JP2009506216A - 加工部品の表面からイオン性の汚染物質を除去するための水溶液と方法 - Google Patents
加工部品の表面からイオン性の汚染物質を除去するための水溶液と方法 Download PDFInfo
- Publication number
- JP2009506216A JP2009506216A JP2008528389A JP2008528389A JP2009506216A JP 2009506216 A JP2009506216 A JP 2009506216A JP 2008528389 A JP2008528389 A JP 2008528389A JP 2008528389 A JP2008528389 A JP 2008528389A JP 2009506216 A JP2009506216 A JP 2009506216A
- Authority
- JP
- Japan
- Prior art keywords
- aqueous solution
- compound
- solution according
- ionic contaminants
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000356 contaminant Substances 0.000 title claims description 49
- 239000007864 aqueous solution Substances 0.000 title claims description 45
- 238000000034 method Methods 0.000 title claims description 37
- 229910000679 solder Inorganic materials 0.000 claims abstract description 24
- -1 ethanolamine compound Chemical class 0.000 claims abstract description 17
- HZAXFHJVJLSVMW-UHFFFAOYSA-N monoethanolamine hydrochloride Natural products NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims abstract description 12
- 150000003839 salts Chemical class 0.000 claims abstract description 11
- ZRALSGWEFCBTJO-UHFFFAOYSA-N anhydrous guanidine Natural products NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 8
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 claims abstract description 7
- 230000001476 alcoholic effect Effects 0.000 claims abstract description 7
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 46
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 239000011135 tin Substances 0.000 claims description 10
- 229910052718 tin Inorganic materials 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 239000000969 carrier Substances 0.000 claims description 9
- 238000000151 deposition Methods 0.000 claims description 9
- 239000008367 deionised water Substances 0.000 claims description 8
- 229910021641 deionized water Inorganic materials 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- STIAPHVBRDNOAJ-UHFFFAOYSA-N carbamimidoylazanium;carbonate Chemical compound NC(N)=N.NC(N)=N.OC(O)=O STIAPHVBRDNOAJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000002848 electrochemical method Methods 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- CJFCGSLFEZPBNJ-UHFFFAOYSA-N carbamimidoylazanium;phosphate Chemical compound NC([NH3+])=N.NC([NH3+])=N.NC([NH3+])=N.[O-]P([O-])([O-])=O CJFCGSLFEZPBNJ-UHFFFAOYSA-N 0.000 claims description 2
- 150000002169 ethanolamines Chemical class 0.000 claims description 2
- UYAKTBUPMOOXNW-UHFFFAOYSA-N guanidine;sulfuric acid Chemical compound NC(N)=N.NC(N)=N.OS(O)(=O)=O UYAKTBUPMOOXNW-UHFFFAOYSA-N 0.000 claims description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims 2
- 238000005406 washing Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 20
- 238000004140 cleaning Methods 0.000 abstract description 17
