CN115287130A - 一种pcb离子污染清洗剂 - Google Patents
一种pcb离子污染清洗剂 Download PDFInfo
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- CN115287130A CN115287130A CN202210813719.1A CN202210813719A CN115287130A CN 115287130 A CN115287130 A CN 115287130A CN 202210813719 A CN202210813719 A CN 202210813719A CN 115287130 A CN115287130 A CN 115287130A
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- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 21
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical group N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
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- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
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- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
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- 229940006460 bromide ion Drugs 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
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- GXHMMDRXHUIUMN-UHFFFAOYSA-N methanesulfonic acid Chemical compound CS(O)(=O)=O.CS(O)(=O)=O GXHMMDRXHUIUMN-UHFFFAOYSA-N 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
- YPJKMVATUPSWOH-UHFFFAOYSA-N nitrooxidanyl Chemical compound [O][N+]([O-])=O YPJKMVATUPSWOH-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11D3/2017—Monohydric alcohols branched
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
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- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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Abstract
本发明公开了一种PCB离子污染清洗剂，该PCB离子污染清洗剂包括第一清洗剂和第二清洗剂。本发明提供的PCB离子污染清洗剂具有优异的清洁电路板面离子污染的能力，其成本低廉，制备简单，可广泛应用于电路板制造中。本发明提供的电路板的清洗方法将离子污染清洗分为两步完成，具体为先用第一清洗剂初步清洗，成品再用第二清洗剂进行二次清洗，该电路板的清洗方法可将大量油墨塞孔的电路板清洗干净。
Description
技术领域
本发明属于电路板制造领域，具体涉及一种PCB离子污染清洗剂。
背景技术
