 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 description 18
- 239000012530 fluid Substances 0.000 description 17
- 238000012546 transfer Methods 0.000 description 14
- 230000000116 mitigating effect Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 6
- 230000003449 preventive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000013400 design of experiment Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000012707 chemical precursor Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012705 liquid precursor Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B49/00—Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
- F04B49/06—Control using electricity
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D16/00—Control of fluid pressure
- G05D16/20—Control of fluid pressure characterised by the use of electric means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Drying Of Semiconductors (AREA)
- General Factory Administration (AREA)
- Treating Waste Gases (AREA)
- Testing And Monitoring For Control Systems (AREA)
- Measuring Fluid Pressure (AREA)
- User Interface Of Digital Computer (AREA)
- Control Of Fluid Pressure (AREA)
- Incineration Of Waste (AREA)
- Sampling And Sample Adjustment (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Control Of Positive-Displacement Pumps (AREA)
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US78337406P | 2006-03-16 | 2006-03-16 | |
| US78337006P | 2006-03-16 | 2006-03-16 | |
| US78333706P | 2006-03-16 | 2006-03-16 | |
| US60/783,370 | 2006-03-16 | ||
| US60/783,337 | 2006-03-16 | ||
| US60/783,374 | 2006-03-16 | ||
| US89060907P | 2007-02-19 | 2007-02-19 | |
| US60/890,609 | 2007-02-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080104372A true KR20080104372A (ko) | 2008-12-02 |
Family
ID=38522928
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087025069A Ceased KR20080104372A (ko) | 2006-03-16 | 2007-03-14 | 전자 장치 제조 시스템의 압력 제어 방법 및 장치 |
| KR1020087025085A Expired - Fee Related KR101126413B1 (ko) | 2006-03-16 | 2007-03-14 | 전자 디바이스 제조 시스템의 동작을 향상시키는 방법 및 장치 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087025085A Expired - Fee Related KR101126413B1 (ko) | 2006-03-16 | 2007-03-14 | 전자 디바이스 제조 시스템의 동작을 향상시키는 방법 및 장치 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US7532952B2 (https=) |
| EP (3) | EP1994457B1 (https=) |
| JP (4) | JP2009530819A (https=) |
| KR (2) | KR20080104372A (https=) |
| CN (1) | CN101495925B (https=) |
| TW (3) | TWI407997B (https=) |
| WO (3) | WO2007109081A2 (https=) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080104372A (ko) | 2006-03-16 | 2008-12-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 전자 장치 제조 시스템의 압력 제어 방법 및 장치 |
| US20090175771A1 (en) * | 2006-03-16 | 2009-07-09 | Applied Materials, Inc. | Abatement of effluent gas |
| US20080216901A1 (en) * | 2007-03-06 | 2008-09-11 | Mks Instruments, Inc. | Pressure control for vacuum processing system |
| WO2008147522A1 (en) * | 2007-05-25 | 2008-12-04 | Applied Materials, Inc. | Methods and apparatus for assembling and operating electronic device manufacturing systems |
| EP2150360A4 (en) * | 2007-05-25 | 2013-01-23 | Applied Materials Inc | METHOD AND DEVICE FOR EFFICIENT OPERATION OF A REDUCTION SYSTEM |
| US20090018688A1 (en) * | 2007-06-15 | 2009-01-15 | Applied Materials, Inc. | Methods and systems for designing and validating operation of abatement systems |
| US8003067B2 (en) * | 2007-09-20 | 2011-08-23 | Applied Materials, Inc. | Apparatus and methods for ambient air abatement of electronic manufacturing effluent |
| US20090148339A1 (en) * | 2007-09-20 | 2009-06-11 | Applied Materials, Inc. | Apparatus and methods for reducing restrictions to air flow in an abatement system |
| WO2009055750A1 (en) | 2007-10-26 | 2009-04-30 | Applied Materials, Inc. | Methods and apparatus for smart abatement using an improved fuel circuit |
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| US8634949B2 (en) * | 2010-05-20 | 2014-01-21 | International Business Machines Corporation | Manufacturing management using tool operating data |
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| WO2012035547A2 (en) * | 2010-09-13 | 2012-03-22 | Manufacturing System Insights (India) Pvt. Ltd. | Apparatus that analyses attributes of diverse machine types and technically upgrades performance by applying operational intelligence and the process therefor |
| US9080576B2 (en) * | 2011-02-13 | 2015-07-14 | Applied Materials, Inc. | Method and apparatus for controlling a processing system |
| US10649424B2 (en) | 2013-03-04 | 2020-05-12 | Fisher-Rosemount Systems, Inc. | Distributed industrial performance monitoring and analytics |
| US10386827B2 (en) | 2013-03-04 | 2019-08-20 | Fisher-Rosemount Systems, Inc. | Distributed industrial performance monitoring and analytics platform |
| US10678225B2 (en) * | 2013-03-04 | 2020-06-09 | Fisher-Rosemount Systems, Inc. | Data analytic services for distributed industrial performance monitoring |
| US9558220B2 (en) | 2013-03-04 | 2017-01-31 | Fisher-Rosemount Systems, Inc. | Big data in process control systems |
| US20150187562A1 (en) * | 2013-12-27 | 2015-07-02 | Taiwan Semiconductor Manufacturing Company Ltd. | Abatement water flow control system and operation method thereof |
| CN103791325B (zh) | 2014-01-26 | 2016-03-30 | 京东方科技集团股份有限公司 | 一种背光源和透明显示器 |
| US20160042916A1 (en) * | 2014-08-06 | 2016-02-11 | Applied Materials, Inc. | Post-chamber abatement using upstream plasma sources |
| US20160054731A1 (en) * | 2014-08-19 | 2016-02-25 | Applied Materials, Inc. | Systems, apparatus, and methods for processing recipe protection and security |
| US20160149733A1 (en) * | 2014-11-26 | 2016-05-26 | Applied Materials, Inc. | Control architecture for devices in an rf environment |
| US9872341B2 (en) | 2014-11-26 | 2018-01-16 | Applied Materials, Inc. | Consolidated filter arrangement for devices in an RF environment |
| JP2020031135A (ja) * | 2018-08-22 | 2020-02-27 | 株式会社ディスコ | シリコンウェーハの加工方法及びプラズマエッチングシステム |
| EP3798878B1 (de) * | 2019-09-24 | 2022-11-09 | Siemens Aktiengesellschaft | Anordnung und verfahren zur sicheren ausführung eines automatisierungsprogramms in einem cloud-computing-umfeld |
| KR102491761B1 (ko) | 2022-03-22 | 2023-01-26 | 삼성전자주식회사 | 반도체 공정 설비 제조 방법 |
| US12560951B2 (en) | 2022-09-01 | 2026-02-24 | Applied Materials, Inc. | Smart manufacturing solutions for wastewater treatment |
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