- 238000011109 contamination Methods 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 239000003599 detergent Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000003153 chemical reaction reagent Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000011780 sodium chloride Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 241000220317 Rosa Species 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000011088 calibration curve Methods 0.000 description 2
- 150000004697 chelate complex Chemical class 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 150000002191 fatty alcohols Chemical class 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229940098779 methanesulfonic acid Drugs 0.000 description 2
- RYKLZUPYJFFNRR-UHFFFAOYSA-N 3-hydroxypiperidin-2-one Chemical compound OC1CCCNC1=O RYKLZUPYJFFNRR-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- JALQQBGHJJURDQ-UHFFFAOYSA-L bis(methylsulfonyloxy)tin Chemical compound [Sn+2].CS([O-])(=O)=O.CS([O-])(=O)=O JALQQBGHJJURDQ-UHFFFAOYSA-L 0.000 description 1
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- YPTUAQWMBNZZRN-UHFFFAOYSA-N dimethylaminoboron Chemical compound [B]N(C)C YPTUAQWMBNZZRN-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 238000010606 normalization Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000010909 process residue Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 150000003585 thioureas Chemical class 0.000 description 1
- OBBXFSIWZVFYJR-UHFFFAOYSA-L tin(2+);sulfate Chemical compound [Sn+2].[O-]S([O-])(=O)=O OBBXFSIWZVFYJR-UHFFFAOYSA-L 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3272—Urea, guanidine or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
- G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
- H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
Description
a)エタノールアミン化合物、及びその塩から構成される群から選択された、少なくとも一つの第一化合物、及び、
b)アルコール性溶媒から構成される群から選択された、少なくとも一つの第二化合物。
1.5g/lのグアニジニウムカルボナート(純度98%)
14g/lのモノエタノールアミン(脱イオン水中、850ml/l)
1g/lのイソプロパノール
約pH10.5
Claims (20)
- 以下のa)、b)即ち、
a)エタノールアミン化合物及びその塩から構成される群から選択された、少なくとも一つの第一化合物、及び、
b)アルコール性溶媒から構成される群から選択された、少なくとも一つの第二化合物、
を含む、半田レジストマスク及び表面トップ層を有する加工部品の表面からイオン性汚染物を除去するための水溶液。 - 水溶液は、グアニジン化合物及びその塩から構成される群から選択された、少なくとも一つの第三化合物を更に含むことを特徴とする、請求項1に記載の水溶液。
- 少なくとも一つのエタノールアミン化合物が、モノエタノールアミンであることを特徴とする、請求項1又は2に記載の水溶液。
- 少なくとも一つのアルコール性溶媒が、2-プロパノール及びn-プロパノールから構成される群から選択されることを特徴とする、請求項1〜3のいずれか一項に記載の水溶液。
- 少なくとも一つのグアニジン化合物の塩が、グアニジニウムカルボナート、グアニジニウムホスフェート、又はグアニジニウムスルフェートから構成される群から選択されることを特徴とする、請求項1〜4のいずれか一項に記載の水溶液。
- 少なくとも一つの第一化合物の濃度が、約5〜約25g/lの範囲にあることを特徴とする、請求項1〜5のいずれか一項に記載の水溶液。
- 少なくとも一つのアルコール性溶媒の濃度が、約0.5〜約5g/lの範囲にあることを特徴とする、請求項1〜6のいずれか一項に記載の水溶液。
- 少なくとも一つの第三化合物の濃度が、約0.5〜約5g/lの範囲にあることを特徴とする、請求項1〜7のいずれか一項に記載の水溶液。
- 水溶液のpHが約7よりも高いことを特徴とする、請求項1〜8のいずれか一項に記載の水溶液。
- 水溶液のpHが約11よりも高いことを特徴とする、請求項1〜9のいずれか一項に記載の水溶液。
- 垂直な、及び/または、水平なラインでの電気回路キャリヤの製造における、請求項1〜10のいずれか一項に係る水溶液の使用。
- 電気回路キャリヤ上の電気接触の製造における、請求項1〜10のいずれか一項に係る水溶液の使用。
- 請求項1〜10のいずれか一項に係るイオン性汚染物を除去するための水溶液を用いて加工部品を処理することを含む、半田レジストマスク及び表面トップ層を有する加工部品の表面からイオン性汚染物を除去する方法。
- イオン性汚染物を除去するための水溶液が、約50℃〜約70℃の範囲の温度を有することを特徴とする、請求項13に記載の方法。
- 加工部品が、約0.5分間〜約2分間の継続する時間、イオン性汚染物を除去するための水溶液で処理されることを特徴とする、請求項13又は14に記載の方法。