电路板行业越来越多地岀现离子污染测试和离子浓度残留检测，并且随着工艺的进步，相关测试越来越多。原因是随着电子行业的迅速发展，电子产品的集成度越来越高，电路板上的元器件密度也越来越高，电路板的布线也越密集。随着线与线之间的距离越来越小，传统的电路板表面清洁标准已无法满足现有产品的要求，主要表现为航天航空电路板、汽车电路板、高端通信板、高端医疗设备等电路板需要更严格的表面清洁标准。
如果电路板面的离子污染清洁不够，表面存在的各种离子会影响电信号的传输，使用过程中会岀现离子迁移现象，严重时会导致电路板短路烧板。离子污染的主要来源为板材原材料污染物及制程中的残留酸，具体的污染离子主要包括：氯离子(Cl-)一般在喷锡板上残留较多，来自喷锡板的助焊剂，特别是有卤助焊剂氯离子的含量较高；溴在线路板上的用途多为阻燃剂，溴离子(Br-)来源主要是线路板的油墨；氟离子(F-)主要来源为喷锡板的助焊剂，有卤助焊剂会使用到氟离子；硝酸根和亚硝酸根(NO2 -/NO3 -)一般在化学沉银板残留较多，主要来源于沉银表面处理药水；钠离子和钙离子(Na+/Ca2+)主要来源于人员污染和清洗用水自带的钠离子和钙离子；氨离子和钙离子(NH4 +/Ca2+)主要来源于水和人员环境污染，以及来自油墨制程污染；乙酸根和甲酸根主要来源于线路板的酸清洗或无卤助焊剂，线路板的表面除油、粗化、去除氧化会用到乙酸和甲酸；硫酸根离子主要来源于表面处理的酸洗步骤，以及药水用到的硫酸、硫酸盐，使用酸性除油剂以及成品板清洗的酸洗都会残留硫酸根离子在板面上。
现有技术是直接采用商业化的离子污染清洗剂，如Envirosense#816其主要成分是单乙醇胺、二乙醇胺和表面活性剂，这些清洗剂可以很好处理如喷锡、沉镍金、沉银的电路板，但对于含有大量油墨塞孔的沉锡板，这些离子清洗效果不大理想，主要原因是塞孔油墨在固化过程中由于溶剂挥发而导致油墨向孔内收缩，孔口会产生可见的裂缝，在沉锡过程中这些塞孔油墨裂缝有药水渗入，而在离子清洗时流出来，造成额外的离子污染。为了解决电路板面的离子污染清洁不够的技术问题，有必要开发一种新的PCB离子污染清洗剂。
发明内容
为了克服现有技术存在的电路板面的离子污染清洁不够的技术问题，本发明的目的在于提供一种PCB离子污染清洗剂；本发明的目的之二在于提供这种PCB离子污染清洗剂的制备方法；本发明的目的之三在于提供这种PCB离子污染清洗剂的应用；本发明的目的之四在于提供一种电路板的清洗方法。
为了实现上述目的，本发明所采取的技术方案是：
本发明第一方面提供一种PCB离子污染清洗剂，所述PCB离子污染清洗剂包括第一清洗剂和第二清洗剂；
所述第一清洗剂包括以下质量百分比的组分：
乙醇胺0.3％-2.8％；
碳酸胍0.1％-1.5％；
异丙醇0.02％-1.0％；
去离子水95％-99.53％；
所述第二清洗剂包括以下质量百分比的组分：
二甘醇胺1.2％-5.0％；
异丙醇0.6％-1.5％；
二乙二醇丁醚0.6％-1.5％；
消泡剂0.015％-0.05％；
去离子水92％-97％。
优选的，所述第一清洗剂包括以下质量百分比的组分：
乙醇胺0.3％-0.8％；
碳酸胍0.1％-0.5％；
异丙醇0.02％-0.1％；
去离子水99％-99.53％；
所述第二清洗剂包括以下质量百分比的组分：
二甘醇胺1.2％-5.0％；
异丙醇0.6％-1.5％；
二乙二醇丁醚0.6％-1.5％；
消泡剂0.015％-0.05％；
去离子水92％-97％。
优选的，所述乙醇胺包括单乙醇胺、二乙醇胺、三乙醇胺中的至少一种。
优选的，所述消泡剂包括聚二甲基硅氧烷、乙氧基丙氧基化-C10-12-烷基醇中的至少一种。
本发明第二方面提供根据本发明第一方面所述PCB离子污染清洗剂的制备方法，包括以下步骤：
将第一清洗剂的各组分进行混合，得到所述的第一清洗剂；
将第二清洗剂的各组分进行混合，得到所述的第二清洗剂。
优选的，所述第一清洗剂的混合步骤具体为将乙醇胺、碳酸胍、异丙醇与少量水混合，然后用水稀释，得到所述的第一清洗剂。
优选的，所述第二清洗剂的混合步骤具体为将二甘醇胺、异丙醇、二乙二醇丁醚、消泡剂与少量水混合，然后用水稀释，得到所述的第二清洗剂。
本发明第三方面提供根据本发明第一方面所述PCB离子污染清洗剂在电路板制造中的应用。
本发明第四发明提供一种电路板的清洗方法，包括以下步骤：
1)用本发明第一方面所述PCB离子污染清洗剂的第一清洗剂清洗电路板；
2)用本发明第一方面所述PCB离子污染清洗剂的第二清洗剂清洗电路板。
