DE602006004361D1 - Verfahren zur entfernung ionischer verunreinigunge - Google Patents

Verfahren zur entfernung ionischer verunreinigunge

Info

Publication number
DE602006004361D1
DE602006004361D1 DE602006004361T DE602006004361T DE602006004361D1 DE 602006004361 D1 DE602006004361 D1 DE 602006004361D1 DE 602006004361 T DE602006004361 T DE 602006004361T DE 602006004361 T DE602006004361 T DE 602006004361T DE 602006004361 D1 DE602006004361 D1 DE 602006004361D1
Authority
DE
Germany
Prior art keywords
workpiece
salt
removing ionic
ionic contamination
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006004361T
Other languages
English (en)
Inventor
Thomas Beck
Hans-Juergen Schreier
Gerhard Steinberger
Irene Kubitza
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of DE602006004361D1 publication Critical patent/DE602006004361D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3272—Urea, guanidine or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5013—Organic solvents containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Detergent Compositions (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
DE602006004361T 2005-08-31 2006-08-21 Verfahren zur entfernung ionischer verunreinigunge Active DE602006004361D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005041533A DE102005041533B3 (de) 2005-08-31 2005-08-31 Lösung und Verfahren zum Entfernen von ionischen Verunreinigungen von einem Werkstück
PCT/EP2006/008315 WO2007025675A1 (en) 2005-08-31 2006-08-21 Aqueous solution and method for removing ionic contaminants from the surface of a workpiece

Publications (1)

Publication Number Publication Date
DE602006004361D1 true DE602006004361D1 (de) 2009-01-29

Family

ID=37136928

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102005041533A Expired - Fee Related DE102005041533B3 (de) 2005-08-31 2005-08-31 Lösung und Verfahren zum Entfernen von ionischen Verunreinigungen von einem Werkstück
DE602006004361T Active DE602006004361D1 (de) 2005-08-31 2006-08-21 Verfahren zur entfernung ionischer verunreinigunge

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102005041533A Expired - Fee Related DE102005041533B3 (de) 2005-08-31 2005-08-31 Lösung und Verfahren zum Entfernen von ionischen Verunreinigungen von einem Werkstück

Country Status (11)

Country Link
US (1) US20080200360A1 (de)
EP (1) EP1917340B1 (de)
JP (1) JP4852610B2 (de)
KR (1) KR101264460B1 (de)
CN (1) CN101253258B (de)
AT (1) ATE417916T1 (de)
DE (2) DE102005041533B3 (de)
ES (1) ES2317578T3 (de)
MY (1) MY145146A (de)
TW (1) TWI378997B (de)
WO (1) WO2007025675A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5977727B2 (ja) * 2013-11-13 2016-08-24 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
US11473036B2 (en) 2017-07-04 2022-10-18 Atotech Deutschland Gmbh Cleaning solution for cleaning metal surfaces
US11304304B2 (en) 2019-11-11 2022-04-12 International Business Machines Corporation Ionic contaminant cleaning
EP4276219A1 (de) 2022-05-09 2023-11-15 Atotech Deutschland GmbH & Co. KG Verfahren zur nasschemischen herstellung einer stabilen zinnoxidschicht für leiterplatten (pcbs)
CN115287130A (zh) * 2022-07-12 2022-11-04 鹤山市世安电子科技有限公司 一种pcb离子污染清洗剂

Family Cites Families (26)

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US2880126A (en) * 1956-07-30 1959-03-31 Jordan Fluxes for soldering and metal coating
US3214279A (en) * 1961-06-09 1965-10-26 M & T Chemicals Inc Novel coating composition
US3673099A (en) * 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US3886099A (en) * 1972-03-13 1975-05-27 Griffin Bros Inc Water soluble flux remover
JPS6369897A (ja) * 1986-09-11 1988-03-29 第一工業製薬株式会社 プリント基板洗浄用洗浄剤組成物
US4934391A (en) * 1988-02-08 1990-06-19 501 Petroleum Fermentations N.V. Dibasic esters for cleaning electronic circuits
JPH0783168B2 (ja) * 1988-04-13 1995-09-06 株式会社日立製作所 プリント板の製造方法
DE3836369C2 (de) * 1988-10-26 1997-10-02 Basf Lacke & Farben Verfahren zur Reinigung von Rohrleitungssystemen
US6121217A (en) * 1990-11-05 2000-09-19 Ekc Technology, Inc. Alkanolamine semiconductor process residue removal composition and process
DE4124246A1 (de) * 1991-07-22 1993-01-28 Henkel Kgaa Reinigungsmittel fuer elektronische und elektrische baugruppen
US5585342A (en) * 1995-03-24 1996-12-17 The Clorox Company Reduced residue hard surface cleaner
JP3255392B2 (ja) * 1994-12-06 2002-02-12 花王株式会社 水系洗浄剤組成物
DE19518990C2 (de) * 1995-05-29 2000-11-02 Staedtler Fa J S Mittel zum Reinigen der Köpfe und Düsen von Tintenstrahldruckern
US6060439A (en) * 1997-09-29 2000-05-09 Kyzen Corporation Cleaning compositions and methods for cleaning resin and polymeric materials used in manufacture
DE19945221A1 (de) * 1998-10-14 2000-04-20 Merck Patent Gmbh Walzenwaschmittel
US6210746B1 (en) * 1999-05-28 2001-04-03 Unimicron Taiwan Corp. Method of fabricating a solder resist mask
GB9914192D0 (en) * 1999-06-17 1999-08-18 Alpha Fry Ltd Soldering flux
JP3420143B2 (ja) * 1999-12-02 2003-06-23 花王株式会社 毛髪処理剤
JP2002060798A (ja) * 2000-08-17 2002-02-26 Asahi Denka Kogyo Kk 溶融型固形洗浄剤組成物およびその製造方法
US6566315B2 (en) * 2000-12-08 2003-05-20 Advanced Technology Materials, Inc. Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures
US7098181B2 (en) * 2002-05-22 2006-08-29 Kao Corporation Liquid detergent composition
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CN1875325B (zh) * 2003-10-29 2011-01-26 马林克罗特贝克公司 含有金属卤化物腐蚀抑制剂的碱性后等离子体蚀刻/灰化残余物去除剂和光致抗蚀剂剥离组合物
JP4145779B2 (ja) * 2003-12-16 2008-09-03 住友ベークライト株式会社 半導体装置の製造方法及び半導体装置
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Also Published As

Publication number Publication date
JP4852610B2 (ja) 2012-01-11
ES2317578T3 (es) 2009-04-16
TWI378997B (en) 2012-12-11
TW200720427A (en) 2007-06-01
JP2009506216A (ja) 2009-02-12
US20080200360A1 (en) 2008-08-21
WO2007025675A8 (en) 2008-01-24
EP1917340A1 (de) 2008-05-07
WO2007025675A1 (en) 2007-03-08
KR101264460B1 (ko) 2013-05-14
KR20080039386A (ko) 2008-05-07
CN101253258B (zh) 2011-04-13
EP1917340B1 (de) 2008-12-17
MY145146A (en) 2011-12-30
CN101253258A (zh) 2008-08-27
ATE417916T1 (de) 2009-01-15
DE102005041533B3 (de) 2007-02-08

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