- 半田レジストマスクが、Taiyo PSR 4000 MH, Taiyo PSR 4000 MP, Taiyo 4000 AUS 5 又はTaiyo 4000 GHP 3タイプから成ることを特徴とする、請求項13〜15のいずれか一項に記載の方法。
- 表面トップ層が、ビスマス、スズ、金、銀、パラジウム、ニッケル及びその合金から構成される群から選択された、一つの金属で作られることを特徴とする、請求項13〜16のいずれか一項に記載の方法。
- 表面トップ層が、無電解の方法、化学的方法、及び電気化学的方法から構成される群から選択された、一つの析出方法を用いて加工部品表面上に析出されることを特徴とする、請求項17に記載の方法。
- 表面トップ層が、半田付け可能な及び結合可能な表面トップ層の少なくとも一つであることを特徴とする、請求項13〜18のいずれか一項に記載の方法。
- 上記方法は、水溶液による処理をされる前、及び/または後に、脱イオン水で少なくとも一回加工部品を洗浄することを更に含むことを特徴とする、請求項13〜19のいずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005041533A DE102005041533B3 (de) | 2005-08-31 | 2005-08-31 | Lösung und Verfahren zum Entfernen von ionischen Verunreinigungen von einem Werkstück |
DE102005041533.4 | 2005-08-31 | ||
PCT/EP2006/008315 WO2007025675A1 (en) | 2005-08-31 | 2006-08-21 | Aqueous solution and method for removing ionic contaminants from the surface of a workpiece |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009506216A true JP2009506216A (ja) | 2009-02-12 |
JP4852610B2 JP4852610B2 (ja) | 2012-01-11 |
Family
ID=37136928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008528389A Active JP4852610B2 (ja) | 2005-08-31 | 2006-08-21 | 加工部品の表面からイオン性の汚染物質を除去するための水溶液と方法 |
Country Status (11)
Country | Link |
---|---|
US (1) | US20080200360A1 (ja) |
EP (1) | EP1917340B1 (ja) |
JP (1) | JP4852610B2 (ja) |
KR (1) | KR101264460B1 (ja) |
CN (1) | CN101253258B (ja) |
AT (1) | ATE417916T1 (ja) |
DE (2) | DE102005041533B3 (ja) |
ES (1) | ES2317578T3 (ja) |
MY (1) | MY145146A (ja) |
TW (1) | TWI378997B (ja) |
WO (1) | WO2007025675A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5977727B2 (ja) * | 2013-11-13 | 2016-08-24 | 東京エレクトロン株式会社 | 基板洗浄方法、基板洗浄システムおよび記憶媒体 |
MY192564A (en) | 2017-07-04 | 2022-08-29 | Atotech Deutschland Gmbh | Cleaning solution for cleaning metal surfaces |
US11304304B2 (en) | 2019-11-11 | 2022-04-12 | International Business Machines Corporation | Ionic contaminant cleaning |
EP4276219A1 (en) | 2022-05-09 | 2023-11-15 | Atotech Deutschland GmbH & Co. KG | Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards (pcbs) |
CN115287130A (zh) * | 2022-07-12 | 2022-11-04 | 鹤山市世安电子科技有限公司 | 一种pcb离子污染清洗剂 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6369897A (ja) * | 1986-09-11 | 1988-03-29 | 第一工業製薬株式会社 | プリント基板洗浄用洗浄剤組成物 |
JPH08157887A (ja) * | 1994-12-06 | 1996-06-18 | Kao Corp | 水系洗浄剤組成物 |
JPH11502884A (ja) * | 1995-03-24 | 1999-03-09 | ザ・クロロックス・カンパニー | 残分の減少した硬表面クリーナー |
JP2001518552A (ja) * | 1997-09-29 | 2001-10-16 | キーゼン コーポレイション | 製造中で使用した重合物及び樹脂のクリーニング組成物及びクリーニング方法 |
JP2002060798A (ja) * | 2000-08-17 | 2002-02-26 | Asahi Denka Kogyo Kk | 溶融型固形洗浄剤組成物およびその製造方法 |
JP2005055859A (ja) * | 2003-08-06 | 2005-03-03 | Mallinckrodt Baker Inc | マイクロエレクトロニクス用のストリッピングおよび洗浄組成物 |
JP2005183453A (ja) * | 2003-12-16 | 2005-07-07 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法及び半導体装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2880126A (en) * | 1956-07-30 | 1959-03-31 | Jordan | Fluxes for soldering and metal coating |
US3214279A (en) * | 1961-06-09 | 1965-10-26 | M & T Chemicals Inc | Novel coating composition |