优选的，所述第一清洗剂清洗电路板的温度为35℃-65℃；进一步优选的，所述第一清洗剂清洗电路板的温度为40℃-60℃。
优选的，所述第一清洗剂清洗电路板的时间为45s-100s；进一步优选的，所述第一清洗剂清洗电路板的时间为45s-80s。
优选的，所述第二清洗剂清洗电路板的温度为45℃-70℃；进一步优选的，所述第二清洗剂清洗电路板的温度为50℃-65℃。
优选的，所述第二清洗剂清洗电路板的时间为50s-100s；进一步优选的，所述第二清洗剂清洗电路板的时间为60s-90s。
优选的，所述第一清洗剂清洗电路板的方式为浸泡和超声波震荡。
优选的，所述第二清洗剂清洗电路板的方式为喷淋清洗。
优选的，所述喷淋的压力为200kPa-300kPa。
优选的，所述电路板为沉锡板、喷锡板、沉金板或沉银板；进一步优选的，所述电路板为沉锡板。
本发明的有益效果是：
本发明提供的PCB离子污染清洗剂具有优异的清洁电路板面离子污染的能力，其成本低廉，制备简单，可广泛应用于电路板制造中。本发明提供的电路板的清洗方法将离子污染清洗分为两步完成，具体为先用第一清洗剂初步清洗，成品再用第二清洗剂进行二次清洗，该电路板的清洗方法可将大量油墨塞孔的电路板清洗干净。
第一清洗剂初步清洗主要是针对电路板塞孔阻焊油墨凹陷或裂缝所带来的MSA等有机酸和重金属离子进行初步清洗，碳酸胍C3H12N6O3常作为重金属去除剂，与重金属离子反应形成沉淀分离；同时以乙醇胺、异丙醇等则作为有机溶剂、表面活性剂配合超声波去清除MSA等有机酸及分离出来的重金属沉淀物。第一次清洗有助于减轻最后清洗的负担。成品用第二清洗剂进行二次清洗，二次清洗只需要采用有机溶剂、表面活性剂以加温、高压喷淋方式去除电路板表面附着的离子污染。采用高压喷淋方式容易产生大量泡沫，因此还要加入少量消泡剂。该电路板的清洗方法可将大量油墨塞孔的电路板清洗干净。
附图说明
图1为第一清洗剂离子清洗设备图。
图2为第一清洗剂浸泡和超声波震荡设备图。
图3为第二清洗剂离子清洗设备图。
图4为PCB清洗前的样品图。
图5为电路板清洗后的样品图。
具体实施方式
以下结合实例对本发明的具体实施作进一步说明，但本发明的实施和保护不限于此。需指出的是，以下若有未特别详细说明之过程，均是本领域技术人员可参照现有技术实现或理解的。所用试剂或仪器末注明生产厂商者，视为可以通过市售购买得到的常规产品。
实施例1
本例PCB离子污染清洗剂的制备步骤如下：
第一清洗剂的制备步骤如下：将3.0g乙醇胺、2.0g碳酸胍与0.5g异丙醇混合，最后加入去离子水补充至总质量为20g。最后加入去离子水，按照2％的重量比稀释至1000g，得到本例第一清洗剂。
第二清洗剂的制备步骤如下：将20g二甘醇胺、15g异丙醇、12.5g二乙二醇丁醚和2.5g消泡剂聚二甲基硅氧烷混合，然后加入去离子水补充至总质量为100g。最后加入去离子水，按照10％的重量比稀释至1000g，得到本例第二清洗剂。
实施例2
本例PCB离子污染清洗剂的制备步骤如下：
第一清洗剂的制备步骤如下：将4.0g乙醇胺、1.0g碳酸胍与0.5g异丙醇混合，然后加入去离子水补充至总质量为20g。最后加入去离子水，按照2％的重量比稀释至1000g，得到本例第一清洗剂。
第二清洗剂的制备步骤如下：将25g二甘醇胺、6.0g异丙醇、15g二乙二醇丁醚和2.5g消泡剂乙氧基丙氧基化-C10-12-烷基醇混合，然后加入去离子水补充至总质量为100g。最后加入去离子水，按照10％的体积比稀释至1000g，得到本例第二清洗剂。
对比例1
本例PCB离子污染清洗剂为市售的Envirosense#816。
性能测试
将实施例1-2和对比例1制备的PCB离子污染清洗剂进行清洗电路板，清洗步骤如下：
清洗流程为将沉锡板(喷锡板、沉金板或沉银板均可)进行：外形加工→表面处理→外形加工→第一清洗剂离子清洗→电测试→FQC→第二清洗剂离子清洗→FQA→包装出货。图1为第一清洗剂离子清洗设备图。图2为第一清洗剂浸泡和超声波震荡设备图。第一清洗剂离子清洗的温度为40℃-60℃，清洗方式为浸泡+超声波震荡，清洗时间为45秒-80秒，水洗为3级溢流水洗+干板。
对比例1的测试与实施例1完全相同，仅使用Envirosense#816按此步骤清洗两次。
第二清洗剂离子清洗流程为：离子清洗(1)→热水洗(2)→离子清洗(3)→热水洗(4)→溢流水洗(5)→DI清水洗(6)→干板(7)。表1为第二清洗剂离子清洗流程详细参数表。图3为第二清洗剂离子清洗设备图。
表1第二清洗剂离子清洗流程详细参数
80％指超声波发生器的能量输出等级为80％，相当于输出8V电压水平。
将清洗后的PCB电路板进行离子测试，表2为实施例与对比例清洗剂离子清洗测试结果。测试标准为IPC-TM-650 2.3.28，试仪器为色谱离子分析仪Ion Chromatography。
表2实施例与对比例清洗剂离子清洗测试结果
| 实施例1 | 实施例2 | 对比例1 | 检测标准 | |
| 氟离子 | N.D. | N.D. | N.D. | <0.5 |
| 氯离子 | 0.7 | 0.05 | 0.06 | <1 |
| 溴离子 | N.D. | N.D. | N.D. | <2.5 |
| 亚硝酸根 | N.D. | N.D. | N.D. | <2.5 |
| 硝酸根 | N.D. | N.D. | N.D. | <2.5 |
| 磷酸根 | N.D. | N.D. | N.D. | <2.5 |
| 硫酸根 | 2.17 | 2.24 | 1.26 | <3 |
| 乙酸根 | N.D. | N.D. | 7.29 | <2.5 |
| 甲酸根 | 1.33 | 1.33 | N.D. | <2.5 |
| MSA | N.D. | N.D. | 5.28 | <0.5 |
| WOA | N.D. | N.D. | N.D. | N/A |
N.D.指not detected，表示未检出该离子。MSA指甲基磺酸MethanesulfonicAcid，是沉锡板特有的污染离子。WOA表示有机弱酸weak organic acid。
表2的测试结果说明本申请实施例制备的PCB离子污染清洗剂可以清洗干净有大量油墨塞孔的沉锡板，而市售的Envirosense#816清洗剂无法完成此效果。图4为PCB清洗前的样品图。图5为电路板清洗后的样品图。
上述实例为本发明较佳的实施方式，但本发明的实施方式并不受上述实施例的限制，其它的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内。
Claims (10)
1.一种PCB离子污染清洗剂，其特征在于：所述PCB离子污染清洗剂包括第一清洗剂和第二清洗剂；
所述第一清洗剂包括以下质量百分比的组分：
乙醇胺0.3％-2.8％；
碳酸胍0.1％-1.5％；
异丙醇0.02％-1.0％；
去离子水95％-99.53％；
所述第二清洗剂包括以下质量百分比的组分：
二甘醇胺1.2％-5.0％；
异丙醇0.6％-1.5％；
二乙二醇丁醚0.6％-1.5％；
消泡剂0.015％-0.05％；
去离子水92％-97％。
2.根据权利要求1所述的PCB离子污染清洗剂，其特征在于：所述乙醇胺包括单乙醇胺、二乙醇胺、三乙醇胺中的至少一种。
3.根据权利要求2所述的PCB离子污染清洗剂，其特征在于：所述消泡剂包括聚二甲基硅氧烷、乙氧基丙氧基化-C10-12-烷基醇中的至少一种。
4.权利要求1-3任一项所述PCB离子污染清洗剂的制备方法，其特征在于：包括以下步骤：
将第一清洗剂的各组分进行混合，得到所述的第一清洗剂；
将第二清洗剂的各组分进行混合，得到所述的第二清洗剂。
5.权利要求1-3任一项所述PCB离子污染清洗剂在电路板制造中的应用。
6.一种电路板的清洗方法，其特征在于：包括以下步骤：
1)用权利要求1-3任一项所述PCB离子污染清洗剂的第一清洗剂清洗电路板；
2)用权利要求1-3任一项所述PCB离子污染清洗剂的第二清洗剂清洗电路板。
7.根据权利要求6所述的电路板的清洗方法，其特征在于：所述第一清洗剂清洗电路板的温度为35℃-65℃；所述第一清洗剂清洗电路板的时间为45s-100s。
8.根据权利要求6所述的电路板的清洗方法，其特征在于：所述第二清洗剂清洗电路板的温度为45℃-70℃；所述第二清洗剂清洗电路板的时间为50s-100s。
9.根据权利要求6所述的电路板的清洗方法，其特征在于：所述第一清洗剂清洗电路板的方式为浸泡和超声波震荡；所述第二清洗剂清洗电路板的方式为喷淋清洗。
10.根据权利要求6所述的电路板的清洗方法，其特征在于：所述电路板为沉锡板、喷锡板、沉金板或沉银板。
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