US3673099A (en) * | 1970-10-19 | 1972-06-27 | Bell Telephone Labor Inc | Process and composition for stripping cured resins from substrates |
US3886099A (en) * | 1972-03-13 | 1975-05-27 | Griffin Bros Inc | Water soluble flux remover |
US4934391A (en) * | 1988-02-08 | 1990-06-19 | 501 Petroleum Fermentations N.V. | Dibasic esters for cleaning electronic circuits |
JPH0783168B2 (ja) * | 1988-04-13 | 1995-09-06 | 株式会社日立製作所 | プリント板の製造方法 |
DE3836369C2 (de) * | 1988-10-26 | 1997-10-02 | Basf Lacke & Farben | Verfahren zur Reinigung von Rohrleitungssystemen |
US6121217A (en) * | 1990-11-05 | 2000-09-19 | Ekc Technology, Inc. | Alkanolamine semiconductor process residue removal composition and process |
DE4124246A1 (de) * | 1991-07-22 | 1993-01-28 | Henkel Kgaa | Reinigungsmittel fuer elektronische und elektrische baugruppen |
DE19518990C2 (de) * | 1995-05-29 | 2000-11-02 | Staedtler Fa J S | Mittel zum Reinigen der Köpfe und Düsen von Tintenstrahldruckern |
DE19945221A1 (de) * | 1998-10-14 | 2000-04-20 | Merck Patent Gmbh | Walzenwaschmittel |
US6210746B1 (en) * | 1999-05-28 | 2001-04-03 | Unimicron Taiwan Corp. | Method of fabricating a solder resist mask |
GB9914192D0 (en) * | 1999-06-17 | 1999-08-18 | Alpha Fry Ltd | Soldering flux |
JP3420143B2 (ja) * | 1999-12-02 | 2003-06-23 | 花王株式会社 | 毛髪処理剤 |
US6566315B2 (en) * | 2000-12-08 | 2003-05-20 | Advanced Technology Materials, Inc. | Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures |
US7098181B2 (en) * | 2002-05-22 | 2006-08-29 | Kao Corporation | Liquid detergent composition |
US20040255974A1 (en) * | 2003-06-23 | 2004-12-23 | Burress Jeffrey P. | Equipment cleaner |
CN1875325B (zh) * | 2003-10-29 | 2011-01-26 | 马林克罗特贝克公司 | 含有金属卤化物腐蚀抑制剂的碱性后等离子体蚀刻/灰化残余物去除剂和光致抗蚀剂剥离组合物 |
US7700533B2 (en) * | 2005-06-23 | 2010-04-20 | Air Products And Chemicals, Inc. | Composition for removal of residue comprising cationic salts and methods using same |
-
2005
- 2005-08-31 DE DE102005041533A patent/DE102005041533B3/de not_active Expired - Fee Related
-
2006
- 2006-08-21 WO PCT/EP2006/008315 patent/WO2007025675A1/en active Application Filing
- 2006-08-21 US US11/995,138 patent/US20080200360A1/en not_active Abandoned
- 2006-08-21 DE DE602006004361T patent/DE602006004361D1/de active Active
- 2006-08-21 ES ES06791636T patent/ES2317578T3/es active Active
- 2006-08-21 MY MYPI20072259A patent/MY145146A/en unknown
- 2006-08-21 AT AT06791636T patent/ATE417916T1/de active
- 2006-08-21 EP EP06791636A patent/EP1917340B1/en active Active
- 2006-08-21 JP JP2008528389A patent/JP4852610B2/ja active Active
- 2006-08-21 CN CN2006800319294A patent/CN101253258B/zh active Active
- 2006-08-31 TW TW095132206A patent/TWI378997B/zh active
-
2008
- 2008-01-25 KR KR1020087002126A patent/KR101264460B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6369897A (ja) * | 1986-09-11 | 1988-03-29 | 第一工業製薬株式会社 | プリント基板洗浄用洗浄剤組成物 |
JPH08157887A (ja) * | 1994-12-06 | 1996-06-18 | Kao Corp | 水系洗浄剤組成物 |
JPH11502884A (ja) * | 1995-03-24 | 1999-03-09 | ザ・クロロックス・カンパニー | 残分の減少した硬表面クリーナー |
JP2001518552A (ja) * | 1997-09-29 | 2001-10-16 | キーゼン コーポレイション | 製造中で使用した重合物及び樹脂のクリーニング組成物及びクリーニング方法 |
JP2002060798A (ja) * | 2000-08-17 | 2002-02-26 | Asahi Denka Kogyo Kk | 溶融型固形洗浄剤組成物およびその製造方法 |
JP2005055859A (ja) * | 2003-08-06 | 2005-03-03 | Mallinckrodt Baker Inc | マイクロエレクトロニクス用のストリッピングおよび洗浄組成物 |
JP2005183453A (ja) * | 2003-12-16 | 2005-07-07 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法及び半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2007025675A8 (en) | 2008-01-24 |
DE102005041533B3 (de) | 2007-02-08 |
CN101253258B (zh) | 2011-04-13 |
TWI378997B (en) | 2012-12-11 |
WO2007025675A1 (en) | 2007-03-08 |
ATE417916T1 (de) | 2009-01-15 |
CN101253258A (zh) | 2008-08-27 |
EP1917340B1 (en) | 2008-12-17 |
TW200720427A (en) | 2007-06-01 |
KR20080039386A (ko) | 2008-05-07 |
ES2317578T3 (es) | 2009-04-16 |
MY145146A (en) | 2011-12-30 |
US20080200360A1 (en) | 2008-08-21 |
KR101264460B1 (ko) | 2013-05-14 |
DE602006004361D1 (de) | 2009-01-29 |
EP1917340A1 (en) | 2008-05-07 |
JP4852610B2 (ja) | 2012-01-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100831182B1 (ko) | 포스트 화학적-기계적 플래너화 (cmp) 세정 조성물 | |
KR102257405B1 (ko) | 수지 마스크층용 세정제 조성물 및 회로 기판의 제조 방법 | |
KR101059707B1 (ko) | 구리 표면 에칭용 용액 및 구리 표면 상에 금속을침착시키는 방법 | |
JP4852610B2 (ja) | 加工部品の表面からイオン性の汚染物質を除去するための水溶液と方法 | |
JPH05263258A (ja) | 置換すずめっき用錯化剤 | |
KR100927068B1 (ko) | 에칭액과 보급액 및 이것을 사용한 도체 패턴의 형성 방법 | |
TW200949016A (en) | Etching solution, etching pre-treating solution and etching process for copper or copper alloy | |
KR20110106880A (ko) | 화학적 기계적 연마 후 세정을 위한 조성물 | |
KR101616731B1 (ko) | 금속 표면 처리 수용액 및 금속 표면상의 휘스커 억제방법 | |
CN101840900A (zh) | 半导体封装的金属部分上的金属可焊性保持涂层 | |
KR100761608B1 (ko) | 팔라듐 제거액 및 팔라듐 제거방법 | |
CN113005437B (zh) | 一种用于印制线路板的化学沉金液 | |
JP3540887B2 (ja) | 選択的ニッケル剥離液およびこれを用いる剥離方法 | |
KR20010042625A (ko) | 주석 또는 주석 합금층으로 구리 또는 구리 합금의 표면을피복하는 방법 | |
KR20000029749A (ko) | 반도체기판용세정수용액 | |
KR20230104628A (ko) | 에칭제 및 회로 기판의 제조 방법 | |
JP3854523B2 (ja) | レジスト剥離剤 | |
EP4276219A1 (en) | Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards (pcbs) | |
KR20230061402A (ko) | 기판의 세정 방법 | |
US6133213A (en) | Solution for removing copper salts from a copper surface comprising an alcohol and an ammonium salt | |
CN113766760A (zh) | 印刷电路板化学镀银方法 | |
KR20230109148A (ko) | 수지 마스크 박리용 세정제 조성물 | |
JP2006002217A (ja) | 無電解めっきの前処理方法及び無電解めっき方法 | |
US6165278A (en) | Removing thermal grease from electronic cards | |
KR20210075151A (ko) | 표면 처리액 및 니켈 함유 재료의 표면 처리 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090414 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110719 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110802 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110831 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110927 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111024 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4852610 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141028 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |